CircuiTree - January 2009 - (Page 25) Total System Concept – Höllmüller offers to its customers the complete range of necessary equipment for their processes. This means that they then deal with only one project partner. This results in an ideal production line configuration made up of optimally adapted modules thus ensuring a maximum security from the planning phase right up to the production start-up. Troughhole Plating Selectable for both, DC and Reverse Pulse Plating ComPlateCu G4 System – Impact of G4 - 50% reduced current at contact - robust machine behaviour - strongly reduced maintenance - higher current density possible: 4 -8 Adm in panel plating, 4-6 Adm in pattern plating - best surface uniformity - TCC (thin copper clad) compatible: 0,1μm – 2,5μm base copper - fine line applicable:15μm line and space Etching Plating Etching Tin Stripping Solder Mask & Exposure Micro-Etching Tin as resist - fine line adjustment system for equal etching over whole product - high impact nozzles with short spray angle, spraying in gap between rollers - ultra high resolution and etching factor - special correction etch system for correction of leading/trailing edge or dog bone effects available - high frequent oscillation system more information www.hms-germany.de http://www.hms-germany.de http://www.hms-germany.de
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