Microwave Engineering Europe - December 2007 - (Page 39) PRODUCTS 39 High performance lightweight cables target military airborne applications Tyco Electronics has extended the M/A-COM family of highperformance, lightweight cables to include five new cable types covering a variety of outer diameter sizes and constructions. The M/A-COM FA20RXLW, FA29RXLW, FA46RXLW, FN49RXLW and FN52RLLW augment the company’s successful FN34RXLW cable line and are ideally suited for use in electronic defense, launch vehicles, commercial aviation, space/satellites and other general purpose military applications. The latest cables offer a 25 to 31 percent weight savings over traditional construction with no change in VSWR or insertion loss. The assemblies can also withstand the same harsh environments as M/ACOM traditional assemblies, Integrated DVB-T/H transmitter cuts costs based on air-cooled LDMOS amplifier technology Unique Broadband Systems (UBS) has released UBwaveTXi, a new low cost DVB-T/H UHF transmitter. This compact 19” 3RU model includes a DVB-T/H modulator, up-converter and 120 W output power. The use of compact high performance air cooled LDMOS amplifier technology simplifies deployment and further reduces maintenance resource requirements. UBwaveTXi can be configured to operate in MFN or SFN applications on DVB-T, DVB-H or DVBT/H hierarchical mode broadcasts. It is ideally suited as a compact repeater platform. The included UBS Web GUI and SNMP software management and control interfaces enable remote control and monitoring. For networks supported by satellite content distribution, an optional DVB-S/S2 receiver/demodulator module is available for even greater repeater integration. www.mwee.com/202802382 including altitudes from ground-level to more than 70,000 feet and temperatures from -55 °C to +200 °C. Complementing the lighter cables, all assemblies feature reduced weight and volume connectors which retain conventional ETNC, SMA and N interfaces while incorporating new materials. The assemblies are also available in various outer diameters and numerous jacket materials. www.mwee.com/202803711 Femtocell supports WiMAX Wave 2 and full IO-MIMO in both downlink and uplink The PC6532 from picoChip is a single-chip (PHY + MAC) reference design that supports WiMAX Wave 2 and full IOMIMO in both downlink and uplink. Like its predecessor, the Wave 1 PC6530, the reference design integrates full PHY and MAC into a single picoArraybased PC205 processor. The PC6532 offers a low cost solution for a complete WiMAX Wave 2 femtocell, with seamless software upgrade for existing picoChip PC6530 Wave 1 designs. It supports Wave 2 and full IO-MIMO, with Matrix A and Matrix B downlink, and both MRC and UL-CSM uplink. Wave 2 is the latest version of the WiMAX standard, adding increased support for mobility, while MIMO (Multi Input Multi Output) increases data-rate and reliability by simultaneously sending and receiving data via multiple antennas. The PC6530 Wave 1 WiMAX reference design is available now and has already passed IOT testing. The seamless software upgrade to the PC6532 Wave 2 WiMAX femtocell reference design will be available in Q2 2008. www.mwee.com/203102909 500 W UHF transistor for long pulsed radar applications Microsemi Corporation has announced a state-of-the-art high power transistor for UHF long pulsed radar applications, designated 0405-500L. A high duty cycle 500 W device, this bipolar transistor is designed for UHF frequencies between 400 and 450 MHz. A common emitter, class C power transistor, it delivers 500 W of peak power, 50 percent collector efficiency and is in a hermetically sealed package for the best reliability for long pulsed radar and over the horizon radar applications. www.mwee.com/204201582 Bluetooth headset single-chip solution adds noise cancellation Broadcom’s BCM2044S Bluetooth headset solution delivers noise and echo suppression without expensive flash memory DSP components. The single-chip device leverages a ROM-based architecture to implement its unique SmartAudio noise and echo reduction algorithms that enhance audio quality without adding components. The ROM-based architecture can reduce bill of materials (BOM) cost by 40 percent, enabling OEMs to offer highend audio capabilities at the same cost as basic headsets. The BCM2044S is footprint-compatible with the predecessor Broadcom BCM2044, enabling OEM customers to cost effectively offer multi-tiered product lines based on a common hardware platform. SmartAudio technology intelligently analyzes digital audio streams within the Bluetooth headset, differentiating between voice and non-voice characteristics while eliminating background noise to deliver a clearer voice conversation. It also automatically increases the volume on the headset when the user walks into a noisy environment. The BCM92044 reference design provides headset OEMs with a greatly reduced 2-layer printed circuit board (PCB), versus alternative solutions that require PCBs with four or six layers. www.mwee.com/204201622 Microwave Engineering ● December 2007 ● www.mwee.com 039_MWEE.indd 39 23/11/07 12:25:47 http://www.mwee.com/202802382 http://www.mwee.com/202803711 http://www.mwee.com/204201582 http://www.mwee.com/203102909 http://www.mwee.com/204201622 http://www.mwee.com
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