EETimes - Apollo - July 20, 2009 - 33

A p o ll o El ec t r o nic s Figure 3: Delidded view of the ULD Figure 2. End- on X-ray of the ULD Figure 2 is an end-on X-ray of the package showing its inner structure. The package is hermetically sealed with an alumina substrate, lid and sidewalls. The gull-wing leads and multiple, flip-mounted dice inside are clearly revealed. Note also the meniscus of silicone rubber used to encapsulate the soldered devices and prevent migration. Figure 3 shows the package with the lid removed. Seven individual silicon dice are mounted face-down to the alumina substrate. The metal routing layer connecting 33 EE Times | Apollo | July 20, 2009 the dice is a tin/lead screen-printed solder. A second routing layer is formed on the underside of the substrate and connects to the upper layer through metal clips at the sides of the package (there were no plated through-holes in 1965). The lower routing layer also incorporates four thin-film resistors; materials analysis indicates they are of lead/silver composition. The resistors show clear signs of trimming. We were lucky enough to track down Bob Munroe, one of the engineering talents at IBM’s Federal

EETimes - Apollo - July 20, 2009

Table of Contents for the Digital Edition of EETimes - Apollo - July 20, 2009

Apollo - July 20, 2009
Contents
Applying the Lessons of Apollo
Why Did We Go to the Moon?
In the Trenches: Profiles of the Engineers Who Made Apollo Go
Apollo Perspectives: Video Interview with Filmmaker David Sington
Virtual Teardown: Apollo Spacesuit
Virtual Teardown: The ‘Genesis’ Rock
Apollo Chip Teardown: Unit Logic Device
Ted Sorensen on Apollo
Soviet Space Firsts
Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - Apollo - July 20, 2009
EETimes - Apollo - July 20, 2009 - Contents
EETimes - Apollo - July 20, 2009 - Applying the Lessons of Apollo
EETimes - Apollo - July 20, 2009 - 4
EETimes - Apollo - July 20, 2009 - Why Did We Go to the Moon?
EETimes - Apollo - July 20, 2009 - 6
EETimes - Apollo - July 20, 2009 - 7
EETimes - Apollo - July 20, 2009 - 8
EETimes - Apollo - July 20, 2009 - In the Trenches: Profiles of the Engineers Who Made Apollo Go
EETimes - Apollo - July 20, 2009 - 10
EETimes - Apollo - July 20, 2009 - 11
EETimes - Apollo - July 20, 2009 - 12
EETimes - Apollo - July 20, 2009 - 13
EETimes - Apollo - July 20, 2009 - 14
EETimes - Apollo - July 20, 2009 - 15
EETimes - Apollo - July 20, 2009 - 16
EETimes - Apollo - July 20, 2009 - 17
EETimes - Apollo - July 20, 2009 - 18
EETimes - Apollo - July 20, 2009 - 19
EETimes - Apollo - July 20, 2009 - 20
EETimes - Apollo - July 20, 2009 - 21
EETimes - Apollo - July 20, 2009 - 22
EETimes - Apollo - July 20, 2009 - Apollo Perspectives: Video Interview with Filmmaker David Sington
EETimes - Apollo - July 20, 2009 - 24
EETimes - Apollo - July 20, 2009 - Virtual Teardown: Apollo Spacesuit
EETimes - Apollo - July 20, 2009 - 26
EETimes - Apollo - July 20, 2009 - 27
EETimes - Apollo - July 20, 2009 - 28
EETimes - Apollo - July 20, 2009 - Virtual Teardown: The ‘Genesis’ Rock
EETimes - Apollo - July 20, 2009 - 30
EETimes - Apollo - July 20, 2009 - 31
EETimes - Apollo - July 20, 2009 - Apollo Chip Teardown: Unit Logic Device
EETimes - Apollo - July 20, 2009 - 33
EETimes - Apollo - July 20, 2009 - 34
EETimes - Apollo - July 20, 2009 - 35
EETimes - Apollo - July 20, 2009 - Ted Sorensen on Apollo
EETimes - Apollo - July 20, 2009 - 37
EETimes - Apollo - July 20, 2009 - 38
EETimes - Apollo - July 20, 2009 - Soviet Space Firsts
EETimes - Apollo - July 20, 2009 - 40
EETimes - Apollo - July 20, 2009 - 41
EETimes - Apollo - July 20, 2009 - Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - 43
EETimes - Apollo - July 20, 2009 - 44
EETimes - Apollo - July 20, 2009 - 45
EETimes - Apollo - July 20, 2009 - 46
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