Embedded Systems Design Europe - October 2007 - (Page 41) new products ETX module meets 3.02 spec MSC Vertriebs GmbH continues to expand its product range of ETX modules, and in doing so build upon the newest ETX Specification 3.02. The MSC ETE-GLX3 is an enhanced ETX assembly provides additional functions beyond those of the current module ETE-GLX, including more mass storage interfaces and support for the AMD-Processor Geode LX900 @1.5W. The ETX module MSC ETE-GLX3 provides, beside a Compact Flash slot Type I, two dual IDE interfaces and two SATA interfaces with a data rate up to 150 Mbyte/s. Bus interfaces include a 32-bit PCI bus and an ISA subset are available. A set of standard connections for external devices brings a high level of flexibility: 4 x USB, serial and parallel interfaces, infrared, keyboard and mouse. The fast Ethernet controller 82551 located on board provides a fast 10/100BaseTX LAN connection. The integrated LCD TFT graphics controller supports a high resolution of 1600 x 1200 pixels via the LCD interface and 1920 x 1440 pixels via the CRT interface. The graphics memory size can be up to 256 Mbyte. An audio interface of type AC’97 rounds out the variety of connections. The AMD Geode LX900 processor running at 600 MHz operates together with the companion chip Geode CS5536 from AMD. As an alternative, the module is also available with the Geode LX800 running at 500 MHz. The processor has Level-1 data and instruction caches, each with 64 kbytes as well as a 128 kbyte L2 cache integrated. By means of DDR-SRAMs on SO-DIMM, local memory can be extended up to 1 Gbit. The ETX-module measures 95 x 114 mm is also available with an optional 2 mm thick flat heat spreader and is specified for a temperature range from 0 to 60°C without forced air movement. www.msc-ge.com IDE leverages 12years of university research TTE Systems Ltd., has launched the RapidiTTy integrated development environment (IDE) that is used to design high-reliability microcontroller software. It is targeted at the software developers of deeply embedded applications such as control and monitoring operations in medical, defence, automotive and industrial sectors, as well as in white and brown goods. The RapidiTTy IDE provides access to time-triggered (TT) software design techniques. TT software is inherently reliable as its behaviour is highly predictable. RapidiTTy leverages over 12 years of research from the University of Leicester and enables TTE Systems to overcome the traditional barriers to TT. RapidiTTy accelerates TT software development by simplifying and automating many of the necessary software development steps. By providing advanced optimization and scheduling capabilities, RapidiTTy produces software executables that run efficiently on off-the-shelf MCUs. www.tte-systems.com PIP5 packaged industrial PC celebrates tenth anniversary MPL introduced the PIP5, one of the first packaged industrial PCs in the market, in 1997 with a fanless, extended temperature, long-term available module for harsh applications. The first board design was based around the 5x86 CPU. The latest model is based on the Intel Core Duo and is available in the same housing designed 10 years ago. Within the 10 years MPL expanded the original housing solution allowing to install up to six PC/104 or PC/104-Plus cards, up to six PMC cards or even up to four PCI cards. There is a IP67 protected solution for outdoor or defense applications. The PIP product range is specifically designed to withstand extreme selection of long-term available components and the operating temperature range. The thermal design power of the PIP solution is done such way that it can be operated with maximum CPU load from -40°C up to +75°C ambient temperature. . The compact and robust housings which measure 162 x 270 x 62/83/120mm consist of internally chromated and externally either powder coated or anodized aluminum. All externally available connectors are standard PC connectors. The PIP Concept includes on-board a power supply that works with a input voltage of 8 – 28VDC (optionally up to 48VDC). www.mpl.ch 41 conditions (cold, heat, dust, shock, vibrations, unmanned ) hence they still can be operated as a common PC with standard software. Differentiators are the design and construction of the pc board, the on-board EMI/RFI protection, the versatile housing, the www.embedded.com/europe | embedded systems design europe | OCTOBER 2007 041_ESDE.indd 41 12/10/07 10:27:52 http://www.msc-ge.com http://www.tte-systems.com http://www.mpl.ch http://www.embedded.com/europe
