Chemical Processing - February 2008 - (Page 23) can lose their dimensional memory as they expand and contract with the cycling of the vacuum system, and thus not completely seal all surfaces. In fact, metal gaskets or special o-rings called sealing discs (o-rings with metal “winglets”) often are needed to prevent leaks in joints, flanges, etc. The techniques used in so-called high vacuum design become necessary when the operational pressure level falls be- Low-pressure-drop piping layout, inside wall smoothness, hard elastomers, etc., can make any vacuum system operate more efficiently. low 1 Torr. They really constitute the best available technology and should be considered to improve the quality of any vacuum system. Unfortunately, they all too often are dismissed as too expensive. The difference in cost between a flanged connection and a threaded connection may be the most extreme example. However, low-pressure-drop layout of the piping, inside wall smoothness, hard elastomers, etc. can make any system, regardless of its operational vacuum level, operate more efficiently. That is, they help deliver more of the vacuum source’s capacity to the user equipment and thus contribute to the overall economics of the vacuum system. Proper testing It’s essential to periodically check your vacuum system for the development of in-leak. The most common method is the “rate-of-rise” test. In it, the system is pumped down below its usual operating pressure and valved off (isolated from the vacuum source). So, the only way the pressure can rise is due to the in-leak of air. The deeper the operational vacuum used the less air in-leak that can be tolerated. Industrial systems shouldn’t increase more than 10% from the base pressure in 24 hours. High vacuum systems need a more strenuous standard, especially if the processes can’t tolerate the presence of oxygen (as in most semiconductor systems). Here, the generally accepted standard as a 1% rise from the base pressure in 24 hours. There’s a temptation in industrial or “rough” vacuum operations to use pressurization methods to test the system (either with water, as in a pressure or hydrostatic test, or with compressed air). However, they only will give a very rough indication of the tightness of a system. Water is a liquid and its surface tension reduces in-leak. In addition, many components such as seals in a vacuum system are directional in nature and pressure testing is looking for flow in the wrong direction (vacuum leaks are in-leaks). CP Henry H. Hesser is a staff technical specialist for Busch, LLC, Virginia Beach, Va. Reach him via e-mail at hhesser@buschusa.com. PiPing Pointers Vacuum systems will provide better performance if you follow these eight tips: 1. Minimize bends in the piping layout. Every bend, every change in direction, etc., adds to pressure drop. 2. Wherever elbows are required, use long-radius instead of short-radius ones to reduce pressure drop. 3. Wherever two lines come together, use a wye instead of a tee to lower pressure drop. 4. Make sure that the overall pressure drop of the piping (farthest use point to the source of vacuum) doesn’t exceed 10% of the operating pressure. 5. Eliminate unsealed threads wherever they are used. They are a large source of leaks. Always remember that whatever leaks into the vacuum system expands greatly. Two ways to lessen the impact of threads are to use a sealer in the gaps of normal NPT threads or use NPT “fine cut” threads. 6. Tighten flanges, regardless of type, by working in turn on “opposites” or “facing” bolts, not clockwise or counterclockwise in succession. 7. Check every elastomer (gasket, o-ring, etc.). Each should be “hard” (greater than 90 durameter) to eliminate leaks arising from pressure cycling (up, down, up, etc.). 8. Keep the rate-of-rise over 24 hours of the piping system to 10% or less of the operating pressure and test regularly. www.chemicalprocessing.com February 2008 • 23 http://www.westernstates.com http://www.westernstates.com http://www.chemicalprocessing.com
Table of Contents Feed for the Digital Edition of Chemical Processing - February 2008 Chemical Processing - February 2008 Contents From the Editor ChemicalProcessing.com Field Notes In Process Energy Saver Compliance Advisor Nanoparticle Safety Raises Questions Take the Pressure Off Vacuum Systems Achieve Optimum Centrifugal Pump Performance Rethink Batch-Manufacturing Alarm Systems Dr. Gooddata Orlando Plant Pioneers HMI Migration Strategy Process Puzzler Plant InSites Equipment & Services Ad Index Product Spotlight/Classifieds End Point Chemical Processing - February 2008 Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page Cover1) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page Cover2) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page 3) Chemical Processing - February 2008 - Chemical Processing - February 2008 (Page 4) Chemical Processing - February 2008 - Contents (Page 5) Chemical Processing - February 2008 - Contents (Page 6) Chemical Processing - February 2008 - From the Editor (Page 7) Chemical Processing - February 2008 - ChemicalProcessing.com (Page 8) Chemical Processing - February 2008 - Field Notes (Page 9) Chemical Processing - February 2008 - In Process (Page 10) Chemical Processing - February 2008 - In Process (Page 11) Chemical Processing - February 2008 - Energy Saver (Page 12) Chemical Processing - February 2008 - Compliance Advisor (Page 13) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 14) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 15) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 16) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 17) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 18) Chemical Processing - February 2008 - Nanoparticle Safety Raises Questions (Page 19) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 20) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 21) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 22) Chemical Processing - February 2008 - Take the Pressure Off Vacuum Systems (Page 23) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 24) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 25) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 26) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 27) Chemical Processing - February 2008 - Achieve Optimum Centrifugal Pump Performance (Page 28) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 29) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 30) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 31) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 32) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 33) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 34) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 35) Chemical Processing - February 2008 - Rethink Batch-Manufacturing Alarm Systems (Page 36) Chemical Processing - February 2008 - Dr. Gooddata (Page 37) Chemical Processing - February 2008 - Dr. Gooddata (Page 38) Chemical Processing - February 2008 - Orlando Plant Pioneers HMI Migration Strategy (Page 39) Chemical Processing - February 2008 - Orlando Plant Pioneers HMI Migration Strategy (Page 40) Chemical Processing - February 2008 - Process Puzzler (Page 41) Chemical Processing - February 2008 - Process Puzzler (Page 42) Chemical Processing - February 2008 - Plant InSites (Page 43) Chemical Processing - February 2008 - Plant InSites (Page 44) Chemical Processing - February 2008 - Equipment & Services (Page 45) Chemical Processing - February 2008 - Ad Index (Page 46) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 47) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 48) Chemical Processing - February 2008 - Product Spotlight/Classifieds (Page 49) Chemical Processing - February 2008 - End Point (Page 50) Chemical Processing - February 2008 - End Point (Page Cover3) Chemical Processing - February 2008 - End Point (Page Cover4)
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