Microwave Engineering Europe - April 2008 - (Page 24)

24 INTERVIEW — Mitsubishi Electric Europe GaAs technologies spanning high-end space and radar through to cost-sensitive handset and LNB applications Microwave Engineering Europe (MWEE) talks to Dr S. Abdin, Product Marketing Director of Semiconductor European Business Group at Mitsubishi Electric Europe B.V. By Jean-Pierre Joosting Introduction The Mitsubishi brand stands for a comprehensive group of companies that recently achieved a turnover of 600 billion USD during the last ﬁnancial year (2007). To put this in perspective, such a large number represents more than 10 percent the GDP of Japan. Part of this colossus, Mitsubishi Electric Corporation (MELCO) turned over around 35 billion USD over the last ﬁnancial year, which in turn includes the Semiconductor and Device Group with major market segments of optoelectronics, power semiconductors and high frequency. The turnover was approximately 2 billion USD over 2007 which represents a growth of about 42 percent since the 2003 ﬁnancial year. Of interest to readers, the High Frequency product segment offers a broad range of innovative technology that spans 0.1 GHz through to 77 GHz as well as power capabilities up to 100 W and above. Some typical application ﬁelds include TETRA, security, RFID, portable radio, cellular, WiMAX base stations and CPE, microwave links, VSAT, DBS, space, and emerging automotive 24 and 77 GHz radar. While the Headquarters of Mitsubishi Electric Europe B.V. is located in Uxbridge near London, the Headquarters for semiconductors is situated in Ratingen. Consequently, all Marketing, Engineering, Logistics and Marketing Communications activities are handled from Ratingen. Sales support is given through local sales ofﬁces in other European countries and a broad distribution network all over Europe. Technology Mitsubishi Electric provides a broad line of GaAs devices for a variety of applications. Noteworthy technologies include: - HBT for portable terminals used in mobile phone and WiMAX applications; - pHEMT in millimeter wave applications covering the L/S bands; - HFET and MESFETs for high-power ampliﬁer (HPA) and solid-state power ampliﬁer (SSPA) applications in base stations; - MMIC technology. Mitsubishi Electric is also developing a future high output GaN device and an InP device for high-speed, EHF (extremely high frequency) applications. With a key strength in mass production, Mitsubishi has long experience since 1960 in HF manufacturing and a vertically integrated approach that covers wafer manufacturing, package, assembly and test. The company combines abilities in highefﬁciency, cost-sensitive technology driven by the domestic (Japan) mobile phone and global DBS (digital broadcast satellites) market and high reliability technology required by internal company demand for space and defense projects. In the 1980’s Mitsubishi Electric started to develop high-efﬁciency PAs for mobile phones based on harmonics processing, well ahead of competitors and has a major market share in the Japanese mobile phone PA market. Mitsubishi also has a substantial share of low noise HEMTs in the DBS market. Interview MWEE: As a leader in the domestic market (Japan) MELCO have the technology required to further expand overseas markets. Which markets are being targeted and what is the strategy for growing market share? Dr Abdin: Our targets in the global market include a variety of technologies such as Dr Abdin, Product Marketing Director, Mitsubishi Electric Europe is responsible for managing the European and Middle Eastern semiconductor division. He draws on 26 years of engineering experience, focuses attention on developing new policies and procedures, and oversees all business operations. He attributes his success to work performance, harmony and dedication. Dr Abdin joined MEU in 1984 and previously held positions at NEC (1982-1984) as Product Marketing Manager, AEG (1979-1982) as Development Engineer and Thomson (19771979) as Development Engineer. WCDMA power ampliﬁers (PAs), LN HEMTs for DBS, Power FETs for space and MMICs for WiMAX CPE (Customer Premise Equipment). In the case of the WCDMA PAs we are targeting chip set vendors as well as reference design, while the for WiMAX PAs we are targeting the global players Our strategy is to establish long term customer relationships and to build up strategic agreements. To this end, we are looking for global market share in the order of 30 percent for WCDMA PAs, 40 percent each for WiMAX CPE , as well as 50 percent for the DBS-LN HEMT. MWEE: As a global player how do you position the company with respect to the European market? Microwave Engineering Europe ● April 2008 ● www.mwee.com 024-025-026-027_MWEE.indd 24 28/03/08 14:06:34 http://www.mwee.com

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Microwave Engineering Europe - April 2008 News Contents Comment Test and Measurement: Comprehensive WiMAX and Wi-Fi Product Design Demands Effective Channel Emulation Military/Aerospace Focus: Hardware Needs Limit Software Radio Interview — Mitsubishi Electric Europe: GaAs Technologies Spanning High-End Space and Radar Through to Cost-Sensitive Handset and LNB Applications How Do You Test ZigBee Transmitters? Advanced Receiver Design Boosts Performance CMOS PAs Pave the Way for One-Chip Phones Products Calendar

Microwave Engineering Europe - April 2008

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