Microwave Engineering Europe - October 2007 - (Page 7)

CONTENTS 7 9 10 14 COVER Comment News CMOS RF: Si-on-sapphire goes mainstream Silicon-on-sapphire (SOS) as for years been recognized as a technically superior semiconductor vehicle and the ultimate form of SOI, offering silicon on a perfect isolator with no parasitic capacitance at high-frequency operation. It is ideal for high perfprmance CMOS RF applications and earlier issues with price, yield, availability and processes are being steadilyt resolved. SOS is ready for the mainstream. Cover Feature: New data protection concept for UHF RFID tags The very nature of RFID technology, where data is transmitted over the air, makes it susceptible to attacks. Atmel have come up with an advanced UHF RFID tag technology that implements a host of security features. Not only is the implementation ﬂexible, depending on the application, but it exceeds EPC requirements. CMOS RF: RF design team touts CMOS spin for 3G PAs Is it possible to make a low-cost CMOS power amp for 3G cell phones that can operate with the power efﬁciency and robustness of a gallium-arsenide PA? Acco Semiconductor (Saint Germain en Laye, France) believes it has found a way. Wireless HID – are you following the standard to another “average” product development? Phase optimisation of the RF front-end Direct synthesis of UWB-WiMedia signal generation 4G chips to target 700 MHz applications Femtocells mobilize to ﬁght Wi-Fi in the home Products Product Feature: AXIEM pioneers the future of EM technologyCalendar The cover represents the advances Atmel has made in developing innovative, high security UHF RFID tag technology. The company's UHF RFID tags address both memory/data intensive and securityorientated applications. EDITORIAL DIRECTOR JEAN-PIERRE JOOSTING Tel. +32 2 7400056 email: jean-pierre.joosting@eetimes.be CONTRIBUTING EDITORS COLIN HOLLAND email: colin.holland@btinternet.com JOHN WALKO email: jwalko@cmp.com EDITORIAL ADVISORY BOARD Tom Brazil, University College Dublin, Ireland Marco Lisi, Telespazio, Italy Holger Meinel, DaimlerChrysler Aerospace AG, Germany Marco Guglielmi, ESTEC, The Netherlands Chris Snowden, Filtronic Compound Semiconductor/ University of Leeds, UK. 18 ADVERTISING PRODUCTION LYDIA GIJSEGOM - MAGGIE FLEERACKERS Tel +32 (0) 2 740 00 50 email: lydia.gijsegom@eetimes.be CIRCULATION & FINANCE LUC DESIMPEL Tel +32 (0) 2 740 0055 email: luc.desimpel@eetimes.be ART MANAGER JEAN-PAUL SPELIERS Tel +32 (0)2 740 0052 email: jean-paul.speliers@eetimes.be ACCOUNTING RICARDO PINTO FERREIRA Tel +32 (0)2 740 0051 email: sonia.stouti@eetimes.be VP SALES PATRICK FLYNN Tel +44 (0)1732 377186 email: pﬂynn@cmp.com PUBLISHER ANDRE ROUSSELOT Tel +32 (0)2 740 0053 email: aroussel@cmp.com EUROPEAN BUSINESS PRESS A CMP COMPANY 144 Avenue Eugène Plasky 1030 Brussels - Belgium Tel: +32 (0)2 740 00 50 Fax: +32 (0)2 740 00 59 www.mwee.com VAT Registration: BE 461.357.437 RPM: Brussels Company Number: 0461357437 © 2007 E.B.P. SA, a CMP Company All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, recording or any information storage or retrieval system without the express prior written consent of the publisher. The contents of Microwave Engineering Europe are subject to reproduction in information storage and retrieval systems. Microwave Engineering Europe is published ten times a year. Apply for a free copy of the journal online at www.mwee. com/subscribe/ Subscriptions: Microwave Engineering Europe is available on subscription to others at 150 Euro. Refunds on cancelled subscriptions will only be provided at the Publisher’s discretion, unless speciﬁcally guaranteed within the terms of the subscription offer. Paid subscription queries tel: +32 2 740 00 50 Printed by Perka. 22 24 26 34 46 48 51 52 65 • • • • • Microwave Engineering Europe ● October 2007 ● www.mwee.com 007_MWEE.indd 7 21/09/07 16:38:44 http://www.mwee.com http://www.mwee.com/subscribe/ http://www.mwee.com

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Microwave Engineering Europe - October 2007 Contents Comment News CMOS RF: Si-On-Sapphire Goes Mainstream Cover Feature: New Data Protection Concept for UHF RFID Tags CMOS RF: RF Design Team Touts CMOS Spin for 3G PAs Wireless HID – Are You Following the Standard to Another “Average” Product Development? Phase Optimisation of the RF Front-End Direct Synthesis of UWB-WiMedia Signal Generation 4G Chips to Target 700 MHz Applications Femtocells Mobilize to Fight Wi-Fi in the Home Products Product Feature: AXIEM Pioneers the Future of EM Technology Calendar

Microwave Engineering Europe - October 2007

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