Evaluation Engineering - December 2008 - (Page 25) C SY M P O SIU M AU S 2009 IEEE International Symposium on Electromagnetic Compatibility August 17 – 21, Convention Center Austin, Texas USA TI TI AS N T E X AS EM 2009 EMC 2009 COMMITTEE Chairman David Staggs d.staggs@ieee.org Vice Chair Richard Worley richard_worley@dell.com Secretary Frans Stork frans_stork@agilent.com Treasurer Patrick Webb patrick.webb@ni.com Technical Program Dr. Robert Flake flake@ece.utexas.edu CALL FOR PAPERS w w w . e m c 2 0 0 9 . o r g Information for Authors Join your colleagues in Austin where you can share your insight, ask questions, learn from the experts/innovators and see new products at the 2009 IEEE International Symposium on Electromagnetic Compatibility. Your published paper will be seen by thousands in the EMC community and across the wide array of disciplines that look to the IEEE EMC Society for technical guidance. Paper Topics of Interest The IEEE EMC Society seeks original, unpublished papers covering all aspects of EMC, including technology areas such as: Regulations, Broadcast, Military, Wireless, Power Transmission, and Networking. Topics include and are not limited to the following technical areas: TC-1 EMC Management • EMC Personnel Accreditation • Laboratory Accreditation • EMC Education • EMC Legal Issues TC-2 EMC Measurements • Test Instrumentation • Measurement Techniques • Emissions and Immunity • Standards and Regulations • Test Facilities TC-3 EM Environment • EM Signal Environment • Atmospheric Noise • Man-Made Noise TC-4 EM Interference • Shielding, Gasketing & Filtering • Cables and Connectors • • • • Coupling System EMC Analysis Grounding PCB Issues • Biological Effects • Radiation Hazards • Environmental Safety TC-9 Computational Electromagnetics • Computer Modeling • Model Validation • Statistical Analysis TC-10 Signal Integrity • Packaging • Model Parameter Determination • Device Modeling • Crosstalk TC-11 Nanotechnology • Nanomaterials • Nanostructures • Carbon Nanotubes • Nanofibers • Smart Materials Dr. Michael Foegelle michael.foegelle@ets-lindgren.com Dr. Bruce Archambeault barch@us.ibm.com Special/Invited Sessions Ross Carlton ross.carlton@ni.com Workshops/Tutorials Bob Scully robert.c.scully@nasa.gov John Maas john.maas@ieee.org Demonstrations/Experiments Michael Vrbanac vrbanacm@swbell.net Colin Brench colin.brench@ieee.org Publications/Marketing Glen Watkins glen.watkins@ets-lindgren.com Exhibits Mark Prchlik mark@prchlik.com Stephen Mullenix smulllenix@austin.rr.com Arrangements Rhonda Erickson rhonda.erickson@ets-lindgren.com Social Activities Dale Stone dale.stone@ets-lindgren.com Companion Program Barbara Staggs bsue5246@aol.com Registration Bronwyn Brench brench.ieee@yahoo.com Website Philip Stolle philip.stolle@ets-lindgren.com TC-5 High Power Electronics • ESD • EMP & Lightning • Transients • Power Transmission TC-6 Spectrum Management • Spectrum Management • Spectrum Monitoring TC-7 Nonsinusoidal Fields • Ultrawideband EMC • Impulse Radar • Time Domain Modeling TC-8 Electromagnetic Product Safety • EMC & Functional Safety Author Submission Schedule • Preliminary Full Paper Manuscript: November 1, 2008 - January 8, 2009 (late papers will not be accepted) • Acceptance Notification: March 7, 2009 • Final Paper and Workshop/Tutorial Material Due: May 1, 2009 Paper Formats • Traditional Oral presentation: Presentation for those interested in presenting to learge groups with limited potential for interations with attendees. Six-page paper maximum, 20 minute presentation. • Open Forum: Presentation for those interested in direct interaction with individuals or small groups. Three Dimensions Conference Management Services • Mary Ellen Vegter at mevegter@threedimensions.com • Phone +1 562 860 8180 www.emc2009.org http://www.emc2009.org http://www.emc2009.org http://www.emc2009.org
