CircuiTree - August 2008 - (Page 12)

Industry Review HMS and Uyemura Form Partnership Germany and Ontario, Calif. – HMS and Uyemura partnered to jointly market and sell desmear/electroless copper/ copper plating packages in Japan as well as in parts of Asia. Uyemura received HMS’ state-of-the-art plated throughhole and plating technology in its Osaka facilities; Uyemura has already begun customer qualifications. Titan Global Holdings Names New Electronics President and CEO, Forms Titan Electronics Asia Richardson, Tex. – Titan Global Holdings appointed Michael Kadlec president and chief executive officer of Titan Electronics, Inc., formally known as Titan PCB West, Inc. Kadlec has worked in the industry since 1973 and most recently was a member of the senior management team of Data Circuit Systems. In addition, Titan announced that Ed Peterson will serve as News Bessette was with Rogers’ Durel Division, where he was responsible for the division’s global electroluminescent backlighting business; he has been with Rogers for 33 years. chief operating officer and Saul Kennedy will continue to serve as senior vice president leading Titan’s focused efforts on Asian expansion. Titan formed Titan Electronics Asia, a wholly owned subsidiary of Titan Electronics, Inc., to capitalize on the expanding global PCB market. According to Kadlec, the company formed Titan Asia to focus its offshore efforts in the hands of a focused team; Kadlec added, “It will also provide greater financial transparency as to our financial progress both domestically and internationally. Our growing sales force and rep network will continue to offer global resources and capacity to our growing customer base.” Park Electrochemical Names Nurmi New Director of European Sales Melville, N.Y. – Park Electrochemical Corp. appointed Robert Nurmi director of European sales. Previously, Nurmi was vice president of corporate development at Tonoga, Ltd. Assel Selects Valor’s vPlan Yavne, Israel – Valor Computerized Systems Ltd was selected by Assel to provide vPlan— Valor’s next-generation, enterprise-level process engineering software solution—for electronics assembly. vPlan will enable Assel to provide its customers with a significantly shorter route through NPI due to vPlan’s advanced process automation and design Bessette to Head Rogers Advanced Circuit Materials Division Chandler, Ariz. – Rogers Corporation appointed Michael D. Bessette, vice president, to head up its Advanced Circuit Division (ACDM) in Chandler, Ariz. Previously, Contract Plating and Circuit Board Processing Providing Surface Finishes & Adding Value To The Electronics Industry Reliable - Fast Turn - Same Day Service We process ﬂexible circuits and rigid printed circuit boards, Piece parts and panels with lot sizes from one up. Have unique panels or piece sizes? We can handle it! ISO 9001:2000 Certiﬁed Top quality, fast-turn, and cost effective PCB service solutions including: • Immersion Tin RoHS Compliant • Electroless Nickel / Immersion Gold RoHS Compliant • Immersion Silver RoHS Compliant • Hot Air Solder Leveling - Utilizing Florida Cirtech’s Sn-100CL - RoHS Compliant - Standard 6337 Tin Lead Horizontal Hot Air Solder Leveling Soldermask & Nomenclature Screening Organic Solderability Preservative (OSP) Adding Value to Every Service We Offer Contact us for a quote www.addedvaluetech.com • E-mail: info@addedvaluetech.com 9401 James Avenue South Suite 100 - Bloomington, MN 55431 Toll Free: (888) 881-3365 | Local: (952) 881-3365 | Fax: (952) 881-6235 12 August 2008 • circuitree.com AVT half.indd 1 7/8/08 12:04:31 PM http://www.addedvaluetech.com http://www.addedvaluetech.com http://circuitree.com

Table of Contents Feed for the Digital Edition of CircuiTree - August 2008

CirciuTree - August 2008 Contents My Line Industry Review Tech Talk Flexible Thinking Creating Connections Between Electronics Design and Manufacturing Happy Thoughts View From the Middle Market Outlook Fein Lines IPCA Showcase Technical Product Spotlights Classified Ads Upcoming Events Ad Index Buyers Guide

CircuiTree - August 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.