CircuiTree - September 2008 - (Page 48)

GSI Group acquired Excel Technology for USD 360 million. Henkel: • Launched research and failure analysis center with Shanghai University; • Relocated its North American corporate headquarters from Gulph Mills, Pa., to Rocky Hill, Conn.; and • Named Alan Syzdek director of its Adhesives and Electronics Materials businesses acquired from National Starch and Chemical. Executive team will include: Michael Todd (product development), Andreas Mader (semiconductor), Joe DeBiase (PCB fab and materials), Doug Dixon (global marketing), Michael Reilly (operations), Zhiwei Cai (business development), Luc Godefroid (project management), and Hilary Norris (ﬁnance). Hexion Specialty Chemicals/Huntsman merger agreement was terminated. Hitachi Chemical: • Developed new ﬁlm type optical wave guides for PCBs with core sizes of 30 to 100 µm; and • Is investing CNY 520 million for a PWB R&D center in China for dry ﬁlm resists. Lincoln International hired Tetsuya Fujii to run its new Tokyo Ofﬁce. Mirtec opened a new AOI manufacturing facility in Ahnsung, Kyungki-do, Korea. Mitsui Mining & Smelting: • Opened a resin coated copper plant with a capacity of 500,000 m2/month; • Expanded its capacity of ultra-thin electrolytic copper foil with carrier to 450,000 m2/month in Saitama, Japan; and • Is developing new resin material with semiconductor performance for resin coated copper. Nichiyu entered the PCB materials business through new product development with Oki Printed Circuits. Nikko Metal commercialized 8 and 9 µm thick RA copper foil for hinge ﬂex circuits in cell phones. Optomec and Applied Nanotech Holdings are cooperating on copper inks for aerosol jet printing of electronics. Orbotech introduced the ﬁrst automated optical repair system for bare PCBs. ORC introduced its DXP-3502 LDI machine for etching resist and solder mask. Rogers appointed Michael Bessette vice president of its Advanced Circuit Materials division in Chandler, Ariz. Samsung Electro-Mechanics installed an ESI high-capacitance MLCC tester. Taiyo Ink is building a PWB ink plant in Guangdong Province. Valor Computerized Systems: • Appointed Dan Hoz president and chief executive ofﬁcer; and • Signed an OEM agreement with PULSE. Electronic Manufacturing Services and Related Assembly Activity Global EMS and ODM industry revenue is projected to grow from USD 305.5 billion in 2007 to USD 432.3 billion in 2012. – iSuppli 48 September 2008 • circuitree.com Advanced Electronic Services received a ﬁve-year, USD 1.7 million contract from Letterkenny Army Depot for rebuilding mechanical devices for the military installation in Chambersburg, Pa. APW Electronics entered receivership, placing its 30 percent stake in APW President for sale. AWS Group added 1,500 m2 of manufacturing space to its Namestrovo, Slovakia, plant. Benchmark Electronics authorized a USD 100 million share repurchase program. Brantham Group: • Finished ﬁrst phase of SMT facility upgrade and second phase is due for completion in November; and • Formed a joint venture with ATM Electronics in Soﬁa, Bulgaria. Catalyst Manufacturing Services: • Purchased USD 4.5 million in equipment, including a Genesis Platform from Universal; and • Opened a newly renovated 60,000 ft2 facility in Tijuana, Mexico. Celestica was named Kemet’s 2007 Best Overall Total Cost of Ownership supplier. Clevo borrowed USD 48 million to expand notebook production in Kunshan, China. Continental inaugurated its USD 51 million R&D and electronics manufacturing facilities near Bangalore, India. Custom Systems Integration received a contract from the Naval Surface Warfare Center to design, manufacture, and test custom, complex PCBs. Digitron is expanding its motherboard production in Manaus, Brazil, from 800,000 to 950,000 units/month. Elcoteq: • Suspended merger talks with Arima Communications for joint production for LGE; and • Appointed Cecilia Liu general manager of its Dongguan plant. First International Computer closed its Czech Republic notebook manufacturing subsidiary and transferred its work to Suzhou. Flextronics: • Is seeking St. Petersburg, Russia, manufacturing location; • Is establishing a plant in Suzhou, China; • Received a CEM contract for Oerlikon Solar products; • Took over Carmanah Technologies’ solar manufacturing activities; • Ended its investment in ServiceSource; • Closing its Östersund, Sweden, plant, and layoffs will begin in November; and • Is losing its Lego contract. Lego will bring its manufacturing back in house in 2009. Foxconn/ Hon Hai: • Is building Mexico’s largest electronics plant in San Jeronimo, scheduled to have 20,000 employees; • Is building a global shipping and assembly hub in free trade zone of Kaohsiung, Taiwan; • Received EU approval to purchase Sanmina-SCI plants in Székesfehérvár, Hungary, and Guadalajara, Mexico; • Is investing an additional USD 243.4 million into 11 China units; • Is building a TWD 88.24 million digital content facility in Kaohsiung,Taiwan; http://circuitree.com

Table of Contents Feed for the Digital Edition of CircuiTree - September 2008

CircuiTree - September 2008 Contents My Line Industry Review Tech Talk Flexible Thinking New Halogen-Free Materials: Their Time Has Finally Arrived Asian Section IPC Issues PCB and Package Convergence Ask the Flexperts Market Outlook IPCA Showcase Technical Product Spotlights Classified Ads Upcoming Events Ad Index

CircuiTree - September 2008

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