Project MEMS - January 2009 - (Page 21)

feature It also has good electrical properties: for instance, it has a low dissipation factor and its dielectric constant is 3 to 4, compared to 9 to 13 for ceramic. For advanced packaging designs, LCP offers greater functionality and flexibility than ceramic. While ceramic packages can be shaped in two dimensions, they have trouble with threedimensional shapes or complex contours. Injection-molded LCP does not, and thus lets many elements connectors, inductors, and other structures normally placed on boards be integrated into complex packages. This will reduce demand for board space and lower component, processing, and assembly costs. For more on packaging, search keyword “package” at http:// www.electronicproducts.com/ packaging.asp. coMPariSon of Packaging MaterialS Material PriMary content Benefits DrawBacks coMMents Project Contents Viewpoint MeMS ePoxy MolDing coMPounD (eMc) Epoxy with fillers, flame retardants, other additives • Economical • Broad experience with its use • Poorer heat dissipation and moisture barrier • Does not tolerate leadfree soldering easily • Not recyclable; disposal an issue • High cost • Rarely used; low experience • Higher cost due to secondary steps • Industry still on learning curve Encapsulates components Solutions for Testing MEMS Devices on the Wafer Level Wireless Sensor Networks Have Arrived Choosing the Right Material for RF Packaging Metal Nickel-iron alloys • Exceptional life • Hermetic • Broad experience with its use • Can be hermetic (solder sealed) • Recyclable • Greater design freedom • Near-hermetic • Withstands Pbfree soldering • Costs much less than ceramic Open cavities ceraMic Alumina, Al-glass blends Dominant opencavity material PreMolDeD Liquid crystal polymer (LCP) Injection molded Use is growing rapidly Home Page Product Training Module Online Ordering Suppliers Catalog ShoP MeMS coMPonentS at digi-key 2 1 | P r o j E C T M E M S | vo L . 1 / N o . 1 http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://www.electronicproducts.com/packaging.asp http://www.electronicproducts.com/packaging.asp http://ad.doubleclick.net/clk;210306136;32013581;k?http://digikey.com/PTM/PTMMaster.page?site=us&lang=en http://www.electronicproducts.com/packaging.asp http://ad.doubleclick.net/clk;210306155;32013581;l?http://ordering.digikey.com/ordering/addpart.aspx?site=US&source=search http://ad.doubleclick.net/clk;210306414;32013581;j?http://digikey.com/Suppliers/SupplierIndex.page?site=us&lang=en http://ad.doubleclick.net/clk;210801500;32013581;f?http://search.digikey.com/scripts/DkSearch/dksus.dll?lang=en&site=US&KeyWords=MEMS&x=0&y=0 http://ad.doubleclick.net/clk;210306629;32013581;r?http://dkc1.digikey.com/us/en/pdf/Current.html Table of Contents for the Digital Edition of Project MEMS - January 2009Project MEMS - January 2009ContentsViewpointAbout Digi-KeySolutions for Testing MEMS Devices at the Wafer LevelWireless Sensor Networks Have ArrivedChoosing the Right Material for RF PackagingMEMS ProductsEnter to Win a TomTom GPSReference MaterialsMEMS Quick LinksProject MEMS - January 2009Project MEMS - January 2009 - Project MEMS - January 2009 (Page Cover1)Project MEMS - January 2009 - Contents (Page 2)Project MEMS - January 2009 - Viewpoint (Page 3)Project MEMS - January 2009 - About Digi-Key (Page 4)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 5)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 6)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 7)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 8)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 9)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 10)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 11)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 12)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 13)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 14)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 15)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 16)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 17)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 18)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 19)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 20)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 21)Project MEMS - January 2009 - MEMS Products (Page 22)Project MEMS - January 2009 - Enter to Win a TomTom GPS (Page 23)Project MEMS - January 2009 - Reference Materials (Page 24)Project MEMS - January 2009 - Reference Materials (Page 25)Project MEMS - January 2009 - Reference Materials (Page 26)Project MEMS - January 2009 - Reference Materials (Page 27)Project MEMS - January 2009 - MEMS Quick Links (Page 28)Project MEMS - January 2009 - MEMS Quick Links (Page 29)http://www.nxtbook.com/nxtbooks/hearst/projectmems_200910http://www.nxtbook.com/nxtbooks/hearst/projectmems_200901http://www.nxtbookMEDIA.com

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