SAMPE Journal - July/August 2017 - 49

Article
to contact the electronics and finally,
sensors and sensing networks are
printed on the external surface of the
part. These concepts are sketched in
Figures 1 and 2.

Figure 2. Schematic of integration between 3D Printing (3DP) and Printed
Electronics (PE) for novel aircraft sensing and testing concepts.
multifunctional structures that are a
few microns thick. Typical elements
or components are interconnects,
electrodes, heaters, sensors (pressure,
temperature, strain), transducers,
antennas and coatings1. It is clear
that by combining both additive
processes, a new revolution on how
we design, fabricate, and maintain
products and systems will occur2. As
a result, really true multifunctional,
smart, and lightweight devices and
system will be created.
Based on the U. S. Air Force
requirements, we investigated a
multi-disciplinary solution that
involved sensor design, functional
materials, additive manufacturing
such as printed electronics and
3D printing, and wind testing to
develop a Printed Skin (pSKIN)
system. pSKIN is a highly
conforming
printed
electronics
method to deposit functional sensing
networks for pressure, strain, and
temperature on aircraft structures.
The system is a few microns thick
(5mm-100mm) and can be deposited
on legacy systems, new systems and
next generation of flying platforms.
PSKIN is a light and robust system
that can be placed on any type of
material (metallic or composite) and/
or structure topology. In addition,
pSKIN can be combined with 3D
printing (3DP) methods to achieve a
fully integrated solution. In this case,
when the 3DP process is paused,
electronic components can be placed
or printed, then the 3DP continues,
encapsulating the electronics within
the body of the structure. Next,
interconnects are printed or inserted
SAMPE Journal, Volume 53, No. 4, July/August 2017

Printed Electronics Manufacturing
Printed Electronics (PE) is a
relatively
new
manufacturing
technique for writing electronic
circuits directly on flat or curved
surfaces without special tooling3. A

Figure 3. Direct write process (left) and aerosol jet system printing an
antenna (right).

49



http://www.mccleananderson.com

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