Microwave Engineering Europe - May 2008 - (Page 41) PRODUCTS 41 Thermally enhanced packages suit power semiconductors up to 6 GHz StratEdge has introduced a family of small outline thermally enhanced molded ceramic packages that can be used for silicon, silicon carbide, gallium nitride, and other compound semiconductors in power integrated circuit applications. Specific devices include amplifiers, discrete transistors, and diodes where greater than 0.5 W power is consumed. The packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together. All materials used have matched coefficients of expansion. During assembly, a glassto-metal seal process combined with gold germanium brazing, results in a rugged and reliable package. The packages can handle temperatures up to 360 degrees Celsius. A hermetic seal provides enhanced reliability for the device and offers protection from harsh environmental conditions, meeting military standard requirements. Packages in this series are sealed with metal or ceramic lids that have gold-tin solder preforms. Copper composite bases or copper inserts ensure enhanced thermal dissipation. Devices are mounted directly to the metal bases thus providing excellent electric ground to the backside of the chip. The packages provide superior electrical performance for frequencies up to at least 6 GHz. Various shapes, sizes, and lead counts are available. All can be provided with gull wing-shaped leads for surface mounting. www.mwee.com/207401072 Solid state programmable attenuator covers 700 MHz to 6.0 GHz Featuring a small and compact housing, the ATS0760-63 solidstate programmable attenuator from eubus GmbH extends the company’s portfolio of solid state attenuators. This electrically switchable attenuator module provides an unmatched frequency range of 700 MHz up to 6 GHz with 1 dB steps up to 63 dB attenuation and a parallel 6 bit TTL/CMOS 5 V interface. Without the connectors it only measures 48- x 42- x 11-mm. In addition it is lightweight coming in at only 45 g. For the RF connection standard SMA (female) connectors are used. The operating temperature range covers 0 to +70 degrees Celsius, and the maximum input power is +20 dBm. Applications are found where fast and frequent attenuation switching is needed, such as in telecommunications, mobile networks, measurement and military. Due to its wide frequency range, it covers all current and future mobile communication bands. www.mwee.com/207401096 Microwave Engineering ● May 2008 ● www.mwee.com http://www.serco.com/Europe http://www.mwee.com/207401072 http://www.serco.com/Europe http://www.mwee.com/207401096 http://www.mwee.com
Table of Contents Feed for the Digital Edition of Microwave Engineering Europe - May 2008 Microwave Engineering Europe - May 2008 News Contents Comment Cover Feature: How to Succeed as a GaAs Foundry Wireless Networking: Wireless Coverage Where Everybody WINS Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band GPS and Satellite: GPS developments: Galileo Moves Forward with Successful Giove-B Satellite Launch — Broadcom Targets AGPS in Mobile Phones and Devices Raising the Bar for the Radio: Making 802.11n Work Reducing Power Consumption in Ultrawideband Chips WiMax Catches Second Test Wave Products Calendar Microwave Engineering Europe - May 2008 Microwave Engineering Europe - May 2008 - Microwave Engineering Europe - May 2008 (Page Cover1) Microwave Engineering Europe - May 2008 - Microwave Engineering Europe - May 2008 (Page Cover2) Microwave Engineering Europe - May 2008 - Microwave Engineering Europe - May 2008 (Page 3) Microwave Engineering Europe - May 2008 - News (Page 4) Microwave Engineering Europe - May 2008 - News (Page 5) Microwave Engineering Europe - May 2008 - News (Page 6) Microwave Engineering Europe - May 2008 - Contents (Page 7) Microwave Engineering Europe - May 2008 - Contents (Page 8) Microwave Engineering Europe - May 2008 - Comment (Page 9) Microwave Engineering Europe - May 2008 - Comment (Page 10) Microwave Engineering Europe - May 2008 - Comment (Page 11) Microwave Engineering Europe - May 2008 - Cover Feature: How to Succeed as a GaAs Foundry (Page 12) Microwave Engineering Europe - May 2008 - Cover Feature: How to Succeed as a GaAs Foundry (Page 13) Microwave Engineering Europe - May 2008 - Wireless Networking: Wireless Coverage Where Everybody WINS (Page 14) Microwave Engineering Europe - May 2008 - Wireless Networking: Wireless Coverage Where Everybody WINS (Page 15) Microwave Engineering Europe - May 2008 - Wireless Networking: Wireless Coverage Where Everybody WINS (Page 16) Microwave Engineering Europe - May 2008 - Wireless Networking: Wireless Coverage Where Everybody WINS (Page 17) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 18) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 19) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 20) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 21) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 22) Microwave Engineering Europe - May 2008 - Wireless Networking: Achieving Good Coexistence in the 2.4 GHz ISM Band (Page 23) Microwave Engineering Europe - May 2008 - GPS and Satellite: GPS developments: Galileo Moves Forward with Successful Giove-B Satellite Launch — Broadcom Targets AGPS in Mobile Phones and Devices (Page 24) Microwave Engineering Europe - May 2008 - GPS and Satellite: GPS developments: Galileo Moves Forward with Successful Giove-B Satellite Launch — Broadcom Targets AGPS in Mobile Phones and Devices (Page 25) Microwave Engineering Europe - May 2008 - Raising the Bar for the Radio: Making 802.11n Work (Page 26) Microwave Engineering Europe - May 2008 - Raising the Bar for the Radio: Making 802.11n Work (Page 27) Microwave Engineering Europe - May 2008 - Reducing Power Consumption in Ultrawideband Chips (Page 28) Microwave Engineering Europe - May 2008 - Reducing Power Consumption in Ultrawideband Chips (Page 29) Microwave Engineering Europe - May 2008 - WiMax Catches Second Test Wave (Page 30) Microwave Engineering Europe - May 2008 - WiMax Catches Second Test Wave (Page 31) Microwave Engineering Europe - May 2008 - WiMax Catches Second Test Wave (Page 32) Microwave Engineering Europe - May 2008 - Products (Page 33) Microwave Engineering Europe - May 2008 - Products (Page 34) Microwave Engineering Europe - May 2008 - Products (Page 35) Microwave Engineering Europe - May 2008 - Products (Page 36) Microwave Engineering Europe - May 2008 - Products (Page 37) Microwave Engineering Europe - May 2008 - Products (Page 38) Microwave Engineering Europe - May 2008 - Products (Page 39) Microwave Engineering Europe - May 2008 - Products (Page 40) Microwave Engineering Europe - May 2008 - Products (Page 41) Microwave Engineering Europe - May 2008 - Calendar (Page 42) Microwave Engineering Europe - May 2008 - Calendar (Page Cover3) Microwave Engineering Europe - May 2008 - Calendar (Page Cover4)
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