Conformity Magazine - August 2008 - (Page 23)

ESD Open Forum Very fast transmission line pulse (VF-TLP) is a new test method for faster rise times and shorter pulse widths. The VF-TLP test method requires a rise time less than 1 ns, and short pulse width between 1 and 10 ns. The TLP standard test method is a 100 ns pulse width. By combining TLP and VF-TLP methods, the power to failure of components can be quantified. Today, the VF-TLP Standard Practice (SP) document has been released from the ESD Association, and round robin testing is still in process to demonstrate this as a standard test method. Q: A: Q: A: Q: A: Q: A: What is the difference between TLP and very fast TLP (VF-TLP)? Who is interested in VF-TLP testing, and why? Today, there is already research at Stanford University by T.W. Chen on ultra-fast transmission line pulse (UF-TLP) methods. These pulses help evaluate the dynamic response of materials when undergoing pulses in the range of 20 to 50 ps; this has value for understanding of the power to failure of components in the 40 to 50 GHz application regime. An UF-TLP test system has been utilized to understand soft- and hard breakdown of dielectrics, and is already being applied to the tunneling magneto-resistor heads (TMR) for the magnetic recording industry (to be published in the EOS/ESD Symposium in 2008). About the Author This article was prepared on behalf of the ESD Association by Dr. Steven H. Voldman. Dr. Voldman is the first IEEE Fellow in the field of Electrostatic Discharge (ESD) in semiconductor devices for “Contributions in electrostatic discharge (ESD) protection in CMOS, Silicon on Insulator (SOI) and Silicon Germanium (SiGe) Technology.” He received the ESD Association Outstanding Contribution Award in 2007. He has served as Chairman of the SEMATECH ESD Committee from 1995 to 2000, ESD Association Board of Directors from 2000 to 2007, and Appointed Board Member 2007–2008. He has served as Technical Program Chair, Vice Chair and Chairman of the ESD Symposium from 2000 to 2002 and once again in 2008 and 2009. Dr. Voldman is currently Chairman of the ESD Device Testing 5.5 Standards Committee on Transmission Line Pulse (TLP) and Very Fast Transmission Line Pulse (VF-TLP) Testing. He can be reached at 802-7698368 and at voldman@ieee.org About the ESDA Founded in 1982, the ESDA is a not-for-profit, professional organization directed by volunteers dedicated to furthering the technology and understanding of electrostatic discharge. The Association sponsors education programs, develops ESD standards, holds an annual technical symposium, and fosters the exchange of technical information among its members and others. Additional information may be obtained by contacting the ESD Association, 7900 Turin Rd., Bldg. 3, Rome, NY 13440-2069, USA. Phone: 315-339-6937. Fax: 315-339-6793. Email: info@esda.org. Website: www.esda.org. Q: A: What else is ahead of us for future device testing? VF-TLP testing provides the current-to-failure and power-to-failure for fast rise-time events and short pulses. Today, this is relevant to quantify pulse events in the GHz time regime; hence, this can be used to quantify noise and pulse events on products, to test systems. With fast events there is also interest for radio frequency (RF) components. Technologists are also studying dielectric breakdown of ultra-thin oxide to quantify the response of fast, high-current events on dielectrics. What advantage is there to doing both TLP and VF-TLP testing? First, TLP testing is “HBM-like” in its total energy for a 100 ns square pulse. Hence, TLP testing provides a sense for the anticipated HBM testing results. VF-TLP represents the response to fast pulse testing. By doing both TLP and VF-TLP testing, one will have the power-to-failure for both fast and slow phenomena. This is useful for development of a power-to-failure characteristic for the semiconductor device, circuit, chip or system. What is the next task of this standards work body? In the future I believe we will be focusing on the transient response of the semiconductor device during the rising edge of the VF-TLP pulse. In this region, the device is not in a quasi-static regime, but a transient state leading to different I-V response. AUGUSt 2008 Conformity 23 http://www.esda.org

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Conformity Magazine - August 2008 Contents Editor’s Note FCC Seeks Comment on Reauction of 700 MHz D Block Commission Cracks Down (Again!) on Junk Fax Marketer Canada Levies Fees for Public Safety Radio Spectrum FDA Issues Guidance on Medical Device Tracking Greenpeace Challenges Video Game Manufacturers The IEEE EMC Society: A Proud History of Accomplishments ESD Open Forum An Update on Changes to the Automotive ESD Standard, ISO 10605 Modeling of Radiated Electromagnetic Disturbances in Automotive Applications Design Issues in Automotive Radio Frequency Systems IEEE EMC Symposium IEEE 2008 Show Preview Exhibitors Buyer’s Guide Product News Most Eco-Friendly Companies Updated Standards List For the EU’s Pressure Equipment Directive Commission Issues Updated Standards List For Directive on Gas-Fired Appliances HHS Releases Fact Sheet on U.S. Imports from China Customs Agents Seize Holiday Lights IEEE PSES Symposium Set for October CPSC Actions in the News IEC Standards Update UL Standards Update Telcordia Standards Update From Our “You Can’t Make This Stuff Up” Department Looking Back: Items from Past Issues of Conformity Product Reviews Advertisers

Conformity Magazine - August 2008

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