CircuiTree - July 2008 - (Page 42)

Materials and Process Equipment ACE Production Technologies introduced a nitrogen peel-off jet for improved ﬁne-pitch selective soldering. Ansoft was acquired by ANSYS. Applied Materials formed a new solar group, SunFab Operations, co-led by Mark Pinto and Randhir Thakur. Bando Chemical entered the PCB material market with silver nanoparticles for low-temperature sintering. CAC and LCOA named Rocky Hilburn product development manager. Dow Chemical raised prices on all its products by up to 20 percent. DuPont celebrated 40 years of Riston® dry ﬁlm photoresist usage. Hexion Specialty Chemicals is pursuing a merger with Huntsman. Hitachi Chemical invested JPY 3 billion for a new Singapore plant for MLB shielding layers. HPTec was acquired by China Minmetals Non-Ferrous Metals. Huntsman raised prices up to 25 percent “in response to sharp and sustained increases” in costs. Lincoln International appointed Franklin Harris managing director. Maintech/Sentek’s former chief executive ofﬁcer Carl Spitko pleaded guilty to 11 counts of bank fraud and two counts of aiding and abetting. Mitsubishi Gas Chemical increased copper foil laminate and prepreg sheet capacity in Fukushima, Japan, by 40 percent to one million m2/month. MYDATA acquired German distributor Royonic. Park Electrochemical’s former president of Asia Paciﬁc business, Howard Elliott, was named chief operating ofﬁcer of Resin Systems. PFG Fiber Glass (PPG and Nan Ya Plastics joint venture) added a third furnace in Kunshan, China, making it the world’s largest automatic glass ﬁber production base and increasing its annual capacity to 110,000 metric tons in China and 200,000 metric tons in Asia. Renesas and Mitsubishi developed a solder ball machine that can deposit 13 µm-diameter balls using an Ag-Sn solder alloy. Rohm and Haas: • Named Pierre Brondeau president and chief operating ofﬁcer; • Formed a chairman’s committee of Raj Gupta, chairman and chief executive ofﬁcer; Brondeau, president and chief operating ofﬁcer; and Jacques Croisetiere, executive vice president and chief ﬁnancial ofﬁcer; and • Electronic Materials received Best Supplier Award for 2007 from SSMC. Shenmao Technology raised solder bump paste prices due to higher metal costs. Taiyo Ink is building a PCB photoresist ink plant in Zhongshan, Guangdong Province, South China. Tollcoating.com launched new contract manufacturing business for high-precision, multilayer coating. Tongtai Machine & Tool acquired 70 percent of Chin Jig Precision Machine for TWD 28 million. Toray began manufacturing adhesiveless ﬂexible laminate in Korea. Tyco Electronics’ automotive facility in Greensboro, N.C., received the 2007 Gold Award for Safety from the North Carolina Department of Labor. Ube Industries is spending JPY 8 billion on two more manufac42 July 2008 • circuitree.com turing lines, increasing its total capacity of Upilex polyimide ﬁlm by 35 percent. Valor Computerized Systems: • Appointed Dan Hoz acting president and chief executive ofﬁcer after Ofer Shofman retired; and • Established a technological partnership with Guilin University of Electronic Technology. Wong’s Kong King allocated HKD 40 million for the ﬁrst phase of its second plant in Guangzhou, China. Electronic Manufacturing Services and Related Assembly Activity Acu-Rite (Jamestown, N.Y.) completed the ﬁrst stage of its USD 5 million expansion and factory renovation including separate enclosed areas for PCBA, electronic, and clean assembly. Adeptron completed USD 6 million equity ﬁnancing with R.H. Global Technologies. API Alliance received a data destruction device assembly contract from Proton Data Security. Bantam Electronics received a compact wireless router contract from JBM Electronics. Benchmark Electronics rented 10,000 m2 at Brasov Industrial Park, Romania. Celestica entered into a manufacturing contract with EMC, Brazil, for networked storage systems. Compal: • Asked notebook OEMs for price increases; • Will close its Manchester, U.K., plant to control rising salaries; and • Is setting up plants in Poland and Brazil to reduce its excessive focus in China. Connectronics Romania, a subsidiary of Connect Systems, Belgium, opened a 16,000 m2 factory in Oradea, Romania. Continental invested EUR 24 million in the Budapest, Hungary, plant in 2007 and will increase this amount in 2008. CTS authorized the repurchase of up to one million of its outstanding shares of common stock. Dell expects to have 2,500 workers at its computer assembly plant in Lodz, Poland, by year end 2008. EB (Elektrobit) cut 59 jobs in Oulunsalo, Oulu, and Kajaani, Finland. Elcoteq transferred mobile phone production in Estonia to Hungary and reduced the number of employees at two plants in Estonia from 3,500 to 2,000 to control labor costs. EN ElectronicNetwork’s co-founder Rüdiger Hornhardt retired from executive board and general manager position. Flextronics: • Chief executive ofﬁcer Mike McNamara expects the company to add USD 3 billion of business this year from organic growth; • Named Paul Read chief ﬁnancial ofﬁcer after Thomas Smach resigned; • Acquired CEAG’s FRIWO mobile power business unit; • Sold its Multi Vendor Division of ServiceSource Europe to former management members George Buchan, Mark Hesketh, and James http://Tollcoating.com http://circuitree.com

Table of Contents Feed for the Digital Edition of CircuiTree - July 2008

CircuiTree - July 2008 Contents My Line Industry Review Tech Talk Flexible Thinking Toward a PCB Production Floor Metric for Go/No Go Testing of Lossy High-Speed Transmission Lines Intelligent Design 20-Year Retrospective Ask the Flexperts Environmentally Speaking BPA Growth Curves Considering Design Variants to Maximize Process Efficiency Market Outlook Technical Product Spotlights Classified Ads Upcoming Events Ad Index

CircuiTree - July 2008

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