Microwave Engineering Europe - July/August 2008 - (Page 18) 18 CAD/EDA Cadence enhances RF verification while AWR delivers an improved Microwave Office Edited by Jean-Pierre Joosting Cadence claims to have enhanced RF verification Cadence Design Systems has introduced a new simulation technology to verify wireless integrated circuits implemented in advanced CMOS process nodes. Cadence has added the “turbo” technology it recently brought to the Virtuoso® Spectre® Circuit Simulator to its RF analysis. The result is performance improvements of two to five times for analysis and verification of large RF circuits targeting advanced CMOS process nodes, and with no degradation in accuracy. This technology complements a complete manufacturability-aware solution from Cadence for design, implementation and verification of RF integrated circuits (RFICs). Based on the Virtuoso custom design platform, this solution enables designers to deal with the challenge of integrating RF with analog/mixed-signal baseband, and the emerging need for RFIC-focused electromagnetic analysis. The complete solution includes the Cadence Virtuoso RF Designer, which brings a full-wave fast planar electromagnetic (EM) field solver to the RF/wireless designer’s desktop. It offers designers advanced verification capabilities for faster electromagnetic analysis of complex structures and geometries — all within a single design flow, accelerating chip finishing and verification. Virtuoso RF Designer integrates seamlessly into the Virtuoso front-end and leverages Cadence’s patented electromagnetic analysis technology to accelerate and accommodate large designs found in today’s RFICs and System-on-Chip (SoC). The Cadence RFIC solution provides an interactive link between system design and circuit design by integrating with Simulink from The MathWorks. Cadence Design Systems www.mwee.com/208800383 AWR improves Microwave Office with 100+ enhancements With Version 2008 of the Microwave Office® design environment, AWR® has made significant changes to the user interface in order to increase its flexibility for the user. The new version also includes APLAC® harmonic balance (HB) analysis software as an alternative non-linear HB engine within the Microwave Office highfrequency design suite. The company reports that overall, hundreds of improvements have been made throughout the design environment. In Version 2008, the appearance of the overall interface can now be switched back and forth to appear much like Microsoft Office 2000 or 2003. AWR explains that it made these changes to make it easier for users to customize the design environment to suit personal preferences, with the goal of streamlining various design tasks to save time and optimizing the screen space. The AWR-APLAC foundry-approved RF simulation capability was previously available only as an option in the AWR design environment, but now comes as a standard HB engine in Version 2008 for customers who license the HB capabilities of the Microwave Office design environment. The APLAC engine is targeted at designers of complex, extremely nonlinear circuits and is based on a proprietary implementation of HB analysis that complements the frequencydomain simulation capabilities of Microwave Office. It has been fine-tuned based on more than 15 years of experience in RFIC design at Nokia and other device manufacturers, and AWR notes that it has been used in the design of more than 30 percent of all mobile phone RFICs. In addition to the user interface and APLAC enhancements, Microwave Office software now incorporates ICED IC verification software along with its support for Mentor Graphics Calibre®. Since the last major release, AWR has added advanced process design kits for TriQuint Semiconductor, WIN Semiconductors, and United Monolithic Semiconductors (UMS), and more are planned for the coming months. Version 2008 also features enhancements to AWR’s Visual System Simulator™ (VSS) software, which was integrated into the AWR design environment several years ago. This software suite aims to assist the end-to-end design and optimization of communications systems by enabling the impact of “real-world” signal impairments and other factors to be evaluated early in the design cycle when they can be addressed most effectively. VSS provides the tools necessary to optimize each of the components in a system architecture from the behavioral through component levels (in conjunction with Microwave Office software or AWR’s Analog Office® software), and then using actual device measurements to validate the final design. VSS also includes an enhanced RF Budget Analysis™ tool, which enables the user to make traditional RF cascaded measurements along a communication link, that now uses a circuit solver and expands the range of supported topologies. Co-simulation with Microwave Office, including the APLAC HB engine, is also now enabled. AWR www.mwee.com/208802767 Analog/RF mixed signal simulator Berkeley Design Automation has introduced a SPICE accurate analog/RF mixed-signal verification based on co-simulation of its Analog FastSPICE™ circuit simulator with Verilog HDL simulators. Analog and RF design teams face increasingly difficult mixed-signal verification challenges. Complex blocks such as fractional-N PLLs, frequency synthesizers, and transmit and receive chains increasingly include complex digital logic. Nanometer CMOS ICs such as system-on-chips (SoCs), wireless transceivers, power ICs, and data converters have a rich mix of digital logic and high-performance analog/RF circuitry. Design teams need to verify their analog/RF circuitry with SPICE accuracy together with their digital logic using their standard Verilog simulator. The Berkeley Design Automation tools include Analog FastSPICE™ circuit simulation, Noise Analysis Option™ device noise analyzer, RF FastSPICE™ periodic analyzer, and PLL Noise Analyzer™ stochastic nonlinear engine. The company guarantees identical waveforms to the leading “golden” SPICE simulators down to noise floor (typically 0.1 percent or less) while delivering higher performance and higher capacity. It achieves this by using advanced algorithms and numerical analysis techniques to rapidly solve the full-circuit matrix and the original device equations without any shortcuts that could compromise accuracy. Berkeley Design Automation www.mwee.com/208802769 Microwave Engineering Europe ● July/August 2008 ● www.mwee.com http://www.mwee.com/208802767 http://www.mwee.com/208800383 http://www.mwee.com/208802769 http://www.mwee.com
Table of Contents Feed for the Digital Edition of Microwave Engineering Europe - July/August 2008 Microwave Engineering Europe - July/August 2008 Contents News Comment Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells CAD/EDA: Software-Defined Radio Platforms CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office How to Meet the Design Challenges of WiMAX Power Amplifiers Products Calendar Microwave Engineering Europe - July/August 2008 Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 1) Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 2) Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 3) Microwave Engineering Europe - July/August 2008 - News (Page 4) Microwave Engineering Europe - July/August 2008 - News (Page 5) Microwave Engineering Europe - July/August 2008 - News (Page 6) Microwave Engineering Europe - July/August 2008 - Contents (Page 7) Microwave Engineering Europe - July/August 2008 - Contents (Page 8) Microwave Engineering Europe - July/August 2008 - Comment (Page 9) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 10) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 11) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 12) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 13) Microwave Engineering Europe - July/August 2008 - RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells (Page 14) Microwave Engineering Europe - July/August 2008 - RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells (Page 15) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Software-Defined Radio Platforms (Page 16) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Software-Defined Radio Platforms (Page 17) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office (Page 18) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office (Page 19) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 20) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 21) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 22) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 23) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 24) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 25) Microwave Engineering Europe - July/August 2008 - Products (Page 26) Microwave Engineering Europe - July/August 2008 - Products (Page 27) Microwave Engineering Europe - July/August 2008 - Products (Page 28) Microwave Engineering Europe - July/August 2008 - Products (Page 29) Microwave Engineering Europe - July/August 2008 - Products (Page 30) Microwave Engineering Europe - July/August 2008 - Products (Page 31) Microwave Engineering Europe - July/August 2008 - Products (Page 32) Microwave Engineering Europe - July/August 2008 - Products (Page 33) Microwave Engineering Europe - July/August 2008 - Products (Page 34) Microwave Engineering Europe - July/August 2008 - Calendar (Page 35) Microwave Engineering Europe - July/August 2008 - Calendar (Page 36)
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