Chemical Processing - February 2008 - (Page 21) Vacuum service imposes certain unique demands on the design of equipment and systems. That is, sizing and design for vacuum differs from that for equipment operating at atmospheric pressure and higher. This article highlights these differences and provides some proven pointers for successful vacuum system design. Some differences apply to any vacuum operation; others come into play only at deep vacuum, that is, at operational pressures below 0.1 Torr (mm. Hg. absolute). There are four important general differences: 1. Pressure drop (“delta P” across the entire system from the user point or user equipment to the vacuum source) is a much greater proportion of the operational pressure. Thus, while a pressure drop of 0.1 in. Hg. is considered acceptable for piping operating above atmospheric pressure, it’s wholly unacceptable if the desired vacuum operation were to be at 0.5 in. Hg. cause there’s a limit on how much differential a vacuum source can produce (how hard it can pull), there’s a limit on the velocity of the pumped vapors. This limit, which is the sonic velocity, means that the volumetric capacity of pipe can only be boosted for larger flow rates by increasing the diameter of the pipe. This is why vacuum piping is always larger than pipe used at atmospheric pressure or higher. Usually, there’s a several-fold increase in pipe size. 4. As the operational vacuum level deepens, heat transfer mechanisms disappear. At atmospheric pressure, three mechanisms transfer heat: convection, conduction and radiation. As operational pressure is lowered, they fall away. By 50 Torr, there’s no convection; by 5 Torr, there’s no conduction, leaving only radiation at deeper vacuum levels. This has a profound effect on sizing, e.g., of condensers and heat exchangers. >> Common cause of in-leaks >> Pump piping Figure 1. Threaded connections shouldn’t be used in vacuum systems unless properly sealed. Figure 2. For pumps in high vacuum systems, always install a seal disk, as shown above. 2. A leak in a vacuum system is the reverse of one in a pressure system — air is leaking in not out. Moreover, the air coming into the vacuum system expands because there’s less than atmospheric pressure. For example, 1 SCFM (standard cubic feet per minute) leaking into a vacuum system operating at 0.1 atm. expands to 10 ACFM (actual cubic feet per minute). The deeper the operational vacuum level, the more the in-leaked air expands. This can greatly raise the required capacity of the vacuum source. In contrast, the same leak from a compressed air system wouldn’t increase; compensating for the loss would require only an equivalent small rise in compressor capacity. 3. A vacuum system can only go down so much in pressure — after all, perfect vacuum is just -14.7 psi. Be- Heat transfer only by radiation can provide some practical benefits, such as when a vacuum pump is used with a furnace. The furnace might be operating at 1,000°F but the vacuum pump won’t have problems below 1 Torr if the piping connecting the pump to the furnace is laid out “optically dense” — that is, there’s at least one 90° turn. Radiation travels in straight lines and must be adsorbed to heat anything. When operating below 1 Torr, the heat can’t get to the vacuum source because the radiation will be adsorbed by the piping. The vapors from the furnace aren’t a heat source as, at 1 Torr and below, they are so dilute the heat quantity carried to the pump is very small (total BTUs are low). Annular pipe arrangements can provide almost “super insulation” if the annular space is evacuated and maintained below 1 Torr. www.chemicalprocessing.com February 2008 • 21 http://www.chemicalprocessing.com
Table of Contents Feed for the Digital Edition of Chemical Processing - February 2008 Chemical Processing - February 2008 Contents From the Editor ChemicalProcessing.com Field Notes In Process Energy Saver Compliance Advisor Nanoparticle Safety Raises Questions Take the Pressure Off Vacuum Systems Achieve Optimum Centrifugal Pump Performance Rethink Batch-Manufacturing Alarm Systems Dr. Gooddata Orlando Plant Pioneers HMI Migration Strategy Process Puzzler Plant InSites Equipment & Services Ad Index Product Spotlight/Classifieds End Point Chemical Processing - February 2008 Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page Cover1) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page Cover2) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page 3) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page 4) Chemical Processing - February 2008 - Contents (Page 5) Chemical Processing - February 2008 - Contents (Page 6) Chemical Processing - February 2008 - From the Editor (Page 7) Chemical Processing - February 2008 - ChemicalProcessing.com (Page 8) Chemical Processing - February 2008 - Field Notes (Page 9) Chemical Processing - February 2008 - In Process (Page 10) Chemical Processing - February 2008 - In Process (Page 11) Chemical Processing - February 2008 - Energy Saver (Page 12) Chemical Processing - February 2008 - Compliance Advisor (Page 13) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 14) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 15) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 16) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 17) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 18) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 19) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 20) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 21) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 22) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 23) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 24) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 25) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 26) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 27) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 28) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 29) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 30) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 31) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 32) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 33) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 34) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 35) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 36) Chemical Processing - February 2008 - Dr. Gooddata (Page 37) Chemical Processing - February 2008 - Dr. Gooddata (Page 38) Chemical Processing - February 2008 - Orlando Plant Pioneers HMI Migration Strategy (Page 39) Chemical Processing - February 2008 - Orlando Plant Pioneers HMI Migration Strategy (Page 40) Chemical Processing - February 2008 - Process Puzzler (Page 41) Chemical Processing - February 2008 - Process Puzzler (Page 42) Chemical Processing - February 2008 - Plant InSites (Page 43) Chemical Processing - February 2008 - Plant InSites (Page 44) Chemical Processing - February 2008 - Equipment & Services (Page 45) Chemical Processing - February 2008 - Ad Index (Page 46) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 47) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 48) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 49) Chemical Processing - February 2008 - End Point (Page 50) Chemical Processing - February 2008 - End Point (Page Cover3) Chemical Processing - February 2008 - End Point (Page Cover4)
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