CircuiTree - August 2008 - (Page 38)

• NWR Division fully qualiﬁed its AccuScribe 2150 real-time dynamic autoFocus scribing solution with a key Taiwan customer. GOEPEL introduced OptiCon TurboLine, a modular high-end AOI system. Gore introduced an online builder for conﬁguring interconnects at www.gore.com/uhdbuilder. Hanslaser received PCB equipment orders worth CNY 52 million from Apple. Henkel was named to the World’s Most Ethical Companies list by the Ethisphere Institute, New York, and Forbes business magazine. Hitachi Chemical: • Developed the world thinnest polyimide base copper foil laminate with a 3 µm base layer and a 9 µm copper foil; and • Introduced a series of new heat-resistant copper clad laminates for high frequency PCBs. HMS-Höllmüller and Uyemura will jointly market and sell desmear/electroless copper/copper plating packages in Asia. HumiSeal Europe published its new edition of the Conformal Coating Facts and Data Handbook. Indium Corporation appointed Powell Industries its sales channel partner for Washington, Oregon, Idaho, and California. Ishii Hyoki unveiled a new vertical scrubbing machine for thin ﬂexible laminates. LORD began a USD 2.5 million renovation to its electronic materials labs in Cary, N.C., including 7,500 ft2 of new or refurbished lab space and USD 600,000 in new instruments and equipment. MacDermid named Steve Racca vice president business development for offshore solutions. Mania Technologie: • And its subsidiaries Mania Deutschland and Mania Entwicklungsgesellschaft began insolvency proceedings; and • Sold its outsourcing businesses in the U.S., Canada, Japan, Taiwan, China, and Singapore to ESO Luxco. Matsushita Electric Works introduced new heat-resistant copperclad HIPER Series R-1755V laminates for automobile PCBs. MCK developed a new vacuum roll-to-roll laminator for ﬂex circuit coverlays. Micronutrients acquired Old Bridge Metals & Chemicals’ fresh alkaline and spent etchant recycling business. Mitsui Metal Mining developed the world thinnest dielectric layer (8 µm thick) for the embedded capacitance of MLBs. Mitsui Metal Smelting is investing JPY 3.5 billion to expand its thin copper foil manufacturing capacity (mostly 12 µm thick) in Malaysia and Taiwan. NexTechFAS unveiled NanoScan AOI technology to detect defects as small as 300 nm in TFT/LCD displays, touch screen substrates, and solar panels. Nittobo raised glass ﬁber prices by 10 to 15 percent on July 1 due to continuing cost increases. Nordson acquired the remaining 51 percent stake in its joint venture, Nordson Sang San, Gwang-Ju City, Korea. Orbotech acquired Photon Dynamics. Ormecon International continued progress with its nanoﬁnish process, including more installations and further improvements. 38 August 2008 • circuitree.com Park Electrochemical appointed Manuel Gonzalez president of Park’s Neltec Europe Business Unit and Robert Nurmi director of European sales. Photo Stencil added a new LPKF StencilLaser G 6080 in Colorado Springs. Polar Instruments Europe introduced an annual license fee for its GRS500 ﬂying probe test system. Reactive NanoTechnologies invented a thin metal foil that reacts quickly and exothermically when triggered by a laser or current pulse. TAMURA developed a new halogen and lead-free solder paste, LFSOLDER TLF-204-NH, for high temperature proﬁles. Technic released TechniENickel AT 5500, a New Pb-free electroless nickel for PCBs. Toray developed a new optical wave guide material for the future hybrid E/O circuit boards and a chip packaging system that uses 60 percent less gold. Ube Industries transferred its adhesiveless ﬂexible laminate business to its subsidiary Ube Nitto Kasei. Valor Computerized Systems’ vPlan was selected by Assel (EMS provider in Poland) to accelerate its NPI Processes. Vishay: • Was chosen as one of eight initial corporate participants in the Turin Polytechnic Institute’s new business research center; and • Amended its revolving credit facility to provide an additional USD 125 million, three-year term loan commitment. Wakayama Seika is building a new USD 48 million plant for aromatic diamines (used for manufacturing polyimide resin in ﬂex boards) at Wakayama city in western Japan. YESTech introduced its X-Series 3-D X-Ray inspection system. Zuken and Dassault Systemes partnered on Board Interchanger, an integrative add-on tool for concurrent mechanical and PCB design. Electronic Manufacturing Services and Related Assembly Activity Benchmark Electronics entered a manufacturing partnership with iRobot. Catalyst Manufacturing Services acquired certain assets of New York based EMS provider RAMP Industries. Celestica: • Received the 2008 100 award from CIO Magazine for exemplifying the highest level of operational and strategic excellence in IT; and • Recognized KEMET with 2007 Total Cost of Ownership Supplier Award. Compal: • Named ex-Dell executive John Medica vice chair; and • Received a manufacturing contract for LCD TVs from Toshiba. Efore Group’s executive vice president of sales and marketing Tuomo Rekilä left the company. Elcoteq canceled the sale of its St. Petersburg, Russia, unit to Flextronics after failing to receive regulatory approval. EPIC Technologies appointed Bhawnesh Mathur chief executive ofﬁcer. Exception adopted lean manufacturing to improve competitiveness at iCalne, Wilshire. http://www.gore.com/uhdbuilder http://circuitree.com

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CirciuTree - August 2008 Contents My Line Industry Review Tech Talk Flexible Thinking Creating Connections Between Electronics Design and Manufacturing Happy Thoughts View From the Middle Market Outlook Fein Lines IPCA Showcase Technical Product Spotlights Classified Ads Upcoming Events Ad Index Buyers Guide

CircuiTree - August 2008

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