Conformity Magazine - October 2007 - (Page 22)

ESD Open Forum Transmission Line Pulse (TLP) Standard Development Provided by the ESD Association Q: A: I am interested in Transmission Line Pulse (TLP) testing. Is there a standard practice today? Today the ESD Association has a document for the TLP testing of semiconductor components. The document is ESDA DSP5.5.1 Standard Practice for Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (TLP) Component Level. The document provides the guidance for the TLP waveform specification, test system and testing methodology. Today, round robin testing of TLP has been completed, and a true Standard Test Method (STM) will be released for the semiconductor industry in 2007. Q: A: Why are engineers interested in TLP testing? practice document on VF-TLP. The VF-TLP test method requires a rise time less than 1 ns, and short pulse width between 1 and 10 ns. TLP testing standard practice method is a 100 ns pulse width. Today, the VF-TLP Standard Practice (SP) document is ready for release from the ESD Association, and round robin testing is in process to demonstrate this as a standard test method. TLP testing provides the ability to understand semiconductor devices, circuits and chips response to high current pulse testing. One of the reasons TLP testing is popular is that it provides the actual current and voltage across the device under test (DUT). A pulsed TLP I-V characteristic is provided which allows visualization of the semiconductor device response. A second reason is that testing can be completed “on wafer” or on product chips. With this capability, it can be used for semiconductor development, product design, to failure analysis. Q: A: Who is interested in VF-TLP testing, and why? Q: A: Q: A: 22 Are there TLP commercial test systems? VF-TLP testing provides the current-to-failure and power-to-failure for fast rise time events and short pulses. Today, this is relevant to quantify pulse events in the GHz time regime; hence, this can be used to quantify noise, and pulse events on products, to test systems. With fast events there is also interest for radio frequency (RF) components. Technologists are also studying dielectric breakdown of ultrathin oxide to quantify the response of fast high current events on dielectrics. Today there are TLP test systems internationally. Corporations that sell TLP test systems exist in the U.S., Europe, and Asia. These TLP systems provide wafer level or product level testing. What is the difference between TLP and Very Fast TLP (VF-TLP)? Q: A: What advantage is there to doing both TLP and VFTLP testing? Very fast transmission line pulse (VF-TLP) is a new test method for faster rise times and shorter pulse widths. The ESD Association will be releasing a new standard CONFORMITY OCTOBER 2007 First, TLP testing is “HBM-like” in its total energy for a 100 ns square pulse. Hence, TLP testing provides a sense for the anticipated HBM testing results. VF-TLP represents the response to fast pulse testing. By doing both TLP and VF-TLP testing, one will have the power-tofailure for both fast and slow phenomena. This is useful for development of a power-to-failure characteristic for the semiconductor device, circuit, chip or system. © Photographer: Bryan Busovicki | Agency: Dreamstime.com http://Dreamstime.com

Table of Contents Feed for the Digital Edition of Conformity Magazine - October 2007

Contents Editor’s Note Commission Proposes Changes for 57-64 GHz Spectrum Rules FCC Continues Actions Against Jamming Device Distributors Radio Operator Fined for Failing to Make Equipment Available for Inspection Commission Fines Unsolicited Fax Advertisers Firm Offering Quality Standards Training Also Fined Breaking New Ground with Lithium-Battery Generic Requirements for Use in Telecommunications Facilities ESD Open Forum EMC UK 2007 Conference Set Staying Abreast of U.S. E-Waste Legislation EU Commission Establishes RFID Expert Group Update on China's CCC Compliance Program System Level ESD Testing: The Waveforms An Alternative Approach to Surge Suppression Testing Equipment Buyer's Guide EU Scientific Committee Releases Updated Data on EMF Risks Updated Standards List For The EU’s EMC Directive Updated Standards List For The EU’s Directives on Measuring Instruments Call for Presentations for 2008 International ESD Workshop Announced CPSC Actions In The News IEC Standards Update Product Reviews UL Standards Update New Products From Our “You Can’t Make This Stuff Up” Department Looking Back: Items from Past Issues of Conformity Upcoming Events Advertisers

Conformity Magazine - October 2007

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