CircuiTree - March 2009 - (Page 8) IPC Releases PCB Industry Results for Dec 08 BANNOCKBURN, Ill. — Association Connecting Electronics Industries® announced the December fi ndings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid PCB shipments are down 14.2 percent and bookings are down 24.5 percent in December 2008 from December 2007. Year to date, rigid PCB shipments are up 0.9 percent and bookings are down 5.5 percent. Compared to the previous month, rigid PCB shipments decreased 0.9 percent and rigid bookings decreased 4.6 percent. The book-to-bill ratio for the North American rigid PCB industry in December 2008 fell to 0.89. Flexible circuit shipments in December 2008 are down 17.1 percent, but bookings are up 23.8 percent compared to December 2007. Year to date, flexible circuit shipments are up 3.4 percent and bookings are down 3.1 percent. Compared to the previous month, flexible circuit shipments are up 23.7 percent and flex bookings nearly doubled, up 99.9 percent. The North American flexible circuit book-to-bill ratio in December 2008 jumped to 1.08. For rigid PCBs and flexible circuits combined, industry shipments in December 2008 decreased 14.5 percent from December 2007 and orders booked decreased 21.1 percent from December 2007. Year to date, combined industry shipments are up 1.1 percent and bookings are down 5.3 percent. Compared to the previous month, combined industry shipments for December 2008 are up 0.6 percent and bookings are up 1.3 percent. The combined (rigid and flex) industry book-to-bill ratio in December 2008 dipped to 0.90. CALCE and Buehler Offer 4-day Course on Failure Analysis of Electronics An intensive 4-day course on Failure Analysis of Electronics is being off ered jointly by CALCE and Buehler. The course will cover specimen preparation and materials analysis techniques applicable to electronic assemblies, components, and devices. The course consists of a combination of classroom instruction, demonstrations, and hands-on laboratory training. Lecture topics include physics-offailure root cause analysis, guidelines for selection of analytical tools and practical instruction on laboratory techniques. The laboratory portion of the course includes demonstrations and step-by-step handson sample preparation using metallographic techniques on the latest failure analysis equipment from Buehler. In addition, a number of important non-destructive and destructive analysis techniques will be demonstrated. Each course attendee is invited to 8 March 2009 • circuitree.com submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance, for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course, to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course. Course fee: $2500, CALCE member discount applies. For more information, and registration, please visit: http://www. calce.umd.edu/facourse/spring2009 or contact Bhanu Soodfor. direct sales team to a combined direct and indirect sales structure. The company maintains the ability to produce new equipment, provide retrofits and machine upgrades and support existing equipment. Given the current challenging economic environment Excellon has decided to focus less on new equipment sales at this time. There will be no change to the company’s warranty or service coverage, and we fully support our equipment to help our customers realize success. Excellon Automation Announces Reorganization of Machine Sales Team Rancho Dominguez, Calif. –Excellon Automation announced that it has restructured its sales organization in the North American market from a dedicated Frank Averdung Assumes Position of SUSS MicroTec AG CEO Ahead of Schedule Munich, Germany —As announced by SUSS MicroTec, Frank Averdung will assume the position of Chief Executive Officer of SUSS MicroTec AG effective starting February 1, 2009. The Company’s Supervisory Board appointed Mr. Averdung to the Management Board of SUSS MicroTec AG in November 2008. Mr. Averdung was originally to take over his duties as Chief Executive Officer beginning June 11 http://www.calce.umd.edu/facourse/spring2009 http://www.calce.umd.edu/facourse/spring2009 http://www.circuitree.com
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