Microwave Engineering Europe - September 2008 - (Page 37)

PRODUCTS 37 200-239 MHz VCO low phase noise, high linearity Power driver amplifiers high-gain over 18- to 33-GHz Avago Technologies has introduced a range of linear power driver ampliﬁers for the 18- to 33-GHz frequency range, designated AMMC/P-6333, that claim high gain and power coupled with excellent input and output return losses. Available in “bare die” or surface-mount packaging, AMMC/P-6333 devices target wireless communication infrastructure applications including point-to-point radios, VSAT and ﬁber to the home. They meet driver ampliﬁer requirements for broadband frequencies while eliminating the need for negative voltage requirements for better RF performance. The AMMC/P-6333 millimeter wave MMICs are fabricated using Avago’s 0.25-µm enhancement mode PHEMT technology, which delivers high dynamic range support with superior gain, high linearity, broad frequency band support and low current consumption. These MMICs deliver a high gain of 20 dB and a high P1dB of 23 dBm. With 50-ohm matching and third order intercept point of 30 dBm, the ampliﬁers are easy to use with a single positive voltage supply and DC power of 5 V bias at 220 mA. www.mwee.com/210102196 Crystek’s CVCO55FL-0200-0239 VCO operates from 200 MHz to 239 MHz with a control voltage range of 0.5 V to 4.5 V. It features a typical phase noise of -123 dBc/Hz at 10 kHz offset and has excellent linearity. Output power is typically +9.0 dBm. The VCO is packaged in the industrystandard 1.27-cm x 1.27-cm SMD package. Input voltage is 5 V, with a max current consumption of 25 mA. Pulling and Pushing are minimized to 0.50 MHz and 0.50 MHz/V, respectively. Second harmonic suppression is -20 dBc typical. Typical applications include digital radio equipment, ﬁxed wireless access, satellite communications systems, and base stations. www.mwee.com/210102199 LC Miniature Filters Small package. High volume. Right price. Large-scale production capabilities and custom design solutions that work for you – today and tomorrow. 3D electromagnetic simulator ideal for designing LTCC RF modules with embedded passive structures Agilent Technologies has introduced an integrated design ﬂow solution that includes full 3D EM (electromagnetic) simulation for RF Module Design. Called EMDS-for-ADS, the full 3D electromagnetic simulator is integrated into the company’s Advanced Design System EDA software platform and eliminates the need for standalone EM tools. EMDS-for-ADS helps designers accurately predict the 3D EM interactions of embedded passive components in RF modules while co-simulating with active circuits to maximize the wireless sub-system performance. The integrated 3D EM simulator improvements allow designers to analyze larger circuits faster without leaving their familiar design ﬂow. EMDS-for-ADS accounts for the ﬁnite dielectric boundaries of RF modules. In addition, it is useful for verifying the accuracy of faster Planar EM simulators such as the company’s Momentum, which assumes inﬁnite dielectric planar layers in its analysis. EMDS-for-ADS also features a new ﬁnite element mesher and highcapacity iterative solver that delivers better accuracy, speed and capacity for RF SIP (system-in-package) and RF module designs. The most common applications for EMDS-for-ADS are RF modules based on LTCC (low temperature co-ﬁred ceramics) and laminates with embedded passive structures. They are found in almost all RF modules produced today. EMDS-for-ADS saves time when drawing these structures with its planar RF layout macros. These macros automatically draw RF components such as spiral inductors and meander lines — which are timeconsuming to construct using a generic 3D drawing and simulation tool. www.mwee.com/210102195 To find out more, call (800) 344-2412 or visit www.trilithic.com. RF32608 Microwave Engineering ● September 2008 ● www.mwee.com 037_MWEE.indd Sec1:37 3/09/08 15:09:32 http://www.mwee.com/210102199 http://www.mwee.com/210102196 http://www.trilithic.com http://www.mwee.com/210102195 http://www.mwee.com

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Microwave Engineering Europe - September 2008 News Contents Comment Cover Feature: Uncovering Test and Measurement’s Role in Advancing LTE and Mobile WiMAX WiMax: WiMax and LTE Need to Address Issues of Backhaul, Cost and Efficiency for Successful Deployment WiMax: Manufacturing Communications Technology Products in India Test and Measurement Mobile Platforms Evolve to Meet Future Demands Products Calendar

Microwave Engineering Europe - September 2008

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