Agilent Measurement Journal - Issue 3 - 2007 - (Page 49)

Conclusion EMI compliance becomes more challenging as clocks and data transmission rates keep moving to ever-higher speeds. The increasing switching currents presented on IC power grids and I/O ports are very often the ultimate cause of both signal integrity issues and EMI compliance failures. It can be difﬁcult to make meaningful measurements of high-frequency noise currents on an IC. Pinpointing the surface currents depends on ultra-ﬁne spatial resolution, excellent electrical ﬁeld rejection and the ability to extract stable relative phase at the harmonic frequencies. Creating a probe with a balanced, shielded structure minimized the effects of unwanted ﬁeld component coupling. In testing, the thin-ﬁlm probe provided much higher resolution than conventional probes and measurements showed good separation between electric- and magnetic-ﬁeld coupling. Measurement of the magnetic ﬁeld was improved using a 40 dB hybrid. The probe demonstrated good response up to a 2 GHz, the limit of the working range of the hybrid. Greater range is expected in the future with modiﬁcations to the probe and its bonding structure as well as the measurement technique. The probe can measure phase as well as the magnitude of magnetic ﬁelds using a synchronized, high-resolution clock and a network analyzer. References 1. Electromagnetic Compatibility Measurement Procedures for Integrated Circuits: Integrated Circuit Radiated Emissions Diagnostic Procedure, 150 kHz to 1000 MHz, Magnetic Field Loop Probe. AE-J 1752/2, March 1995. 2. Hu, K., Weng, H., Beetner, D., Pommerenke, D., Drewniak, J., Lavery, K. and Whiles, J. 2006. Application of Chip-Level EMC in Automotive Product Design. Proceedings of the IEEE Symposium on Electromagnetic Compatibility, Volume 3, August 2006: 842-848. 3. Dhia, B. S., Ramdani M., Sicard E.,2005. Electromagnetic Compatibility of Integrated Circuits: Techniques for low emission and susceptibility, Springer, 2005, ISBN-13: 978-0387266008. 4. Weng, H., Beetner, D.G., DuBroff, R.E. and Shi, J. 2005. Estimation of Current from Near-ﬁeld Measurement. Proceedings of the IEEE Symposium on Electromagnetic Compatibility, Volume 1, August 2005: 222-227. 5. Hu, K. 2007. Integrated Circuits Switching Current Modeling, Measurement and Power Distribution Network Optimization. Ph.D. dissertation, University of Missouri-Rolla, April 2007. 6. Reck, J. , Hu, K., Li, S., O’Keefe, M., Drewniak, J., Beetner, D., et.al. Unpublished. Fabrication of Two-Layer Thin Film Magnetic Field Micro-Probes on Freestanding SU-8 Photoepoxy. 7. Guerin, L.J. The SU-8 Homepage. http://geocities.com/guerinlj/ 8. Bockelman, D. E. and Eisenstadt, W. R. 1995. Combinded Differential and Common-Mode Scattering Parameters: Theory and Simulation. IEEE Transactions on Microwave Theory and Technology, Volume 43, July 1995: 1530-1539. Agilent Measurement Journal 49 http://geocities.com/guerinlj/

Table of Contents Feed for the Digital Edition of Agilent Measurement Journal - Issue 3 - 2007

Applying Ingenuity to the Measurement of Emerging Technologies Contents Emerging Innovations Department Delivering Bigger Benefits by Optimizing Customer Workflows Measuring Material Properties at the Nanoscale Utilizing In Situ Atomic Force Microscopy in Life Science, Pharmaceutical and other Bio-Related Applications WiMAX™: Plotting a New Path to Global Mobility Addressing the Triple Complexity of Triple-Play Networks What Next for Mobile Telephony? Exploring the Inner Workings of Tire-Pressure Monitoring Systems Developing, Assessing and Applying a High-Resolution Thin-Film Magnetic Probe Making Accurate Settling-Time Measurements Using a Vector Network Analyzer Applying Metabolomics Methods to the Study of Bacterial Leaf Blight in Rice Plants Measuring Stream Dynamics with Fiber Optics survey

Agilent Measurement Journal - Issue 3 - 2007

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