Microwave Engineering Europe - December 2007 - (Page 41) PRODUCT FOCUS — EDA 41 Figure 3: 3-D viewer with Z-axis scaling enables verification of layout and package. layers, accurate tracking with the associated schematic diagram, placement, and accurate modeling of bond wires and options for viewing the layout beyond a two-dimensional representation. Completed designs then need to be exported for manufacturing while maintaining the integrity of the design. Advanced Design System 2008 offers several new features that address these requirements: • When entering trace interconnects, layers are easily changed through keyboard hotkeys, and ADS inserts a pre-designed via to complete the connection across layers. • The layout and schematic can be automatically synchronized at all times, but ADS 2008 also provides for full control to guarantee the correct layout. • Design Rule Checking (DRC) provides a global view of all errors but also makes it easy to identify individual problems and zoom in on those components that are in violation. ADS 2008 includes a new DRC viewer that meets these requirements. • JEDEC-compliant bond wires may be entered directly into the layout, and are suitable for 3-Dimensional electromagnetic simulation using the built-in Electromagnetic Design System (EMDS). • A 3-D viewer with Z-axis stretching and adjustable cut-planes enables easy verification of correct placement of all structures (Figure 3). • Artwork translation, such as DXF import/ export or Gerber export with drill file has been improved with a better user interface, saving of configuration options and the option to flatten the hierarchy on DXF import to avoid creating large numbers of un-needed sub-networks. A new preproduction editor assists in checking for correct export prior to sending an exported file for fabrication. In addition to offering high productivity, the EDA environment must also provide access to help and assistance when required. In ADS 2008, a new window appears that provides project management functions and hyperlinks to information including new how-to videos, global searches of the product documentation and Agilent EEsof EDA Knowledge Center, a source of examples, users forums and more for supported customers. Agilent EEsof EDA is known for providing the widest range of simulation technologies available. In 2007, this range expanded to include electromagnetic (EM) simulation, offering 3-D planar EM with Momentum, and full 3-D analysis for structures using FiniteElement (FEM) analysis with EMDS. Both Momentum and EMDS are fully-integrated into ADS, and can simulate directly from the ADS layout window. ADS 2008 continues to expand the EM and circuit simulation applications by offering significant improvements to simulation capacity, flexibility, speed and compatibility. For example, Momentum now detects the presence of multiple cores in the workstation or compute node and uses them for the matrix load operation. This can speed up a simulation of a complex structure by more than 2X. (Figure 4) Many simulations, particularly those required for Signal Integrity, generate very large sets of output data. Previous barriers to such large datasets, such as the memory limitations of 32-bit operating systems have been overcome. Large designs are now commonplace and productive use of designers’ time requires continuing improvements to circuit simulation speed. Circuit simulations may involve several combined simulation domains. For example, Transient and Harmonic Balance simulations begin with DC simulation. Advanced Design System 2008 delivers speed-ups to DC, AC, and Transient simulation. Transient simulation speed-ups average 6X for large designs containing over 10,000 nodes. Besides simulation speed improvements, today’s mixed-technology designs require interoperability with models drawn from many different sources. In the Signal Integrity design space, ADS 2008 builds upon many SI-related functions introduced during the past year, such as a unique Transient Convolution simulator that guarantees correct time-domain results using easy-to-obtain S-parameter measurements. In addition to simulating IBIS and SERDES components, the W-element, integrated StatEye for fast Bit Error Rate (BER), HSPICE® networks may now be directly simulated. For general circuit design, the ability to optimize across multiple performance goals and design variables is critical to first-pass success. In the past, some circuits, such as those with both a broad-band response and narrow-band resonances pose particular difficulties for traditional optimizers such as random and gradient types. An algorithm known as simulated annealing very capably optimizes such difficult problems and is included with Advanced Design System 2008. Conclusion Agilent Technologies’ Advanced Design System 2008 contains significant new enhancements for high-frequency design, improving the productivity of all designers. Several planned update releases this year will provide further productivity and simulation enhancements. For more information about Advanced Design System 2008, visit www.agilent.com/ find/eesof-ads-product-2008-new. To request a demo, visit www.agilent.com/find/eesofads2008-demo. Figure 4: Momentum multi-threaded matrix load speeds simulation on multi-core workstations. Microwave Engineering ● December 2007 ● www.mwee.com 040_041_MWEE.indd 41 22/11/07 11:35:21 http://www.agilent.com/ http://www.agilent.com/find/eesof-ads-product-2008-new http://www.agilent.com/find/eesof-ads-product-2008-new http://www.agilent.com/find/eesof-ads2008-demo http://www.agilent.com/find/eesof-ads2008-demo http://www.mwee.com
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