Conformity Magazine- May 2008 - (Page 67) NewsBreaks • IEC 60384-20 Ed. 2.0 (2008-02) Corrigendum 1 - Fixed capacitors for use in electronic equipment - Part 20: Sectional specification - Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors • IEC 60384-20-1 Ed. 2.0 (2008-01) Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification - Fixed metallized polyethylene sulfide film dielectric surface mount d.c. capacitors Assessment level EZ • IEC 60384-20-1 Ed. 2.0 (2008-02) Corrigendum 1 - Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ • IEC 60539-1 Ed. 2.0 (2008-02) Directly heated negative temperature coefficient thermistors - Part 1: Generic specification • IEC 60603-7-3 Ed. 1.0 (2008-01) Connectors for electronic equipment - Part 7-3: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz • IEC 60738-1-1 Ed. 3.0 (200802) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ • IEC 60738-1-2 Ed. 2.0 (200802) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ • IEC 60738-1-3 Ed. 2.0 (200802) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ • IEC 60738-1-4 Ed. 2.0 (200802) Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application Assessment level EZ • IEC 60747-16-2 Ed. 1.1 (2008-01) Semiconductor devices - Part 16-2: Microwave integrated circuits Frequency prescalers • IEC 60749-37 Ed. 1.0 (2008-01) Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer • IEC 60749-38 Ed. 1.0 (2008-02) Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory • IEC 61249-4-1 Ed. 1.0 (2008-01) Materials for printed boards and other interconnecting structures Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability Fiber Optic Communications • IEC 61300-2-15 Ed. 2.0 (2008-02) Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-15: Tests - Torque strength of coupling mechanism Household • IEC 60335-2-36 Amd.2 Ed. 5.0 (2008-02) Amendment 2 Household and similar electrical appliances - Safety - Part 236: Particular requirements for commercial electric cooking ranges, ovens, hobs and hob elements Product Reviews RF Shielding Systems Offer User Flexibility ETS-Lindgren offers a variety of modular panel RF shielding systems to meet customer usage, budget and performance needs. Series 71, Series 81 and Series 101 are the most popular systems with thousands of time-tested installations worldwide. Commonly met performance standards include NSA 65-6, MIL-STD-285 and IEEE 299, among others. Modular construction simplifies relocation and facilitates modifications to the original chamber size. All systems include a wide selection of doors, filters, and other accessories for a turnkey shielding system. ETS-Lindgren Tel: (512) 531-6400 info@ets-lindgren.com www.ets-lindgren.com mAy 2008 Conformity 7 © Radu Razvan | Dreamstime.com http://www.ets-lindgren.com http://Dreamstime.com
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