IEEE Awards Booklet - 2018 - 21

2018 ieee technical field awards

IEEE James L. Flanagan Speech and
Audio Processing Award

IEEE Electronics Packaging Award
Sponsored by the IEEE Electronics Packaging Society

Sponsored by the IEEE Signal Processing Society

William T. Chen

Mari Ostendorf

For contributions to electronics packaging from research and development
through industrialization, and for his
leadership in strategic roadmapping
efforts

For contributions to statistical and computational models for analysis, interpretation, and synthesis in speech and
language processing

William T. Chen is a visionary strategist, lead mentor for innovation, and hands-on engineer. His leadership has led to industrialization of game-changing packaging technologies by enabling
miniaturization, cost reduction, and performance enhancements
for today's pervasive all-powerful electronic devices. They include development of copper wirebonds replacing gold interconnects, saving industry hundreds of millions of dollars a year
and 2.5D packaging high-volume implementation, setting the
standard for myriad interconnects in a small package space for
applications including high-performance logic and memory. His
strategic vision on fan-out wafer-level packaging is critical for
meeting future demand for smaller, thinner, and faster electronic
systems.
An IEEE Life Fellow, Chen is an ASE Fellow and senior technical advisor with ASE Group, Inc., Sunnyvale, CA, USA.

Mari Ostendorf has advanced the field of speech and language
processing by combining pioneering advances in statistical modelling and machine learning with an understanding of the deeper
structures in speech. In acoustic modeling, she developed stochastic segment models to overcome the limitations of hidden Markov
models, allowing the use of richer feature sets. Ostendorf helped
standardize the method for annotating prosodic events (the properties of syllables and larger units of speech such as intonation,
tone, and rhythm), as a major contributor to the now standard
"ToBI" method for labeling speech prosody, and demonstrated its
utility for improving spoken language technology. She also created novel frameworks of language modeling that are effective
in separating different contextual factors, significantly impacting
language modeling for speech recognition.
An IEEE Fellow, Ostendorf is a professor of electrical engineering at the University of Washington, Seattle, WA, USA.

IEEE Fourier Award for Signal Processing

IEEE Andrew S. Grove Award

Sponsored by the IEEE Circuits and Systems Society and the
IEEE Signal Processing Society

Sponsored by the IEEE Electron Devices Society

Peter Stoica

Gurtej Singh Sandhu

For broad contributions to research and
education in statistical signal processing
and its applications

For contributions to silicon CMOS process technology that enable DRAM and
NAND memory chip scaling

Peter Stoica's extensive contributions have impacted virtually every
important subject of modern statistical signal processing. He has made
seminal contributions to a broad area of theoretical topics. In particular
he has been hailed for his pioneering contributions to array processing and direction-of-arrival estimation techniques and to multi-input
multi-output radar. His influential scholarly texts, System Identification
and Spectral Analysis of Signals, have been used worldwide to educate
many generations of students, and his more recent books on wireless
communications and sequence design have been invaluable references
for researchers in the field. Throughout his life-long career he has also
been a leader in bringing innovative signal processing techniques to
a wide spectrum of important applications including radar, nuclear
magnetic resonance, breast cancer diagnosis, wireless communications,
sensor networks, and exo-planet search in astronomy.
An IEEE Fellow, Stoica is a professor with Uppsala University,
Uppsala, Sweden.

Gurtej Singh Sandhu's pioneering achievements concerning patterning and materials integration have enabled the continuation of
Moore's Law for aggressive scaling of memory chips integral to consumer electronics products such as cell phones, digital cameras, and
solid-state drives for personal and cloud server computers. Sandhu
initiated the development of atomic layer deposition high-k films
for DRAM devices and helped drive cost-effective implementation starting with 90-nm node DRAM. Extreme device scaling was
also made possible through his pitch-doubling process, which led to
the first 3X-nm NAND flash memory. Sandhu's method for constructing large-area straight-wall capacitors enabled the formation of
double-sided capacitors that extended the scaling of important onetransistor, one-capacitor (1T1C) device technologies. His process for
CVD Ti/TiN is still in use for making DRAM and NAND chips.
An IEEE Fellow, Sandhu is a Senior Fellow and director of
Micron Technology, Inc., Boise, ID, USA.

21 | 2018 IEEE awards bookLET



Table of Contents for the Digital Edition of IEEE Awards Booklet - 2018

Table of Contents
IEEE Awards Booklet - 2018 - Cover1
IEEE Awards Booklet - 2018 - Cover2
IEEE Awards Booklet - 2018 - 1
IEEE Awards Booklet - 2018 - 2
IEEE Awards Booklet - 2018 - 3
IEEE Awards Booklet - 2018 - 4
IEEE Awards Booklet - 2018 - Table of Contents
IEEE Awards Booklet - 2018 - 6
IEEE Awards Booklet - 2018 - 7
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IEEE Awards Booklet - 2018 - 36
IEEE Awards Booklet - 2018 - Cover3
IEEE Awards Booklet - 2018 - Cover4
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