Conformity Magazine - August 2008 - (Page 22)

ESD Open Forum Transmission Line Pulse (TLP) and Very Fast Transmission Line Pulse (VF-TLP) Standard Development Provided by the ESD Association The ESD Association just released the standard test method (STM) ANSI/ESD STM5.5.1-2008, ESD Association Standard Test Method for the Protection of Electrostatic Discharge Susceptible Items – Electrostatic Discharge Sensitivity Testing – Transmission Line Pulse (TLP) – Component Level, which is a revision of the standard practice (SP) ANSI/ESD SP5.5.1-2004. Round robin testing of TLP was completed in 2007. This document provides the guidance for the TLP waveform specification, test system and testing methodology. This methodology uses a 100 ns pulse width for evaluation of components. The ESD Association has also just released ANSI/ ESD SP5.5.2-2007, ESD Association Standard Practice for Electrostatic Discharge Sensitivity Testing – Very Fast Transmission Line Pulse (VF-TLP) – Component Level. This document is the very fast transmission line pulse (VF-TLP) standard practice (SP) for the VF-TLP testing of semiconductor components. It provides the guidance for the VF-TLP waveform specification, test system and testing methodology for this short pulse testing methodology. The VF-TLP testing method uses a shorter pulse width in the range of 1 to 10 nanoseconds. Round robin testing of VF-TLP is in progress in 2008, with an anticipated release of a standard test method (STM) in early 2009. Today, results demonstrate no roadblocks to the methodology; hence, it is anticipated that the standard test method will be released soon. Q: A: What about the very fast transmission line pulse (VF-TLP) standard practice (SP) methodology? TLP testing provides the ability to understand semiconductor devices, circuits and chips response to high current pulse testing. One of the reasons TLP testing is popular is that it provides the actual current and voltage across the device under test (DUT). A pulsed TLP I-V characteristic is provided, which allows visualization of the semiconductor device response. A second reason is that testing can be completed “on wafer” or on product chips. With this capability, it can be used for semiconductor development, product design, to failure analysis. Q: A: Q: A: Why are engineers interested in TLP and VFTLP testing? Are there both TLP and VF-TLP commercial test systems? Today, there are both TLP and VF-TLP test systems that exist internationally. These TLP systems provide wafer level or product level testing. 22 Conformity AUGUSt 2008 © Jacus | Dreamstime.com Q: A: I am interested in what is new in the area of transmission line pulse (TLP) testing. Is there a standard practice today? http://Dreamstime.co

Table of Contents Feed for the Digital Edition of Conformity Magazine - August 2008

Conformity Magazine - August 2008 Contents Editor’s Note FCC Seeks Comment on Reauction of 700 MHz D Block Commission Cracks Down (Again!) on Junk Fax Marketer Canada Levies Fees for Public Safety Radio Spectrum FDA Issues Guidance on Medical Device Tracking Greenpeace Challenges Video Game Manufacturers The IEEE EMC Society: A Proud History of Accomplishments ESD Open Forum An Update on Changes to the Automotive ESD Standard, ISO 10605 Modeling of Radiated Electromagnetic Disturbances in Automotive Applications Design Issues in Automotive Radio Frequency Systems IEEE EMC Symposium IEEE 2008 Show Preview Exhibitors Buyer’s Guide Product News Most Eco-Friendly Companies Updated Standards List For the EU’s Pressure Equipment Directive Commission Issues Updated Standards List For Directive on Gas-Fired Appliances HHS Releases Fact Sheet on U.S. Imports from China Customs Agents Seize Holiday Lights IEEE PSES Symposium Set for October CPSC Actions in the News IEC Standards Update UL Standards Update Telcordia Standards Update From Our “You Can’t Make This Stuff Up” Department Looking Back: Items from Past Issues of Conformity Product Reviews Advertisers

Conformity Magazine - August 2008

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