Circuits Assembly - November 2007 - (Page 26)

On the Forefront companies are not able to use WLPs because the die area is too small to route the I/O. For this reason, fan-out versions of the WLP have been developed. Freescale Semiconductor’s RCP and Infineon’s eWLB are examples of this technology. With the move to 12" wafers, there are concerns about capacity availability. Companies with 12" wafer level processing today include Amkor (Figure 1), ASE and Casio. TSMC has announced plans to spend almost $60 million to build a 12" WLP line, and others are expected to migrate to the larger wafer size. There are also concerns with han- Figure 1. Amkor’s 12” wafer (at left). dling and thinning for 12" wafers. New methods are under development. ics. Its mission is “to promote the adoption of With the introduction of low-k dielectrics, semiconductor devices using WLCSP, to establish companies will need to make careful selections of industry sponsored best practices for their utilizaunderfill materials so as not to induce increased tion and to establish strategies for migration to stress. For some end-users there remains concern finer pitch WLCSP products.” over handling this minimally packaged die, as it The prospects are bright for the WLP, and cellclosely resembles a bare die. The WLCSP Forum phones will remain the driver for the future. ■ (wlcspforum.org) has been formed to address these and other issues. Founding members include References Amkor, CMD, Flip Chip International, Maxim Integrated Products, Nokia, and STMicroelectron1. TPSS Japan, “Analysis of Motorola RAZR V3,” December 2005. POLYMER INFUSED METAL SQUEEGEES Maximize Your Micro-Electronics Printing Results Precision Hand Squeegees Light Ergonomic Holders Permalex-3D: Various Blade Thickness for printing optimization See us at Productronica, Hall A4, Booth 331 Blades for Pump-Head Printing Patented Holders with Accurate Referencing 101 Billerica Avenue, Bldg 5 N Billerica, Massachusetts 01862 All Permalex Products are Guaranteed WEB: WWW.PERMALEX.COM PH: 800-648-3338 FX: 978-670-2300 SALES@TRANSITIONAUTOMATION.COM http://wlcspforum.org http://WWW.PERMALEX.COM http://WWW.PERMALEX.COM

Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2007

Circuits Assembly - November 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Pb-Free Manufacturing from a Tier III EMS Perspective ‘Living Documents, Subject to Change’ Creating Ideal Solder Joints An Alternative Drying Process for MSDs ‘Customer Satisfaction is More than a Score’ Optoelectronic Substrates: Will They Happen? Tech Tips Wave Soldering Process Doctor Test and Inspection Getting Lean Materials World Equipment Advances Product Spotlight Assembly Insider Technical Abstracts Ad Index

Circuits Assembly - November 2007

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