Embedded Systems Design Europe - March 2008 - (Page 39)

new products Intel adds processors, extends life Intel has expanded it range of devices for embedded market segments with processors with extended, 7-year life cycle support, a new chipset and a carrier-grade server. The processors, based on Intel’s high-k, metal gate transistor formula and manufactured on the company’s 45-nanometer (nm) process, include the Quad-Core Intel Xeon processor 5400 Series and DualCore Intel Xeon processor 5200 series. These new processors, coupled with the new power-optimized Intel 5100 memory controller hub (MCH) chipset, comprise the ﬁrst 45nm CPU platforms for thermally constrained bladed applications. When using the Intel 5000P chipset, the 45nm processors are suitable for full-performance and memory-intensive applications such as storage, routers, security and medical solutions, as well as communications applications such as IP multimedia subsystems (IMS). The processors take advantage of Intel’s Hafnium-based, high-k metal gate transistor formula, which reduces power consumption, increases switching speed and signiﬁcantly increases transistor density over the company’s previous 65nm manufacturing technology. These 45nm CPU-based platforms, based on the Intel 5100 MCH chipset, are suitable for 200 watt maximum power envelope speciﬁcations such as AdvancedTCA and also for NEBS Level-3 requirements. Intel says it recorded a 67 percent increase it compute performance-perwatt when it validated the Intel 5100 MCH chipset-based 45nm quad-core platform. These comparisons were done using 2x Quad-Core Intel Xeon processor L5318 on an Intel 5000P chipset-based platform versus 2x QuadCore Intel Xeon processor L5408 on an Intel 5100 chipset-based platform using the same workloads . It says that the 45nm quad-core processors also allow for a 22 percent performance gain over previous-generation platforms within the same thermal proﬁle. Intel is offering extended lifecycle support for 7 years for the dual-core Intel Xeon processor 5200 series (E5240, E5220, L5238) and the Quad-Core Intel Xeon processor 5400 series (E5440 and L5408). This represents an expansion from previous minimum support of 5 years. The new Intel carrier grade server TIGH2U building block offers increased choice for customers that require power efﬁciency and improved compute performance for high-end communication applications. Intel also announced enhancements for its TIGW1U carrier grade server, NSW1U IP network server and NSC2U IP network server. These communication rack-mount servers now support the Quad-Core Xeon processor 5400 series and are suitable for telco and network applications in harsh environments with NEBS Level-3 requirements that demand high performance, energy efﬁciency and high I/O throughput. www.intel.com Memory controller improves power and reliability Hyperstone has introduced the F3 family of Flash Memory controllers for solid state disk (SSD), disk-on-module (DoM), CompactFlash (CF) cards, and embedded ﬂash. The F3 provides lower power consumption, higher reliability, endurance, and rigorous power fail safe features for all single level cell (SLC) and multi level cell (MLC) based ﬂash memory solutions. Based on a 32-bit RISC core including instruction set extensions optimized for ﬂash handling, the F3 offers safe power fail handling, proven error detection and correction, superior wear leveling that involves all physical blocks including the ones containing static data, satisfying the most demanding requirements regarding data trafﬁc and power fail situations. It is fully compliant to CompactFlash 3.0 and compatible to 4.1 speciﬁcations and has a fast ATA supporting PIO mode 6, MDMA mode 4, UDMA mode 4 in True-IDE mode with sustained read up to 45 Mbit/s and random read up to 35 Mbit/s and sustained write up to 30 Mbit/s and random write up to 6 Mbit/s. It provides two direct ﬂash access (DFA) channels including two sector buffers and interleaving capability as well as error correcting code (ECC) capable of correcting 4 symbols in a 512 bytes sector with additional CRC. As ﬁrmware is stored in ﬂash memory, all future ﬂashes can be supported by simple ﬁrmware upgrades while a built-in voltage regulator, and detector, reducing the bill-of-materials to a few additional capacitors and resistors. System operation current is 75 mA max. depending on ﬂash, automatic power-down mode, power saving mode, automatic wake-up with sleep mode current < 200 µA. The F3 is available as known-gooddie, in a 100 or 128 pin TQFP with and in either industrial or consumer temperature range. www.hyperstone.com 39 www.embedded.com/europe | embedded systems design europe | MARCH 2008 039_ESDE.indd 39 6/03/08 15:59:19 http://www.intel.com http://www.hyperstone.com http://www.embedded.com/europe

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Embedded Systems Design Europe - March 2008 Distributors to Increase Embedded Focus Kontron and Quanta to Join Forces Coverity Raises $22m as European Business Booms Help is at Hand for Europe's Industrial Control Developers Milestones in Embedded Systems Microsoft is Recruiting for Embedded Center in Aachen European Designers to Win Cash for Green Designs Duo Work on Smaller Form Factor Europe Invests in Real-Time Java for Multicore Systems Curtiss-Wright Buys Pentland Systems Designing DSP-Based Motor Control Using Fuzzy Logic Lower the Cost of Intelligent Power Control with FPGAs Virtualizing Embedded Linux Back to the Future: Manchester Encoding Is Multicore Hype or Reality New Products Advertising Contacts

Embedded Systems Design Europe - March 2008

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