Project MEMS - January 2009 - (Page 5)

cover Story SolutionS for teSting MeMS deviceS at the wafer level Project Contents Viewpoint MeMS t Compared to ClassiC iCs, the behavior of mems deviCes is muCh more Complex, and requires testing before paCkaging he MEMS industry is growing rapidly, but early testing is still much neglected. At a glance, manufacturing MEMS devices and classic ICs seem quite similar, but the behavior of MEMS devices is much more complex than classic ICs and differs owing to the MEMS devices having additional mechanical, mostly moveable, parts and packages that are generally a large portion of their cost. There are many reasons why testing prior to packaging is beneficial: The packaging process is very costly. Failed devices that are tested after final packaging waste not only money but R&D, process utilization, and foundry time. Performing functional tests, reliability investigations, and failure analysis at an early stage of the production is vital for the commercialization of the microsystems as it will reduce production costs and time to market. teSt goalS by PhaSe Each of the three phases of the MEMS product development By frank-Michael werner and Joshua M. preston SuSS Microtec teSt SySteMS | Sacka, germany www.suss.com Solutions for Testing MEMS Devices on the Wafer Level Wireless Sensor Networks Have Arrived Choosing the Right Material for RF Packaging Home Page Product Training Module Online Ordering Suppliers Catalog 5 | P r o j E C T M E M S | vo L . 1 / N o . 1 http://www.suss.com http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://ad.doubleclick.net/clk;210306059;32013581;o?http://www.digikey.com/ http://ad.doubleclick.net/clk;210306136;32013581;k?http://digikey.com/PTM/PTMMaster.page?site=us&lang=en http://ad.doubleclick.net/clk;210306155;32013581;l?http://ordering.digikey.com/ordering/addpart.aspx?site=US&source=search http://ad.doubleclick.net/clk;210306414;32013581;j?http://digikey.com/Suppliers/SupplierIndex.page?site=us&lang=en http://ad.doubleclick.net/clk;210306629;32013581;r?http://dkc1.digikey.com/us/en/pdf/Current.html Table of Contents for the Digital Edition of Project MEMS - January 2009Project MEMS - January 2009ContentsViewpointAbout Digi-KeySolutions for Testing MEMS Devices at the Wafer LevelWireless Sensor Networks Have ArrivedChoosing the Right Material for RF PackagingMEMS ProductsEnter to Win a TomTom GPSReference MaterialsMEMS Quick LinksProject MEMS - January 2009Project MEMS - January 2009 - Project MEMS - January 2009 (Page Cover1)Project MEMS - January 2009 - Contents (Page 2)Project MEMS - January 2009 - Viewpoint (Page 3)Project MEMS - January 2009 - About Digi-Key (Page 4)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 5)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 6)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 7)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 8)Project MEMS - January 2009 - Solutions for Testing MEMS Devices at the Wafer Level (Page 9)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 10)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 11)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 12)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 13)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 14)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 15)Project MEMS - January 2009 - Wireless Sensor Networks Have Arrived (Page 16)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 17)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 18)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 19)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 20)Project MEMS - January 2009 - Choosing the Right Material for RF Packaging (Page 21)Project MEMS - January 2009 - MEMS Products (Page 22)Project MEMS - January 2009 - Enter to Win a TomTom GPS (Page 23)Project MEMS - January 2009 - Reference Materials (Page 24)Project MEMS - January 2009 - Reference Materials (Page 25)Project MEMS - January 2009 - Reference Materials (Page 26)Project MEMS - January 2009 - Reference Materials (Page 27)Project MEMS - January 2009 - MEMS Quick Links (Page 28)Project MEMS - January 2009 - MEMS Quick Links (Page 29)http://www.nxtbook.com/nxtbooks/hearst/projectmems_200910http://www.nxtbook.com/nxtbooks/hearst/projectmems_200901http://www.nxtbookMEDIA.com

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