CircuiTree - July 2008 - (Page 32)

[ CircuiTree 20-Year Retrospective ] learned that solder volume under the part could be very beneﬁcial in that solder become plastic when subjected to heat and thus provided the compliancy needed to withstand the difference in the component and board expansion. The industry would, and still does, deal with mixed mounting technology on almost every product produced. A group of experts involved in military hardware product development were invited to Washington to discuss the solder cracking issues. They discussed the problem and focused on an AT&T study of the problem. AT&T had developed reliability equations and shared its “Figures of Merit” with the industry to better understand the inﬂuence of solder, lead versus leadless, component size, CTE differences, number of life cycles, and use environment temperature swings. AT&T’s concepts became an industry norm to deﬁne the nine use environments shown in Figure 5. advanced technologies by standardization and other means. Another thing that the council developed was a status and action plan. The document was ﬁrst created in 1986 to highlight and focus on critical issues that challenged the implementation of complex and process intensive technologies. Many of the critical issues discussed in 1986 still exist. The Surface Mount Council status and action plan summarized and clariﬁed the problem areas that are faced in converting from throughhole mounting to surface mounting. Figure 6 shows some of the council work. Japan Council (sponsored by JEITA, JPCA), the Jisso North American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso European Council (sponsored by the EIPC). Where Do We Go From Here? It’s a simple question with very complex answer. The industry, technology, standardization, and ideas for building electronic products are a global endeavor. In addition, the competition between companies is as strong as ever and the vision in many instances is short sighted. The philosophy of outsourcing will also continue. However, it now is thought of as a global supplier base. Sometimes that is in the U.S., sometimes in China, and sometimes in India. Some customers have also deemed everything a commodity as if they could get it off the shelf from anyone in the world. The sad thing is that one hears horror stories about failed projects due to poor relationships. Environmental legislation is the new issue facing technology groups. What started as a marketing strategy in Asia has become a couple legislative nightmare. The European Union started it with legislation on the automotive industry. The idea was to make sure that old cars didn’t wind up in landﬁlls. And so the end of life concept that states that suppliers need to reclaim products when they have seen the end of their lives was developed. The unfortunate part of the concept is that everyone has an opinion and everyone is in charge of some aspects of the problem. Lead free, halogen free, and material declaration seminars abound and engineers rush to hear the latest concern or requirement fostered on this industry. Table 1 shows an Figure 6 Products of the Surface Mount Council Figure 5 Worst-Case Use Environments for Surface Mounted Electronics and Recommended Accelerated Testing for Surface Mount Solder Attachments by Most Common Use Categories (The Actual Thermal Environments in Use Need to Be Established By Thermal Analysis or Measurement) The learning curve was reaching the point where many now believed that surface mounting would be a way of the future. The skeptics still needed some convincing so a small group of industry experts supported by several trade organizations created a council to facilitate the sharing of knowledge and promote surface mounting technology. The Surface Mount Council was formed in September 1986 and was composed of a maximum of 30 industry experts who were senior personnel of electronic suppliers, users, and manufacturers. The mission of the council was to facilitate, coordinate, and promote the orderly implementation of surface mount and other 32 July 2008 • circuitree.com Although the Council closed in late 1999, out of the ashes came a new group that needed to do a similar job. The idea of a total packaging solution was the goal of the new council, and the Japan concepts of Jisso were quickly adopted. The Jisso International Council (JIC) was formed in May 2000 and is composed of a maximum of 30 industry experts who are senior personnel of electronic suppliers, users, and manufacturers. The mission of the JIC is to facilitate, coordinate, and promote the orderly implementation of advanced electronic packaging and other advanced technologies by standardization and other means. The council is supported by three main regional groups in each of three global hemispheres: the Jisso Table 1 Global Approaches to Electronic Legislation Issues RoHS Equipment Regulation on the specific chemicals Presence marking Electrical and electronic equipment Restricted with exemptions J-Moss Electrical and electronic equipment Presence mark excluding exemptions and information disclosure C-RoHS Information equipment Presence mark and information disclosure Presence information Required including exemptions Required http://circuitree.com

Table of Contents Feed for the Digital Edition of CircuiTree - July 2008

CircuiTree - July 2008 Contents My Line Industry Review Tech Talk Flexible Thinking Toward a PCB Production Floor Metric for Go/No Go Testing of Lossy High-Speed Transmission Lines Intelligent Design 20-Year Retrospective Ask the Flexperts Environmentally Speaking BPA Growth Curves Considering Design Variants to Maximize Process Efficiency Market Outlook Technical Product Spotlights Classified Ads Upcoming Events Ad Index

CircuiTree - July 2008

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