Circuits Assembly - November 2007 - (Page 28) Screen Printing Diagnosing High-Volume Medical Processes Novel printing tools and methods deliver the cure. here’s no debating that the medical market is huge. According to Prismark Partners, spending on non-IT medical electronics was $53 billion in 2006, with this figure expected to grow to $66 billion by 2010.1 As the population ages and people take on more responsibility for self-monitoring and self-administration of treatment, medical device manufacturing volumes will reach new levels. But, like the majority of products today, manufacturing these diagnostic tools at the lowest cost per unit is essential for OEM competitiveness. Not only do medical manufacturers need high-volume production speeds, but as these products become smaller, accuracy also becomes tantamount. These two requirements – speed and precision – are forcing medical device companies to seek alternatives to traditional production methods. As has been the case with so many other applications, printing is again emerging as the most costeffective and precise method by which to achieve yields and volumes required for medical device production, more specifically for biosensors. These small – and often disposable – products provide instant data on everything from pregnancy to blood sugar levels and are produced by depositing layers of live enzymes onto a very thin substrate that is usually some porous material such as paper or cardboard. Historically, because of the product size and deposit volumes, print accuracy hasn’t been a major concern. However, as these devices become smaller and the materials to be deposited become more expensive and challenging, medical firms now require a process capable of delivering a deposit thickness that fits within a Six Sigma envelope. The nominal thickness of deposit required depends on the application and can range from 25 to 50 µm. Alignment accuracy, fast cycle times and deposition control are, of course, where printing lends its expertise. I’ve addressed printing platform speed and accuracy discussions in previous columns, and won’t go into great detail here about the capabilities and benefits of many of today’s high-end systems. What I will review, though, is the importance of screen production, substrate handling, and material management in relation to screen-printing biosensors, as these elements are just as critical as machine speed and accuracy. The accuracy and precision of the screens used in medical manufacturing is mission-critical – literally. With traditional electronics manufacturing, the worst that might happen if a manufacturing defect occurs is that T Figure 1. Reel-to-reel processing affords the speed needed for medical volumes. Clive Ashmore is global applied process engineering manager at DEK (dek. com); cashmore@dek.com. His column appears bimonthly. your cellphone won’t work. But a wrong reading from a biosensor designed to diagnose a particular medical issue could spell tragedy. Keeping this in mind, it is essential that the accuracy of the screens is spot on; there can be no pinpricks, no room for errors. The choice of the mesh used, the way it is stretched, the emulsion selection and application – all are vital for precision medical screen production. In addition to the screen technology, material management and substrate handling are other challenging components of biosensor printing processes. The materials printed are live enzymes suspended in a printable vehicle and, in most cases, are printed in layers. As you can imagine, these materials are very difficult to print because they are live products, so they must be handled with extreme care and control. They don’t like a dry environment; it will actually kill the enzyme. When these materials are stored en masse within a closed container at high humidity, they’re fine. But take them out, print them thinly onto a substrate and expose them to air, and the enzymes will die. So, the environmental conditions must be optimized for this type of production. One of the most difficult aspects of biosensor printing, though, may be handling and printing of the substrates at high volume. Medical manufacturers produce millions of these things – so many, in fact, that they can wear out a mesh screen in a day. The beat rate is phenomenal: One big sheet of substrate cardboard and in one pass, a thousand biosensors are printed with an enzyme layer. Continued on pg. 47 28 Circuits Assembly NOVEMBER 2007 circuitsassembly.com http://dek.com http://dek.