Microwave Engineering Europe - October 2008 - (Page 35)

RF ATE 35 with degraded insertion loss. In contrast, UltraCMOS technology is composed of a stack of FETs manufactured on a perfectly insulating sapphire substrate, providing the ability to pass high-power RF signals. CMOS: a matter of control Having a CMOS interface on a device makes it much easier for any designer to use, and this is true for test and measurement as well. Normally a system’s logic function is implemented in CMOS, so, if the switch is manufactured using a CMOS process, then the chip manufacturer can easily include logic on chip. The PE42552 SPDT switch, for instance, was designed with integrated CMOS control logic that is driven by a single-pin, lowvoltage CMOS control input. Another way to improve switch functionality is to enable a user-deﬁned logic table. An UltraCMOS switch, for example, includes a logic-select pin that inverts logic polarity for back-to-back switching applications, effectively changing the logic deﬁnition of the control pin. As test and measurement manufacturers gear up for Long-Term-Evolution (LTE) mobile phones, mobile WiMAX, and, perhaps, a converged version of the two, the performance of their test equipment will be stretched to the maximum. Fortunately, they can offer the broadband, repeatable, accurate performance that their customers are demanding because UltraCMOS technology was commercialized years ago, is in high-volume production, and parts are being custom tailored for the ATE marketplace. In the end, today’s RF test instrumentation must make extremely accurate and repeatable measurements, the good news is that test and measurement suppliers have access to the devices that will allow them to meet their targets. References [1] Baker, Ray. “CMOS-based Digital Step Attenuator Designs,” Wireless Design & Development Magazine, May 2004. http:// www.psemi.com/articles/2004/2004_ar_5.pdf Figure 6: The 42552 is a broadband switch with a typical insertion loss of <1 dB at 7.5 GHz which is nearly 50 percent lower than comparable GaAs switches. Register online and enjoy the beneﬁts: www.electronica.de/ticket discover more details mems.structures.sensors.oleds.accelerometers.nanowires. get the whole picture electronica micronano-systems at the world’s leading trade fair for key future technologies. Discover tomorrow’s most important topics and trends today. Expand your knowledge and make valuable contacts in all of the important sectors and at all levels of the microelectronics industry. www.electronica.de/micronano. Be sure to visit the concurrent trade fair www.hybridica.de electronica 2008 micronano-systems 23rd world’s leading trade fair New Munich Trade Fair Centre November 11–14, 2008 e08_MiEnEu210x140_micna_E.indd 2 Microwave Engineering ● October 2008 ● 02.07.2008 10:19:31 Uhr www.mwee.com 032-035_MWEE.indd 35 2/10/08 13:45:20 http://www.psemi.com/articles/2004/2004_ar_5.pdf http://www.psemi.com/articles/2004/2004_ar_5.pdf http://www.electronica.de/ticket http://www.electronica.de/micronano http://www.electronica.de/micronano http://www.hybridica.de http://www.mwee.com

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Microwave Engineering Europe - October 2008 Contents Comment News Cover Feature: AWR's AXIEM Software Brings 3D Planar Electromagnetic (EM) Simulation "Up Front" RFID: Augmented Reality: Beyond RFID and QR Codes for Mobile Phone Platforms Filters & Frequency Synthesis ZigBee Goes Green with Support for Smart Energy Simplify Mobile Data Applications and Services Test Enabling the State-of-the-Art in Automatic Test Equipment National Physical Laboratory Test Facility Aids Development of Next-Generation Antennas Selecting the Synthetic Test Environment for Transmit-Receive (T-R) Modules in a Phased Array Radar System Products Calendar

Microwave Engineering Europe - October 2008

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