Table of Contents for the Digital Edition of EE Times - November 24, 2008 EE Times - November 24, 2008 Contents Commentary: Semiconductors in China: A Mixed View Patent Office Continues to Struggle with its Growing Backlog of Applications VCs Get Picky in Difficult Economic Environment SIA Projects Sales Decline Next Year for the First Time Since 2001 Market Heats Up for Transforming the Aging Power Grid into a “Smart Power Web” Investment Bankers Comb Through Electronica in Search of Renewable Technology The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? Who Will Dominate China’s Semiconductor Market? Design Feature: Packaging Goes Vertical Under the Hood: Revell RC Helicopter: Have Fun with Mechatronics Planet Analog: Multiple Techniques for Solving Stability Problems in Power Op Amps Product Feature: ICs Address H.264/AVC Compression Issues Last Word: Intel’s Craig Barrett Directing His New Passion EE Times - November 24, 2008 EE Times - November 24, 2008 - EE Times - November 24, 2008 (Page Cover1) EE Times - November 24, 2008 - EE Times - November 24, 2008 (Page Cover2) EE Times - November 24, 2008 - Contents (Page 3) EE Times - November 24, 2008 - Commentary: Semiconductors in China: A Mixed View (Page 4) EE Times - November 24, 2008 - Commentary: Semiconductors in China: A Mixed View (Page 5) EE Times - November 24, 2008 - Commentary: Semiconductors in China: A Mixed View (Page 6) EE Times - November 24, 2008 - Patent Office Continues to Struggle with its Growing Backlog of Applications (Page 7) EE Times - November 24, 2008 - Patent Office Continues to Struggle with its Growing Backlog of Applications (Page 8) EE Times - November 24, 2008 - Patent Office Continues to Struggle with its Growing Backlog of Applications (Page 9) EE Times - November 24, 2008 - VCs Get Picky in Difficult Economic Environment (Page 10) EE Times - November 24, 2008 - VCs Get Picky in Difficult Economic Environment (Page 11) EE Times - November 24, 2008 - Market Heats Up for Transforming the Aging Power Grid into a “Smart Power Web” (Page 12) EE Times - November 24, 2008 - Market Heats Up for Transforming the Aging Power Grid into a “Smart Power Web” (Page 13) EE Times - November 24, 2008 - Investment Bankers Comb Through Electronica in Search of Renewable Technology (Page 14) EE Times - November 24, 2008 - Investment Bankers Comb Through Electronica in Search of Renewable Technology (Page 15) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 16) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 17) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 18) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 19) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 20) EE Times - November 24, 2008 - The Mad Rush to Invest in China’s Semiconductor Sector is Slowing Down. Will China Find a Way to Build its Own Chip Industry -- Ever? (Page 21) EE Times - November 24, 2008 - Who Will Dominate China’s Semiconductor Market? (Page 22) EE Times - November 24, 2008 - Who Will Dominate China’s Semiconductor Market? (Page 23) EE Times - November 24, 2008 - Who Will Dominate China’s Semiconductor Market? (Page 24) EE Times - November 24, 2008 - Design Feature: Packaging Goes Vertical (Page 25) EE Times - November 24, 2008 - Design Feature: Packaging Goes Vertical (Page 26) EE Times - November 24, 2008 - Design Feature: Packaging Goes Vertical (Page 27) EE Times - November 24, 2008 - Design Feature: Packaging Goes Vertical (Page 28) EE Times - November 24, 2008 - Under the Hood: Revell RC Helicopter: Have Fun with Mechatronics (Page 29) EE Times - November 24, 2008 - Under the Hood: Revell RC Helicopter: Have Fun with Mechatronics (Page 30) EE Times - November 24, 2008 - Under the Hood: Revell RC Helicopter: Have Fun with Mechatronics (Page 31) EE Times - November 24, 2008 - Under the Hood: Revell RC Helicopter: Have Fun with Mechatronics (Page 32) EE Times - November 24, 2008 - Planet Analog: Multiple Techniques for Solving Stability Problems in Power Op Amps (Page 33) EE Times - November 24, 2008 - Planet Analog: Multiple Techniques for Solving Stability Problems in Power Op Amps (Page 34) EE Times - November 24, 2008 - Planet Analog: Multiple Techniques for Solving Stability Problems in Power Op Amps (Page 35) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 36) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 37) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 38) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 39) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 40) EE Times - November 24, 2008 - Product Feature: ICs Address H.264/AVC Compression Issues (Page 41) EE Times - November 24, 2008 - Last Word: Intel’s Craig Barrett Directing His New Passion (Page 42) EE Times - November 24, 2008 - Last Word: Intel’s Craig Barrett Directing His New Passion (Page Cover3) EE Times - November 24, 2008 - Last Word: Intel’s Craig Barrett 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