Table of Contents Feed for the Digital Edition of Evaluation Engineering - December 2008 Evaluation Engineering - December 2008 Contents Editorial Product Briefing Test Software C-V Measurements Nanoelectronics Test Product Guide Company Guide Machine Vision EMC Test Index of Advertisers Evaluation Engineering - December 2008 Evaluation Engineering - December 2008 - Evaluation Engineering - December 2008 (Page Cover1) Evaluation Engineering - December 2008 - Evaluation Engineering - December 2008 (Page Cover2) Evaluation Engineering - December 2008 - Evaluation Engineering - December 2008 (Page 1) Evaluation Engineering - December 2008 - Evaluation Engineering - December 2008 (Page 2) Evaluation Engineering - December 2008 - Contents (Page 3) Evaluation Engineering - December 2008 - Contents (Page 4) Evaluation Engineering - December 2008 - Contents (Page 5) Evaluation Engineering - December 2008 - Editorial (Page 6) Evaluation Engineering - December 2008 - Editorial (Page 7) Evaluation Engineering - December 2008 - Product Briefing (Page 8) Evaluation Engineering - December 2008 - Product Briefing (Page 9) Evaluation Engineering - December 2008 - Product Briefing (Page 10) Evaluation Engineering - December 2008 - Product Briefing (Page 11) Evaluation Engineering - December 2008 - Product Briefing (Page 12) Evaluation Engineering - December 2008 - Product Briefing (Page 13) Evaluation Engineering - December 2008 - Test Software (Page 14) Evaluation Engineering - December 2008 - Test Software (Page 15) Evaluation Engineering - December 2008 - Test Software (Page 16) Evaluation Engineering - December 2008 - Test Software (Page 17) Evaluation Engineering - December 2008 - Test Software (Page 18) Evaluation Engineering - December 2008 - Test Software (Page 19) Evaluation Engineering - December 2008 - C-V Measurements (Page 20) Evaluation Engineering - December 2008 - C-V Measurements (Page 21) Evaluation Engineering - December 2008 - C-V Measurements (Page 22) Evaluation Engineering - December 2008 - C-V Measurements (Page 23) Evaluation Engineering - December 2008 - C-V Measurements (Page 24) Evaluation Engineering - December 2008 - C-V Measurements (Page 25) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 26) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 27) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 28) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 29) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 30) Evaluation Engineering - December 2008 - Nanoelectronics Test (Page 31) Evaluation Engineering - December 2008 - Product Guide (Page 32) Evaluation Engineering - December 2008 - Product Guide (Page 33) Evaluation Engineering - December 2008 - Product Guide (Page 34) Evaluation Engineering - December 2008 - Product Guide (Page 35) Evaluation Engineering - December 2008 - Company Guide (Page 36) Evaluation Engineering - December 2008 - Company Guide (Page 37) Evaluation Engineering - December 2008 - Machine Vision (Page 38) Evaluation Engineering - December 2008 - Machine Vision (Page 39) Evaluation Engineering - December 2008 - Machine Vision (Page 40) Evaluation Engineering - December 2008 - Machine Vision (Page 41) Evaluation Engineering - December 2008 - Machine Vision (Page 42) Evaluation Engineering - December 2008 - Machine Vision (Page 43) Evaluation Engineering - December 2008 - EMC Test (Page 44) Evaluation Engineering - December 2008 - EMC Test (Page 45) Evaluation Engineering - December 2008 - EMC Test (Page 46) Evaluation Engineering - December 2008 - EMC Test (Page 47) Evaluation Engineering - December 2008 - EMC Test (Page 48) Evaluation Engineering - December 2008 - EMC Test (Page 49) Evaluation Engineering - December 2008 - EMC Test (Page 50) Evaluation Engineering - December 2008 - EMC Test (Page 51) Evaluation Engineering - December 2008 - Index of Advertisers (Page 52) Evaluation Engineering - December 2008 - Index of Advertisers (Page Cover3) Evaluation Engineering - December 2008 - Index of Advertisers (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.