CircuiTree - September 2008 - (Page 30) IP Process (Immersion Palladium Process) Multifunctional Finish Special features proven production process inhibits nickel diffusion into the gold layer especially for multiple lead free soldering designed for gold wire bonding usable for mixed interconnecting technologies RoHS compliant in combination with the NIRUNA process immersion palladium bath stable bath chemistry easy bath and process control short dwell times cost effective due to reduced precious metal usage patent pending IP is used as an immersion palladium process step which is integrated into the NIRUNA ENIG process. The thin palladium layer acts as a diffusion barrier between the nickel and the flash gold layers (< 0.05 μm). The IP surface combines excellent wettability, multiple lead free solderability and gold wire bondability with substantial precious metal cost savings compared to the standard ENIG process. Therefore this surface finish is ideally suitable for mixed interconnect technologies. The process is characterized by a very simple maintenance of the palladium bath as well as gentle plating parameters and a wide operating window. Chip in Cavity (LED COB on IMS PCB - produced by Asetronics AG, Switzerland Further information: +49 (0) 71 71 607 - 307 Technical Support +49 (0) 71 71 607 - 332 Sales Department +49 (0) 71 71 607 - 364 Fax galvano@eu.umicore.com www.umicore-galvano.com http://www.umicore-galvano.com http://www.umicore-galvano.com
Table of Contents Feed for the Digital Edition of CircuiTree - September 2008 CircuiTree - September 2008 Contents My Line Industry Review Tech Talk Flexible Thinking New Halogen-Free Materials: Their Time Has Finally Arrived Asian Section IPC Issues PCB and Package Convergence Ask the Flexperts Market Outlook IPCA Showcase Technical Product Spotlights Classified Ads Upcoming Events Ad Index CircuiTree - September 2008 CircuiTree - September 2008 - CircuiTree - September 2008 (Page Cover1) CircuiTree - September 2008 - CircuiTree - September 2008 (Page Cover2) CircuiTree - September 2008 - CircuiTree - September 2008 (Page 1) CircuiTree - September 2008 - Contents (Page 2) CircuiTree - September 2008 - Contents (Page 3) CircuiTree - September 2008 - Contents (Page 4) CircuiTree - September 2008 - Contents (Page 5) CircuiTree - September 2008 - My Line (Page 6) CircuiTree - September 2008 - My Line (Page 7) CircuiTree - September 2008 - Industry Review (Page 8) CircuiTree - September 2008 - Industry Review (Page 9) CircuiTree - September 2008 - Industry Review (Page 10) CircuiTree - September 2008 - Industry Review (Page 11) CircuiTree - September 2008 - Industry Review (Page 12) CircuiTree - September 2008 - Industry Review (Page 13) CircuiTree - September 2008 - Industry Review (Page 14) CircuiTree - September 2008 - Industry Review (Page 15) CircuiTree - September 2008 - Industry Review (Page 16) CircuiTree - September 2008 - Industry Review (Page 17) CircuiTree - September 2008 - Industry Review (Page 18) CircuiTree - September 2008 - Industry Review (Page 19) CircuiTree - September 2008 - Industry Review (Page 20) CircuiTree - September 2008 - Industry Review (Page 21) CircuiTree - September 2008 - Tech Talk (Page 22) CircuiTree - September 2008 - Tech Talk (Page 23) CircuiTree - September 2008 - Flexible Thinking (Page 24) CircuiTree - September 2008 - Flexible Thinking (Page 25) CircuiTree - September 2008 - New Halogen-Free Materials: Their Time Has Finally Arrived (Page 26) CircuiTree - September 2008 - New Halogen-Free Materials: Their Time Has Finally Arrived (Page 27) CircuiTree - September 2008 - New Halogen-Free Materials: Their Time Has Finally Arrived (Page 28) CircuiTree - September 2008 - New Halogen-Free Materials: Their Time Has Finally Arrived (Page 29) CircuiTree - September 2008 - Asian Section (Page 30) CircuiTree - September 2008 - Asian Section (Page 31) CircuiTree - September 2008 - Asian Section (Page 32) CircuiTree - September 2008 - Asian Section (Page 33) CircuiTree - September 2008 - Asian Section (Page 34) CircuiTree - September 2008 - Asian Section (Page 35) CircuiTree - September 2008 - Asian Section (Page 36) CircuiTree - September 2008 - Asian Section (Page 37) CircuiTree - September 2008 - Asian Section (Page 38) CircuiTree - September 2008 - Asian Section (Page 39) CircuiTree - September 2008 - Asian Section (Page 40) CircuiTree - September 2008 - IPC Issues (Page 41) CircuiTree - September 2008 - PCB and Package Convergence (Page 42) CircuiTree - September 2008 - PCB and Package Convergence (Page 43) CircuiTree - September 2008 - PCB and Package Convergence (Page 44) CircuiTree - September 2008 - Ask the Flexperts (Page 45) CircuiTree - September 2008 - Market Outlook (Page 46) CircuiTree - September 2008 - Market Outlook (Page 47) CircuiTree - September 2008 - Market Outlook (Page 48) CircuiTree - September 2008 - Market Outlook (Page 49) CircuiTree - September 2008 - IPCA Showcase (Page 50) CircuiTree - September 2008 - Technical Product Spotlights (Page 51) CircuiTree - September 2008 - Classified Ads (Page 52) CircuiTree - September 2008 - Classified Ads (Page 53) CircuiTree - September 2008 - Classified Ads (Page 54) CircuiTree - September 2008 - Classified Ads (Page 55) CircuiTree - September 2008 - Ad Index (Page 56) CircuiTree - September 2008 - Ad Index (Page Cover3) CircuiTree - September 2008 - Ad Index (Page Cover4)
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