Conformity Magazine - March 2009 - (Page 37) Traditional antistatic agents are mainly based on highly conductive materials or surface active solutions. The question is, does the industry get its best return on its efforts to resolve ESD, or could certain circumstances allow these protective solutions to become sources for ESD problems themselves? Origins of ESD Damage ESD damage may be originated by either a catastrophic failure or a latent defect. Catastrophic Failure When an ESD event impacts an electronic device, it may have caused a metal melt, junction breakdown, or oxide failure. The device’s circuitry is permanently damaged, causing the device to fail. Such failures usually can be detected when the device is tested. While the failed device will probably not reach the customer, damage to electronic components nevertheless results in higher manufacturing costs. Latent Defect A latent defect is harder to detect. A device that is exposed to an ESD event may be partially degraded, yet continue to perform its intended function. However, the operating life of the device may be reduced dramatically. Warranty support when a product fails can impact a company’s profits significantly. Such failures are usually costly to repair and the loss of customer satisfaction cannot be recovered. Understanding the Discharge Phenomena ESD events occur when triboelectric or induced charges build up in an object and then discharge instantaneously and uncontrollably on contact with the electronic part. All ESD solutions attempt to bleed off the static charge before damage occurs. There are many types of antistatic solutions utilized within floors, clothing, furniture, machine equipment, etc. But the last and closest line of defense against ESD events is the packaging surrounding the electronic part itself. Neat plastics are prone to uncontrolled charge and discharge. The amount of accumulated charges, strength of the discharged current, and decay time of the discharge event are out of the hands of the user. ESD damage of electronic parts can happen every time a product is used. Examples of ESD problems include the following: • In a wafer fabrication plant, workers walking through a clean room curtain can generate a charge that could discharge and damage a wafer;. • When wafers are transferred from one cassette to another, a charge can be created on both the wafers and the cassette. • An integrated circuit can generate a charge when it slides out of a package tube, and then discharge when it approaches the workbench surface. Need a Bright Idea? Don’t waste another day stressing about how to get to the next level. Advanced Test Equipment offers highly specialized test solutions from top manufacturers to fit your business needs and help achieve new benchmarks of performance. If you are ready to break through the barriers you’ve been contending with, we can help. Contact us today and maintain the flexibility you need to succeed. Rent Your Test Equipment! For further information, contact us online at www.atecorp.com/brightidea or call us at 1-800-404-ATEC to see how we can help. Reference “Conformity” when you call. Test With The Best. The Knowledge. The Equipment.The Solution. ® Advanced Test Equipment ® ©2009 Advanced Test Equipment Corp. All rights reserved. 1005, Rev. 1/09. http://www.atecorp.com/brightidea http://www.atecorp.com/brightidea
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