Microwave Engineering Europe - January/February 2008 - (Page 18)

18 COVER FEATURE — RF SIP DESIGN Adding the effects of packaging and interconnects The above down-converter RF subsystem needs to be interconnected with wire bonds and housed in a package. The TOPS package that houses the SiP is then modeled as shown in Figure 8. Here ADS 2008 allows 3D visualization of the package with interactive stretching in the vertical dimension to check correct via placements. Cut-planes can interactively slice through complex 3D multi-layer structures to verify correctness before committing to hardware prototyping or production. During layout editing, layer translucency can be turned on to see all layers at once in ADS 2008 instead of selectively toggling layer visibility as in previous ADS versions. ADS 2008 allows JEDEC-compliant wire-bond proﬁles to be directly inserted into layout for 3D-EM simulation (Figure 9) and the results conveniently included into the overall SiP system veriﬁcation. Vias used for interconnects are automatically added during trace insertion through multi-layer substrates in ADS 2008 and avoids the need to call up via insertion menu picks. Conclusion RF-SiP is fast becoming the enabling technology for quickly integrating multiple active and passive functions into small drop-in modules for the wireless and defense-aerospace industries. Agilent Technologies also rely on RFSiPs to improve the price-performance of its state-of-the-art instruments and the many capabilities in its Advanced Design System 2008 are developed speciﬁcally for designing RF-SiPs productively. About Agilent EEsof Advanced Design System 2008 The installed base of ADS users represents the world’s largest community of highfrequency designers in the wireless, defenseaerospace and high-speed digital industries. ADS has its origin as the design tool for Hewlett Packard’s instrumentation and today it is used by Agilent Technologies to design the high-frequency mixed-signal systems and circuits that go into its state-of-the-art test and measurement instrumentation. ADS 2008 is designed to deliver 100 percent productivity improvements over previous versions. These signiﬁcant enhancements to the ADS user interface can cut in half the time and effort needed by designers to accomplish typical design tasks. For more information about the productivity improvements in Advanced Figure 8: TOPS package for RF-SiP. Figure 9: TOPS interconnect RF-SiP total analysis with JEDECcompliant bond wire 3D-EM simulation in ADS 2008. Design System 2008, visit www.agilent. com/ﬁnd/eesof-ads2008-productivity, or to try out ADS 2008 for yourself, visit www. agilent.com/ﬁnd/eesof-ads2008-demo Author information Hee-Soo Lee graduated from Hankuk Aviation University, Korea with a BSEE degree. He is an RF/SiP/Module design ﬂow specialist in Agilent EEsof EDA Division, where he is responsible for developing and promoting ADS/RFDE software solutions for RF SiP/Module market. He can be reached at hee-soo_lee@ agilent.com How-Siang Yap is the product manger for the Advanced Design System EDA platform in Agilent EEsof with responsibility for developing design solutions for the RF-SiP, MMIC, RFmixed signal board, antennas and RF-MW components targeted at the commercial wireless and defense-aerospace industries. He holds a 1st class honors engineering degree from the University of New South Wales, Australia and a postgraduate technology management diploma from the Helsinki School of Business, Finland. His email is how-siang_yap@agilent.com Dean Nicholson is a hardware R&D engineer responsible for developing advanced components for use in nextgeneration test instruments from Agilent Electronic Measurement Group. He has been active in designing oscillators, microwave MCM packaging and advanced switching systems. Dean graduated from UC Berkeley with double major BS degrees in Electrical Engineering and Material Science. Company Information Agilent EEsof EDA www.agilent.com Microwave Engineering Europe ● January/February 2008 ● www.mwee.com 016_017_018_MWEE.indd 18 22/01/08 15:00:10 http://www.agilent.com/find/eesof-ads2008-productivity http://www.agilent.com/find/eesof-ads2008-productivity http://www.agilent.com/find/eesof-ads2008-demo http://www.agilent.com/find/eesof-ads2008-demo http://www.agilent.com http://www.mwee.com

Table of Contents Feed for the Digital Edition of Microwave Engineering Europe - January/February 2008

Microwave Engineering Europe - January/February 2008 Contents News Comment Radio: Raising the Bar for the Radio: Making 802.11n Work Cover Feature: The RF-System-In-Package Trend - Efficient Design with Advanced Design System 2008 Wireless Sensor Networks: The Zigbee PRO Feature Set: More of a Good Thing Very Fast Measurements of Wireless Devices with Small Antennas in Reverberation Chambers WiMAX Update 2008 Bridging the Gap from the CMOS DSP to the Antenna in OFDM Systems Products Calendar

Microwave Engineering Europe - January/February 2008

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