Assembly Planbook - April 2008 - (Page 36) Ultrasonics A major benefit of ultrasonic soldering is the ability to join dissimilar materials, adds Karl Graff, Ph.D., principal engineer at the Edison Welding Institute (Columbus, OH). The technology can solder copper to aluminum in heat exchangers for cars and home airconditioners; graphite to aluminum for heat sinks; sapphire to metal for lightweight sensor assemblies; metal to glass in vacuum tubes; and silicon carbide to titanium and other metals for lightweight armor and wear-resistant surfaces. Ultrasonic soldering can be used to solder leads to glass display panels, solar cells, crystal oscillators and hybrid integrated circuits. It can bond metal fittings to glass; create airtight seals on high-voltage resistors and condensers; and form electrodes on electronic parts. Ultrasonic soldering requires less heat than brazing or fusion welding. And, because flux is not required, assemblers save the time and expense of cleaning flux residues from the parts. Some applications are unsuitable for ultrasonic soldering. For example, the technology cannot be used to tin unplated stranded wire, because a wicking action is necessary to thoroughly penetrate the strands with solder. Similarly, the technology is not practical for soldering through-hole components in circuit boards or for tinning insulated magnet wire, because those applications require capillary flow of the solder. A DE-STA-CO’s comprehensive line of workholding products provides unmatched flexibility and improved productivity. So many reasons to choose DE-STA-CO. TOGGLE CLAMPS DE-STA-CO’s innovative horizontal, vertical, straight-line action, latch and plier clamps maximize safety through reliable design and a toggle-action locking mechanism. Ultrasonic Soldering Works With Many Substrates The following substrates are amenable to ultrasonic soldering. Alumina Aluminum Beryllia Nickel Niobium Nitinol Pyrex Rare earth elements Ruthenium Sapphire Silica glass Silicon Silicon carbide Silver Soda-lime glass Stainless steel Tantalum Titanium Titania Tungsten Tungsten carbide Zinc Zirconium POWER CLAMPS Our next generation power clamps provide a long life cycle and high holding torques in a low weight, compact design. Beryllium Ceran Chromium Copper Corderite Crystal Diamond Enamel Forsterite Germanium Gold Graphite Lead Magnesia Magnesium Mica Molybdenum Mullite Borosilicate glass Quartz glass MODULAR END EFFECTOR SYSTEMS Constructed from lightweight aluminum, DE-STA-CO’s modular end effector systems offer maximum flexibility and excellent strength-to-weight ratios. www.destaco.com 1.888.DESTACO P o s i t i o n i n g o u r c u s t o m e r s f o r p r o d u c t i v i t y. 36 ASSEMBLY / April 2008 www.assemblymag.com http://www.destaco.com http://www.destaco.com http://www.assemblymag.com
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