Microwave Engineering Europe - October 2007 - (Page 53)

PRODUCT FEATURE — EM SOLVER 53 elements for accuracy of straight line sections to the ﬂexibility of triangular elements for ﬁtting to arbitrary shapes, both of which are found together as is so often the case with today’s microwave/RF IC designs. True 3-D Metal Additionally, AXIEM differs from many planar solvers in that its mesher accurately and efﬁciently creates true 3D meshes of extruded planar geometries, and the ﬁnal solution includes all x, y, and z directed currents on all surfaces — making it an excellent ﬁt for today’s highfrequency microwave/RF IC designs. Figure 2, also from Nera, illustrates both the thick metal capability and the hybrid mesh technology of AXIEM, whereas Figure 3 shows the results of AXIEM for a curved spiral inductor where the metal width is of the same dimension as its thickness. Likewise in this view, the current ﬂow for the thick metal spiral at 20 GHz can be seen crowding on the metal edges and near to the high Er substrate. Design ﬂow The AXIEM product as a stand-alone EM solver is a powerful addition to any designer’s suite of tools. The solver provides accuracy regardless of complexity, and does so efﬁciently across the entire frequency range. The meshing technology enables complexity by delivering robust representations of the currents with fewer unknowns. The true value of AXIEM, however, lies in its integration into the overall AWR design ﬂow, where it contributes signiﬁcantly to AWR’s commitment to accelerating GHz design. While delivering innovations in its solver and meshing algorithms, the AXIEM technology also takes to a new level the AWR automated design ﬂow philosophy. By employing features that automatically determine and set user options, the requirement of a super-user with years of EM design expertise to run the product is neither necessary nor a prerequisite. Moreover, AXIEM is seamlessly tied to circuit and system simulation, layout, and veriﬁcation through the proprietary AWR uniﬁed data model (UDM). The UDM provides features such as extraction directly from circuit simulation without having to perform explicit layout and EM setup steps. OCXOs N 45 SMD OCXO Series, 10 to 32 MHz ± 30 ppb, -40 to +85 °C, 3.3 volt supply, LVCMOS or HCMOS output, low proﬁle SMD VCOs ultra low phase noise VCOs, PLL Modules, Synthesizers, 100 MHz – 18 GHz, patented coupled resonator technology, ultra low phase noise standard and custom made Conclusion The pervasive miniaturization and complexity in nearly every next-generation wireless product has pushed the envelope on not only EM technology but the Figure 2: Nera ﬁlter example – geometry: ﬁlter example reveals metal development technologies behind thickness and AXIEM hybrid mesh. it as well — from tools, to foundry processes, to packaging, and so on. The one constant is that time-tomarket windows continue to shrink and the winners are those who can get working products to market in the shortest period of time. The breakthrough represented by AXIEM technology delivers an unprecedented design tool that meets today’s advanced and demanding design requirements for an EM analysis tool that is fully integrated into the design ﬂow. AXIEM functions at the front end where it helps identify problems early on and contributes signiﬁcantly to an efﬁcient and accurate design process that enables product developers to compete successfully. AXIEM (www.axiem3d.com) is currently in beta test, and the commercial release is scheduled for Q1 2008. The product supports Windows 2000, XP, and Vista. It will be demonstrated at the European Microwave Week Conference from October 9-12, 2007. EuMW at Booth 912 www.appwave.com www.axiem3d.com ISOLATORS Isolatorors and Circulators Tetra, GSM or UMTS high Power-Isolators Microwave-Isolators AIR CAVITY 300 MHz – 4 GHz ceramic load ed also available Microwave Engineering ● October 2007 ● www.mwee.com 2PUNKT_EINE WERBEAGENTUR WWW.2PUNKT.DE 052-053_MWEE.indd 53 21/09/07 14:39:43 7010014 Figure 3: High-frequency spiral inductor: current ﬂow for thick metal spiral at 20 GHz. CompoTRON United Kingdom +44 (0) 17 93/60 24 40 Germany +49 (0) 89/53 88 66 -0 www.compotron.com sales@compotron.com http://www.compotron.com http://www.axiem3d.com http://www.appwave.com http://www.axiem3d.com http://www.compotron.com http://www.mwee.com http://WWW.2PUNKT.DE

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Microwave Engineering Europe - October 2007 Contents Comment News CMOS RF: Si-On-Sapphire Goes Mainstream Cover Feature: New Data Protection Concept for UHF RFID Tags CMOS RF: RF Design Team Touts CMOS Spin for 3G PAs Wireless HID – Are You Following the Standard to Another “Average” Product Development? Phase Optimisation of the RF Front-End Direct Synthesis of UWB-WiMedia Signal Generation 4G Chips to Target 700 MHz Applications Femtocells Mobilize to Fight Wi-Fi in the Home Products Product Feature: AXIEM Pioneers the Future of EM Technology Calendar

Microwave Engineering Europe - October 2007

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