Mission Critical - Winter 2008 - (Page 58)

High-Density Data Centers continued Legend A - In-Row Power Distribution (UPS and Battery Back-up) B - In-Row Cooling (Closed Loop, Close Coupled) C - Equipment Enclosures Figure 2. A simple in-row data center solution For most sites, enclosures, or, at the least, large footprint open frames are recommended for installation of IT hardware. While it may be tempting to install a smaller size Table 2. Some tasks that should be a part of any project Establish communications between all parties: Engineers, end users, facilities Conduct regular and ongoing project status meetings Determine realistic cost and lead time values Set aside time AND money for unforeseen circumstances Clearly document existing facility environment Establish scalability and redundancy requirements Develop and publish test and certifi cation procedures for specifi c components as required Develop a comprehensive labeling and documentation program Have maintenance contracts in place prior to system startups. And Finally – TRUST BUT VERIFY – Check everything, review all documentation, and know what you are getting product, the largest product footprint (frame or enclosure) is a better choice. These frames will provide sufficient volume to accommodate larger components, whether deeper server or storage chassis or high cable volume products such as multi-slot switches, utilizing high performance copper (Category 6 and higher) or fiber optic cable. The larger volume will provide sufficient room to support the components, incabinet power distribution products (power strips, PDUs), connectivity cables and related patch panels, and associated ancillary hardware. And, the bigger footprint just might save aggravation in the long run, as it may not be necessary to add depth extenders, remove doors or split up components required for future applications. The design must also provide sufficient overall power capacity, spare capacity to handle future growth, provisions for system redundancy, and enough UPS and generator capacity to support not only critical IT loads but also site infrastructure components such as chillers, air handlers, and related hardware. The circuits to each enclosure footprint must feed sufficient power to support highdensity loads. This may require an upgrade from 30 to 60 amp circuits and from single-phase to three-phase supply. Planning for cooling must take the same approach. If there is enough power to meet the server loads, there also must be enough cooling to remove all the heat. Again, guidelines should be set for overall room capacity (still using a watts/ square foot model) as well as per enclosure footprint--still using watts/square foot but with much higher loads (in some cases in excess of 2500 watts per square foot.) 58 | Mission Critical Winter 2008

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Mission Critical - Winter 2008 Table of Contents Editorial: What Have We Been Doing? Cronin’s Workshop: Imagining the Perfect Data Center Power And Cooling Solution Digital Power: The Next Edge in Business Resiliency Zinc Whiskers: Keeping Up With The Green Movement Mission Critical Care: Shipping, Staging, and Installation Legal Perspectives: “A Reliable Energy Supply Is Key to Data Center Success” Continued Payback, Instant Protection Beyond the Nines The Green Information Technology Revolution Health Care Network Offers Glimpse of the Future of Backup Power High-Density Data Centers – Discuss, Design, Deploy High Performance Data Centers Call for Innovative Cooling Techniques More Data in the Data Center Five Considerations for Powering Data Center Racks New Products Industry News Events Classifieds Letters Ad Index Datacenter Wiki: wiki-Mission Critical

Mission Critical - Winter 2008

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