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2007 Circuits Assembly - November 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Pb-Free Manufacturing from a Tier III EMS Perspective ‘Living Documents, Subject to Change’ Creating Ideal Solder Joints An Alternative Drying Process for MSDs ‘Customer Satisfaction is More than a Score’ Optoelectronic Substrates: Will They Happen? Tech Tips Wave Soldering Process Doctor Test and Inspection Getting Lean Materials World Equipment Advances Product Spotlight Assembly Insider Technical Abstracts Ad Index Circuits Assembly - November 2007 Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page Cover1) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page Cover2) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page 1) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page 2) Circuits Assembly - November 2007 - Contents (Page 3) Circuits Assembly - November 2007 - Contents (Page 4) Circuits Assembly - November 2007 - Contents (Page 5) Circuits Assembly - November 2007 - Caveat Lector (Page 6) Circuits Assembly - November 2007 - Caveat Lector (Page 7) Circuits Assembly - November 2007 - Industry News (Page 8) Circuits Assembly - November 2007 - Industry News (Page 9) Circuits Assembly - November 2007 - Industry News (Page 10) Circuits Assembly - November 2007 - Industry News (Page 11) Circuits Assembly - November 2007 - Industry News (Page 12) Circuits Assembly - November 2007 - Industry News (Page 13) Circuits Assembly - November 2007 - Market Watch (Page 14) Circuits Assembly - November 2007 - Market Watch (Page 15) Circuits Assembly - November 2007 - Market Watch (Page 16) Circuits Assembly - November 2007 - Market Watch (Page 17) Circuits Assembly - November 2007 - Talking Heads (Page 18) Circuits Assembly - November 2007 - Talking Heads (Page 19) Circuits Assembly - November 2007 - Focus on Business (Page 20) Circuits Assembly - November 2007 - Focus on Business (Page 21) Circuits Assembly - November 2007 - Focus on Business (Page 22) Circuits Assembly - November 2007 - Focus on Business (Page 23) Circuits Assembly - November 2007 - Global Sourcing (Page 24) Circuits Assembly - November 2007 - Global Sourcing (Page Insert1) Circuits Assembly - November 2007 - Global Sourcing (Page Insert2) Circuits Assembly - November 2007 - On the Forefront (Page 25) Circuits Assembly - November 2007 - On the Forefront (Page 26) Circuits Assembly - November 2007 - On the Forefront (Page 27) Circuits Assembly - November 2007 - Screen Printing (Page 28) Circuits Assembly - November 2007 - Screen Printing (Page 29) Circuits Assembly - November 2007 - Better Manufacturing (Page 30) Circuits Assembly - November 2007 - Better Manufacturing (Page 31) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 32) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 33) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 34) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 35) Circuits Assembly - November 2007 - ‘Living Documents, Subject to Change’ (Page 36) Circuits Assembly - November 2007 - ‘Living Documents, Subject to Change’ (Page 37) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 38) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 39) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 40) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 41) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 42) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 43) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 44) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 45) Circuits Assembly - November 2007 - ‘Customer Satisfaction is More than a Score’ (Page 46) Circuits Assembly - November 2007 - ‘Customer Satisfaction is More than a Score’ (Page 47) Circuits Assembly - November 2007 - Optoelectronic Substrates: Will They Happen? (Page 48) Circuits Assembly - November 2007 - Optoelectronic Substrates: Will They Happen? (Page 49) Circuits Assembly - November 2007 - Tech Tips (Page 50) Circuits Assembly - November 2007 - Tech Tips (Page 51) Circuits Assembly - November 2007 - Wave Soldering (Page 52) Circuits Assembly - November 2007 - Wave Soldering (Page 53) Circuits Assembly - November 2007 - Process Doctor (Page 54) Circuits Assembly - November 2007 - Process Doctor (Page 55) Circuits Assembly - November 2007 - Test and Inspection (Page 56) Circuits Assembly - November 2007 - Getting Lean (Page 57) Circuits Assembly - November 2007 - Getting Lean (Page 58) Circuits Assembly - November 2007 - Materials World (Page 59) Circuits Assembly - November 2007 - Equipment Advances (Page 60) Circuits Assembly - November 2007 - Product Spotlight (Page 61) Circuits Assembly - November 2007 - Assembly Insider (Page 62) Circuits Assembly - November 2007 - Assembly Insider (Page 63) Circuits Assembly - November 2007 - Ad Index (Page 64) Circuits Assembly - November 2007 - Ad Index (Page Cover3) Circuits Assembly - November 2007 - Ad Index (Page Cover4)
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