CircuiTree - February 2009 - (Page 37) Electronics Panel / Pattern Plating Technology Inpulse 2THF – The Best Choice for Through Hole Filling Inpulse 2THF – Savings in chemistry and resources Conventional Filling 0 20 40 60 80 100 Inpulse 2THF 75% less chemistry and resources The Inpulse 2THF electrolyte together with the unique Uniplate InPulse 2 System is ideally suited for through hole filling especially for thin core material with copper foil thickness less than 5 μm. Benefits of the Inpulse 2THF System ▪ Through hole filling with minimum surface plated copper ▪ Excellent surface uniformity ▪ Through hole metallisation and electrolytic copper through hole filling in one conveyorised process line ▪ Process capable for core material of 50 μm with copper foil ≤ 5 μm thickness ▪ Allows 2 mil line and space technology ▪ Improved reliability, CTE mismatch eliminated ▪ Deposit plated with the Inpulse 2THF system meets all current reliability standards ▪ Dramatically reduced costs compared to conventional plugging technology ▪ Economical process savings in: copper metal, soldermask, etching process and processing time Inpulse 2THF with high hole density: ▪ Diameter 100 μm ▪ Panel thickness 120 μm ▪ Drill pitch 250 μm ▪ Copper foil 3 μm ▪ Strike plated 3 μm ▪ Inpulse 2THF 10 μm Atotech Headquarters P.O. Box 21 07 80 · 10507 Berlin · Germany · www.atotech.com Tel. +49 (0) 30-349 85-0 · Fax +49 (0) 30-349 85-777 http://www.atotech.com http://www.atotech.com
Table of Contents Feed for the Digital Edition of CircuiTree - February 2009 CircuiTree - February 2009 Contents Lead Wire The Wire Tech Talk Flexible Thinking Are Better PCB Design Tools and Manufacturing Enough to Stay Competitive? The Strategist Fein-Lines The Big Deal Over Fine Pitch Assembly Asian Section View From the Middle Market Outlook Technical Product Spotlights Classified Ads Upcoming Events Ad Index CircuiTree - February 2009 CircuiTree - February 2009 - CircuiTree - February 2009 (Page Cover1) CircuiTree - February 2009 - CircuiTree - February 2009 (Page Cover2) CircuiTree - February 2009 - CircuiTree - February 2009 (Page 1) CircuiTree - February 2009 - Contents (Page 2) CircuiTree - February 2009 - Contents (Page 3) CircuiTree - February 2009 - Contents (Page 4) CircuiTree - February 2009 - Contents (Page 5) CircuiTree - February 2009 - Lead Wire (Page 6) CircuiTree - February 2009 - Lead Wire (Page 7) CircuiTree - February 2009 - The Wire (Page 8) CircuiTree - February 2009 - The Wire (Page 9) CircuiTree - February 2009 - The Wire (Page 10) CircuiTree - February 2009 - The Wire (Page 11) CircuiTree - February 2009 - The Wire (Page 12) CircuiTree - February 2009 - The Wire (Page 13) CircuiTree - February 2009 - Tech Talk (Page 14) CircuiTree - February 2009 - Tech Talk (Page 15) CircuiTree - February 2009 - Tech Talk (Page 16) CircuiTree - February 2009 - Tech Talk (Page 17) CircuiTree - February 2009 - Tech Talk (Page 18) CircuiTree - February 2009 - Flexible Thinking (Page 19) CircuiTree - February 2009 - Are Better PCB Design Tools and Manufacturing Enough to Stay Competitive? (Page 20) CircuiTree - February 2009 - Are Better PCB Design Tools and Manufacturing Enough to Stay Competitive? (Page 21) CircuiTree - February 2009 - Are Better PCB Design Tools and Manufacturing Enough to Stay Competitive? (Page 22) CircuiTree - February 2009 - Are Better PCB Design Tools and Manufacturing Enough to Stay Competitive? (Page 23) CircuiTree - February 2009 - The Strategist (Page 24) CircuiTree - February 2009 - Fein-Lines (Page 25) CircuiTree - February 2009 - The Big Deal Over Fine Pitch Assembly (Page 26) CircuiTree - February 2009 - The Big Deal Over Fine Pitch Assembly (Page 27) CircuiTree - February 2009 - The Big Deal Over Fine Pitch Assembly (Page 28) CircuiTree - February 2009 - The Big Deal Over Fine Pitch Assembly (Page 29) CircuiTree - February 2009 - Asian Section (Page 30) CircuiTree - February 2009 - Asian Section (Page 31) CircuiTree - February 2009 - Asian Section (Page 32) CircuiTree - February 2009 - Asian Section (Page 33) CircuiTree - February 2009 - Asian Section (Page 34) CircuiTree - February 2009 - Asian Section (Page 35) CircuiTree - February 2009 - View From the Middle (Page 36) CircuiTree - February 2009 - View From the Middle (Page 37) CircuiTree - February 2009 - Market Outlook (Page 38) CircuiTree - February 2009 - Market Outlook (Page 39) CircuiTree - February 2009 - Market Outlook (Page 40) CircuiTree - February 2009 - Market Outlook (Page 41) CircuiTree - February 2009 - Technical Product Spotlights (Page 42) CircuiTree - February 2009 - Technical Product Spotlights (Page 43) CircuiTree - February 2009 - Technical Product Spotlights (Page 44) CircuiTree - February 2009 - Classified Ads (Page 45) CircuiTree - February 2009 - Classified Ads (Page 46) CircuiTree - February 2009 - Classified Ads (Page 47) CircuiTree - February 2009 - Ad Index (Page 48) CircuiTree - February 2009 - Ad Index (Page Cover3) CircuiTree - February 2009 - Ad Index (Page Cover4)
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