CircuiTree - January 2009 - (Page 26) New Capability for HDI Microvia Defect Detection incur service, transportation, and replacement costs. And this last case damages customer relationships and may result in the loss of future business. Many HDI manufacturers recognize HDI via construction as a prime defect risk area. HDI applications put these features in harm’s way due to stresses from thermal excursions, vibration, and electrical current loading. AOI does not inspect these features, and high volume final electrical test will mask some defect categories. Final electrical test comes late in the process. AEI provides manufacturers with the opportunity for early detection of such defects, leading to process correction before a larger population of product enters the value flow. Enhanced detection of latent defects will reduce cost, improve customer satisfaction, and improve development of future business. ■ Figure 10 Allowing Defects to Reach Downstream Not Only Adds Cost but Damages Customer Relationships does not completely eliminate the possibility of latent failures escaping to assembly. But the fundamental process problems that create the defect situations discussed here are similar. The early detection of elevated populations of the defects shown in Figure 2 and 3 and many of the Figure 5 defects will permit the manufacturer to utilize lot-acceptance criteria that avoid shipment of latent defects to the end customer, hence reducing downstream product liability risk, even for latent defects that are not individually detected. The costs associated with failure to control HDI microvia defects and latent failures far outweigh the costs to deploy and operate the AEI process. The Rule of 10s (Figure 9) suggests that the cost of defect correction increases by an order of magnitude each time the product escalates between the in-process, final test, component assembly, and final customer delivery stages. As noted, problems not caught until final test can result in delayed process control feedback and production of costly scrap (Figure 10). Latent defects of the type illustrated in Figure 5 that appear at final assembly add the loss of expensive electronic components that have been added to the substrate, usually more valuable than the substrate itself. Latent defects that make it to distribution and end use Mark Swart is vice president of R&D and Dave Wilkie is chief technical liaison. Both are employed by Everett Charles Technologies. Email: mark.swart@ectinfo.com 1,238,353 Postal Addresses 965,577 with Phones 410,330 Email Addresses BNP Media’s database gives you access to over 1.2 Million business professionals. BNP Media offers prime executives from over 60+ Titles across 50+ Industries. Select from high-growth key business markets: • Manufacturing • Architecture • Food • Construction • Packaging • Service • Industrial Machinery • Gaming and much more! For Postal Information Contact: Robert Liska 800.223.2194 x726 robert.liska@edithroman.com Order these exceptional revenuegenerating lists to increase the success of your next campaign. For Email Information Contact: Shawn Kingston 800.409.4443 x828 shawn.kingston@epostdirect.com 26 January 2009 • circuitree.com EdithRomanAd_CT_0808_Half.indd 1 7/1/08 2:23:49 PM http://www.circuitree.com
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