Project MEMS - January 2009 - (Page 20) feature SPonSor advertiSeMent AnAlog DeVIces ADXl202 mems AcceleromeTers AVAIlAble AT DIgI-Key From Digi-Key, the ADxL202E is a low-cost, low-power, complete 2-axis accelerometer with a digital output, all on a single monolithic IC. It is an improved version of the ADxL202AQC/JQC. The ADxL202E will measure accelerations with a full-scale range of ±2 g. The ADxL202E can measure both dynamic acceleration (e.g., vibration) and static acceleration (e.g., gravity). The outputs are analog voltage or digital signals whose duty cycles (ratio of pulsewidth to period) are proportional to acceleration. The duty cycle outputs can be directly measured by a microprocessor counter, without an A/D converter or glue logic. The duty cycle period is adjustable from 0.5 ms to 10 ms via a single resistor (RSET). click here for additional inforMation tolerate 260°C or more without melting or distorting, and PEEK is more expensive, more difficult to bond, and much harder to mold in thin cross-sections than LCP. Not only has LCP begun displacing more expensive ceramic packaging equivalent LCP packages typically costs about 40% less but it is also replacing less-expensive EMC in highperformance applications, such as those that call for high power density and high frequencies. Manufacturing with LCP differs from other packaging processes. LCP packages are injection molded around leadframe inserts, often at mold cycle times under 10 s. This method lends itself to high-efficiency approaches, such as a continuous process that molds strips of metal leadframes in multi-cavity molds. Alternatively, conductor patterns can be placed on LCP after molding by such automated processes as laser direct structuring, in which a laser draws a circuit pattern on a platable LCP that is then metallized in an electroless plating bath. Once a die is attached and wirebonded, the air-cavity package can be sealed with a metal, ceramic, glass, or plastic lid. Sealing often involves an adhesive such as epoxy, although heat, laser, or other means can be used. LCP works well in premolded LCP packaging because many grades of this polymer withstand temperatures above 300°C. It is inherently flame retardant and meets UL 94V-0 flammability criteria without the addition of halogen, phosphorous, or other flame retardants. And, as a thermoplastic, it is recyclable. LCP has 10 times the water vapor barrier of epoxy and absorbs just 0.02% moisture, so it can create near-hermetic packaging. It has excellent dimensional stability in molding and creates precision parts having flat surfaces right out of the mold, without rework. Project Contents Viewpoint MeMS Solutions for Testing MEMS Devices on the Wafer Level Wireless Sensor Networks Have Arrived Choosing the Right Material for RF Packaging Home Page Product Training Module Online Ordering Suppliers Catalog 2 0 | P r o j E C T M E M S | vo L . 1 / N o . 1 http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://ad.doubleclick.net/clk;210663630;32013581;p?http://search.digikey.com/scripts/DkSearch/dksus.dll?Cat=1966355&keywords=adxl202;stock=1 http://ad.doubleclick.net/clk;210306136;32013581;k?http://digikey.com/PTM/PTMMaster.page?site=us&lang=en http://ad.doubleclick.net/clk;210306155;32013581;l?http://ordering.digikey.com/ordering/addpart.aspx?site=US&source=search http://ad.doubleclick.net/clk;210306414;32013581;j?http://digikey.com/Suppliers/SupplierIndex.page?site=us&lang=en http://ad.doubleclick.net/clk;210306629;32013581;r?http://dkc1.digikey.com/us/en/pdf/Current.html
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.