Microwave Engineering Europe - July/August 2008 - (Page 32) 32 PRODUCTS Single-chip baseband processor family second-generation device designed for cost-effective femtocell applications The PC3xx family from picoChip represents a new range of system-onchip baseband processors specifically targeted at the fast-growing femtocell market. These second-generation devices incorporate the company’s field-proven modem software in a highly integrated form, enabling femtocell manufacturers to substantially reduce bill-ofmaterials while increasing performance. The PC302, the first member of the family, is a single-chip solution for HSPA femtocells compliant to TR25.820 and the newly standardized Iu-h interface. Supporting up to four users for residential and SME femtocell access points and with data rates of 14.4/5.7-Mb/s in downlink and uplink respectively the PC302 claims to enable the lowest and delivers spare processing power for customer specific enhancements and additional home networking functions. Layer 1 functionality is provided for release 6 WCDMA, while RNC stacks optimized for the PC302 support standard network architectures including the Iu-h interface to femtocell gateways or SIP/IMS. In addition to 3GPP TR25.820, the chip includes functionality for 2G and 3G network monitoring functions for cell planning and handoff (sometimes described as “cognitive radio” or Self Organizing Networks (SON)) functions and Dynamic Spectrum Management. Enhanced security features are supported for authentication, location detection, encryption and the prevention of DoS attacks. www.mwee.com/208800682 bill-of-materials and lowest power for a femtocell available today. The PC3xx family also offers an upgrade path to more users (picocells), higher performance (Release 7 with HSPA+ and MIMO) and other air-interfaces such as LTE. Fabricated in 65 nm technology, the PC302 device is a complete femtocell solution, supporting up to 14.4 Mb/s HSDPA together with 5.7 Mb/ s HSUPA for 4 connected terminals. It integrates a 3GPP NodeB modem, RNC stack, Radio Resource Management, cryptographic engine, high-speed accelerators, synchronization, network listen functionality and peripherals. The picoArray-based multi-core architecture also enables the flexibility for in-field upgrade SP2T electromechanical switch covers DC to 26.5 GHz Narda, an L-3 Communications company, has introduced the Model SEM124 single-pole, doublethrow electromechanical switch that operates from DC to 26.5 GHz with low insertion loss, high isolation, and low VSWR. The switch features a fail-safe mechanism and an integrated indicator circuit. Actuating current is 160 mA at 28 VDC. The insertion loss of the switch ranges from 0.2 dB at 3 GHz to 0.7 dB at 26.5 GHz, and VSWR is 1.2:1 to 3 GHz and less than 1.7:1 at 26.5 GHz. Isolation is at least 50 dB at 26.5 GHz and 80 dB to 3 GHz. Model SEM124 is a member of Narda’s SEM Series of electromechanical microwave single-pole, High-speed software radio PMC module offers 32 programmable DDC channels Pentek has introduced its Model 7152, a quad 200 MHz, 16-bit A/D digitizer with a 32channel digital down converter (DDC). Configured in a PMC format, it employs a highperformance, factory-installed core for users who want to purchase a product with the critical signal processing functions already installed and functioning. It is well suited to fulfill the requirements of real-time software radio, beamforming, signal intelligence and radar systems. The latest addition to the company’s FPGA installedcore, software radio family of products, the 7152 boasts features such as DDC gain and phase adjustments, signal summation and power meters with threshold detectors. The range of decimation has been extended, now programmable from 16 to 8192. The module features 32 power meters that continuously measure the individual average power output of each of the 32 DDC channels. Further, the factory installed IP cores save the user the task of FPGA programming. Another important feature of the 7152, retained from previous designs, is the frontpanel synchronization bus that simplifies integration of larger, multi-channel systems. Software support includes ReadyFlow® Board Support Packages running under Linux, Windows and VxWorks. These are complete software packages that include examples and driver interfaces for the operating system. www.mwee.com/208800683 double-throw switches that are available from stock. They include pulse latching and fail-safe models as well as models with TTL logic control and indicator circuits. In addition to the 26.5 GHz SEM124, there are models that cover DC to 12.4 GHz and DC to 18 GHz. www.mwee.com/208800686 Microwave Engineering Europe ● July/August 2008 ● www.mwee.com http://www.mwee.com/208800682 http://www.mwee.com/208800686 http://www.mwee.com/208800683 http://www.mwee.com
Table of Contents Feed for the Digital Edition of Microwave Engineering Europe - July/August 2008 Microwave Engineering Europe - July/August 2008 Contents News Comment Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells CAD/EDA: Software-Defined Radio Platforms CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office How to Meet the Design Challenges of WiMAX Power Amplifiers Products Calendar Microwave Engineering Europe - July/August 2008 Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 1) Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 2) Microwave Engineering Europe - July/August 2008 - Microwave Engineering Europe - July/August 2008 (Page 3) Microwave Engineering Europe - July/August 2008 - News (Page 4) Microwave Engineering Europe - July/August 2008 - News (Page 5) Microwave Engineering Europe - July/August 2008 - News (Page 6) Microwave Engineering Europe - July/August 2008 - Contents (Page 7) Microwave Engineering Europe - July/August 2008 - Contents (Page 8) Microwave Engineering Europe - July/August 2008 - Comment (Page 9) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 10) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 11) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 12) Microwave Engineering Europe - July/August 2008 - Cover Feature: Effective EM Simulations with Micro−λ Resolution in Macro-λ Objects — General Huygens Box Implementation (Page 13) Microwave Engineering Europe - July/August 2008 - RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells (Page 14) Microwave Engineering Europe - July/August 2008 - RF CMOS: Programmable Transceiver IC Minimises OEM Inventory for Femtocells (Page 15) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Software-Defined Radio Platforms (Page 16) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Software-Defined Radio Platforms (Page 17) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office (Page 18) Microwave Engineering Europe - July/August 2008 - CAD/EDA: Cadence Enhances RF Verification While AWR Delivers an Improved Microwave Office (Page 19) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 20) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 21) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 22) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 23) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 24) Microwave Engineering Europe - July/August 2008 - How to Meet the Design Challenges of WiMAX Power Amplifiers (Page 25) Microwave Engineering Europe - July/August 2008 - Products (Page 26) Microwave Engineering Europe - July/August 2008 - Products (Page 27) Microwave Engineering Europe - July/August 2008 - Products (Page 28) Microwave Engineering Europe - July/August 2008 - Products (Page 29) Microwave Engineering Europe - July/August 2008 - Products (Page 30) Microwave Engineering Europe - July/August 2008 - Products (Page 31) Microwave Engineering Europe - July/August 2008 - Products (Page 32) Microwave Engineering Europe - July/August 2008 - Products (Page 33) Microwave Engineering Europe - July/August 2008 - Products (Page 34) Microwave Engineering Europe - July/August 2008 - Calendar (Page 35) Microwave Engineering Europe - July/August 2008 - Calendar (Page 36)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.