Embedded Systems Design Europe - March 2008 - (Page 10)

news Microsoft is recruiting for embedded center in Aachen Microsoft Corp. has launched its ﬁrst Microsoft Embedded Systems Development Centre (MESDC) which will be based in Aachen, Germany. The MESDC is part of Microsoft’s effort to expand regional development centers in Denmark, France, Ireland, Serbia, the U.K. and other countries across Europe. Located within the European Microsoft Innovation Centre (EMIC) in Aachen which was set up in 2003, the company says the MESDC is a signiﬁcant part of the $75 million global R&D investment that the Windows Embedded Business is making in Europe this ﬁscal year. Microsoft is recruiting embedded systems engineers for the MESDC and the aim is to bring up to 15 engineers on board by the end of 2008 to work closely with the U.S. Windows Embedded product development team based in Redmond, Washington. The MESDC will support global product R&D, development of Microsoft’s embedded operating systems, and accelerate collaboration between the U.S.-based Microsoft product groups and their counterparts in Europe. The MESDC will also support the needs of the active Windows Embedded customer and partner ecosystem in Europe by engaging with select members of this group to showcase high-visibility embedded systems projects that accelerate embedded development. “The MESDC will form an integral part of helping us recruit outstanding embedded systems engineers across Europe to perform product R&D, and the MESDC located in the EMIC in Aachen provides a very conducive environment for these engineers to spearhead incubation projects and accelerate technology transfer and collaborative efforts within Microsoft,” according to John Lefor, the director of the European Microsoft Innovation Center in Aachen. Kevin Dallas, general manager of the Windows Embedded Business at Microsoft, added, “Due to the immense engineering talent pool and high concentration of enterprise customers and key Windows Embedded partners in the region, we see tremendous growth opportunities for the Windows Embedded Business in Europe. European designers to win cash for green designs Freescale Semiconductor used the Embedded World conference to open registration in Europe for its ﬁrst worldwide design contest. Top regional winners will be invited to compete in the Grand FTF Design Challenge, competing against other ﬁrst place teams to win a total of $61,000 in cash prizes. The Freescale Technology Forum (FTF) Design Challenge Europe is focused on the development of sustainable applications to encourage engineers to test the boundaries of green embedded systems design. “Energy management and other green issues are becoming major considerations in virtually every purchase decision: consumer or corporate,” said Steve Wainwright, vice president of sales and marketing & general manager, Freescale EMEA. Embedded systems engineers and students are challenged to create innovative, green electronic designs using a select group of Freescale solutions. Once registered, participants receive a kit with hardware and software development tools to start on their designs, submitting ﬁnal design papers by May 23. The judging process will coincide with FTF Paris, which will be held October 7 – 8, where top regional winners will be recognized and awarded cash prizes. Freescale is hosting Design Challenges in the Americas, Japan, Europe, China and India. To be eligible to participate in the Europe Design Challenge, participants must be 18 years or older and live in Europe including Israel. First place regional winners will receive $10000, in addition to being invited to participate in the Grand FTF Design Challenge. Second place winners receive $5000 and third place $2000. Additional information including entry requirements and the ofﬁcial rules are available at www.freescale. com/designchallenge. Duo work on smaller form factor Congatec (Deggendorf, Germany) and SECO (Arezzo,Italy) have jointly created the Qseven form factor for embedded computing using the latest low power chipsets such as Intel’s Menlow platform. Targeting next generation embedded processors built using 45nm technology, Qseven format is a board measuring 70 x 70mm and a maximum power consumption of around 12W. Where heat dissipation is an issue, a thermal cooling interface has been deﬁned to help transfer any heat generated to a cooling solution. It will also provide connectivity through industry standard interfaces, including: 10 4x PCI Express; 2x SATA; 6x USB 2.0; 1x 1000BaseT Ethernet; 2x SDIO 8 bit; LVDS 2x 24 bit; DVO/SDVO (shared); video input port (VIP); high deﬁnition audio (HDA); I²C bus; and low pin count bus. By leveraging the Mobile PCI Express Module connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Through this conﬁguration it is hoped the Qseven platform will be as simple to integrate as a DIMM memory module. The companies plan to release a general speciﬁcation by the end of April, with a full design guide available by May 2008. MARCH 2008 | embedded systems design europe | www.embedded.com/europe 010_ESDE.indd 10 7/03/08 13:53:55 http://www.freescale.com/designchallenge http://www.freescale.com/designchallenge http://www.embedded.com/europe

Table of Contents Feed for the Digital Edition of Embedded Systems Design Europe - March 2008

Embedded Systems Design Europe - March 2008 Distributors to Increase Embedded Focus Kontron and Quanta to Join Forces Coverity Raises $22m as European Business Booms Help is at Hand for Europe's Industrial Control Developers Milestones in Embedded Systems Microsoft is Recruiting for Embedded Center in Aachen European Designers to Win Cash for Green Designs Duo Work on Smaller Form Factor Europe Invests in Real-Time Java for Multicore Systems Curtiss-Wright Buys Pentland Systems Designing DSP-Based Motor Control Using Fuzzy Logic Lower the Cost of Intelligent Power Control with FPGAs Virtualizing Embedded Linux Back to the Future: Manchester Encoding Is Multicore Hype or Reality New Products Advertising Contacts

Embedded Systems Design Europe - March 2008

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