Table of Contents Feed for the Digital Edition of Embedded Systems Design Europe - October 2007 Embedded Systems Design Europe - October 2007 Contents Linux Set to Dominate Torvalds Updates Linux Kernel ARM Establishes Smart Card Foundry Program Emerson Buys Motorola's Embedded Comms Group LynuxWroks and TTTech to Cooperate on Avionics MontaVista CEO Looks for Acquisitions in Europe Ready: Multiprocessing Technology Provides Opportunity Automotive to Drive MCU Market New Supporters Join COM Express Group Analyst Weighs TI Versus Xilinx Versus PicoChip Cover Feature: Embedded Systems Security Has Moved to the Forefront Trace Exposes the Toughest Real-Time Bugs Employ a Secure Flavor of Linux Use an MCU's Low-Power Modes in Foreground/Background Systems Transporting Video Over Wireless Networks New Products Advertising Contacts Embedded Systems Design Europe - October 2007 Embedded Systems Design Europe - October 2007 - Embedded Systems Design Europe - October 2007 (Page 1) Embedded Systems Design Europe - October 2007 - Embedded Systems Design Europe - October 2007 (Page 2) Embedded Systems Design Europe - October 2007 - Contents (Page 3) Embedded Systems Design Europe - October 2007 - Contents (Page 4) Embedded Systems Design Europe - October 2007 - Contents (Page 5) Embedded Systems Design Europe - October 2007 - ARM Establishes Smart Card Foundry Program (Page 6) Embedded Systems Design Europe - October 2007 - ARM Establishes Smart Card Foundry Program (Page 7) Embedded Systems Design Europe - October 2007 - LynuxWroks and TTTech to Cooperate on Avionics (Page 8) Embedded Systems Design Europe - October 2007 - Ready: Multiprocessing Technology Provides Opportunity (Page 9) Embedded Systems Design Europe - October 2007 - Analyst Weighs TI Versus Xilinx Versus PicoChip (Page 10) Embedded Systems Design Europe - October 2007 - Analyst Weighs TI Versus Xilinx Versus PicoChip (Page 11) Embedded Systems Design Europe - October 2007 - Cover Feature: Embedded Systems Security Has Moved to the Forefront (Page 12) Embedded Systems Design Europe - October 2007 - Cover Feature: Embedded Systems Security Has Moved to the Forefront (Page 13) Embedded Systems Design Europe - October 2007 - Cover Feature: Embedded Systems Security Has Moved to the Forefront (Page 14) Embedded Systems Design Europe - October 2007 - Cover Feature: Embedded Systems Security Has Moved to the Forefront (Page 15) Embedded Systems Design Europe - October 2007 - Cover Feature: Embedded Systems Security Has Moved to the Forefront (Page 16) Embedded Systems Design Europe - October 2007 - Trace Exposes the Toughest Real-Time Bugs (Page 17) Embedded Systems Design Europe - October 2007 - Trace Exposes the Toughest Real-Time Bugs (Page 18) Embedded Systems Design Europe - October 2007 - Trace Exposes the Toughest Real-Time Bugs (Page 19) Embedded Systems Design Europe - October 2007 - Trace Exposes the Toughest Real-Time Bugs (Page 20) Embedded Systems Design Europe - October 2007 - Trace Exposes the Toughest Real-Time Bugs (Page 21) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 22) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 23) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 24) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 25) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 26) Embedded Systems Design Europe - October 2007 - Employ a Secure Flavor of Linux (Page 27) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 28) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 29) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 30) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 31) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 32) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 33) Embedded Systems Design Europe - October 2007 - Use an MCU's Low-Power Modes in Foreground/Background Systems (Page 34) Embedded Systems Design Europe - October 2007 - Transporting Video Over Wireless Networks (Page 35) Embedded Systems Design Europe - October 2007 - Transporting Video Over Wireless Networks (Page 36) Embedded Systems Design Europe - October 2007 - Transporting Video Over Wireless Networks (Page 37) Embedded Systems Design Europe - October 2007 - Transporting Video Over Wireless Networks (Page 38) Embedded Systems Design Europe - October 2007 - New Products (Page 39) Embedded Systems Design Europe - October 2007 - New Products (Page 40) Embedded Systems Design Europe - October 2007 - New Products (Page 41) Embedded Systems Design Europe - October 2007 - New Products (Page 42) Embedded Systems Design Europe - October 2007 - Advertising Contacts (Page 43) Embedded Systems Design Europe - October 2007 - Advertising Contacts (Page 44)
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