Microwave Engineering Europe - October 2008 - (Page 56)

56 PRODUCTS Demodulator/digital IF processor fully integrated, reduces component count Fresco Microchip has introduced its FM1100 family of worldwide legacy audio/ video demodulator and multistandard digital IF processor solutions for television broadcast reception. The low-power FM1100 devices enable the convergence of hybrid terrestrial and cable television broadcast reception globally. The first member of the product family is the FM1150, which is encapsulated in a 40-pin. 5- x 5-mm QFN package. The FM1100 family leverages Fresco Microchip’s agileSP architecture that includes four key technologies — WAVe, iSAW, perfectTUNE, and smartTUNE, which enhance consumer TV viewing experience across a broad spectrum of platforms, and enable manufacturers to deliver better quality products with a reduced manufacturing cost, according to the company. Worldwide legacy audio/ video demodulation (WAVe) converts standard or nonstandard NTSC/PAL/SECAM to high fidelity CVBS and SIF. Fresco’s iSAW wideband IF processing simplifies CAN tuners by eliminating the need for dozens of passive components, external IF SAW filters and variable-gain amplifiers. The FM1100 is said to provide the industry’s best adjacent channel rejection for digital IF signals (ATSC, J.83B QAM, DVB-C/T or DMBT/H). www.mwee.com/210700030 X-Band high power amplifiers cover the full X-band in three parts StratEdge is offering packaged high power amplifier MMICs for 8 to 12 GHz (X-Band) applications that cover the full X-Band range in three separate bands. Part number 560134, which is for 9 to 10.5 GHz applications, provides 37 dBm output power and 40 percent power added efficiency (PAE) for bias of 7V, 1.4 A. The typical gain is 18 dB. The other members of the family are part number 560141 for 7 to 8.5 GHz and 560142 for 10.5 to 12 GHz. The company’s SMX 580448 ceramic surface mount package is used to package all of the devices. The SMX 580448 is a surface mount package with excellent thermal properties. It provides good electrical transition performance for die in the X-Band range. The package has a copper composite base that enhances thermal dissipation. Though sealed with epoxy and a liquid crystal polymer lid, it will pass fine and gross leak hermeticity testing per MIL-STD-883. The assembly process, including eutectic and epoxy component attach, gold wire bonding, lid seal, lead trim, electrical test, labeling, and delivery preparation. www.mwee.com/210700060 Microwave Engineering Europe Upcoming features and article focus November 2008: MMICs MEMS/Nanotech December 2008: EM Modelling Microwave Materials Jan/Feb 2009: 4G Technologies Test & Measurement March 2009: Wireless Infrastructure Radio (and SDR) April 2009: Antennas MMICs/RFICs Microwave Engineering Europe ● October 2008 ● www.mwee.com 056_MWEE.indd 56 6/10/08 11:55:15 http://www.mwee.com/210700030 http://www.mwee.com/210700060 http://www.filter-solutions.com http://www.filter-solutions.com http://www.mwee.com

Table of Contents Feed for the Digital Edition of Microwave Engineering Europe - October 2008

Microwave Engineering Europe - October 2008 Contents Comment News Cover Feature: AWR's AXIEM Software Brings 3D Planar Electromagnetic (EM) Simulation "Up Front" RFID: Augmented Reality: Beyond RFID and QR Codes for Mobile Phone Platforms Filters & Frequency Synthesis ZigBee Goes Green with Support for Smart Energy Simplify Mobile Data Applications and Services Test Enabling the State-of-the-Art in Automatic Test Equipment National Physical Laboratory Test Facility Aids Development of Next-Generation Antennas Selecting the Synthetic Test Environment for Transmit-Receive (T-R) Modules in a Phased Array Radar System Products Calendar

Microwave Engineering Europe - October 2008

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