Circuits Assembly - November 2007 - (Page 3)

Vardaman on Wafer-Level CSPs, p. 25 NOVEMBER 2007 circuitsassembly.com Get the Wet Out NOVEMBER 2007 – Vol. 18 No. 11 Inventory Management How One Tier III EMS Switched to RoHS Making the Perfect Joint Alternative Methods for Drying MSDs FIRST PERSON 6 Caveat Lector Show me(ans) the money. Mike Buetow FEATURES RoHS Transition ON THE COVER: A novel solution to component moisture problems. 18 Talking Heads Photo Stencil’s Keith Favre. Mike Buetow 32 Pb-Free Manufacturing from a Tier III EMS Perspective The Pb-free transition was daunting even for larger EMS firms, but had a major impact on smaller firms that lacked abundant engineering resources. How did we do it and how has the process matured? Here’s how one company made the switch. Greg Caswell MONEY MATTERS 20 Focus on Business Trimming the excess. Susan Mucha Standards Development 36 38 ‘Living Documents, Subject to Change’ The origins – and future – of standards, the foundation of electronics manufacturing. Michael L. Martell 24 Global Sourcing The top PWB fabricators. Mike Buetow Reflow Soldering Creating Ideal Solder Joints Reflow soldering is a superset of an accurate thermal profile. A poorly devised profile can have devastating (read: expensive) repercussions. Same goes for the stencil. Zulki Khan TECH TALK 25 On the Forefront Wafer thin, but getting bigger. E. Jan Vardaman Cover Story 42 46 48 An Alternative Drying Process for MSDs Components baked at 70˚C for 24 hr. in a vacuum passed IPC and EIA testing. Charles S. Leech Jr. 28 Screen Printing ‘Sensing’ a huge medical advance. Clive Ashmore SEAs 2007 30 Better Manufacturing Narrowing your supplier list. Peter Grundy ‘Customer Satisfaction is More than a Score’ For five-time SEA winner DEK, it’s about continuous improvement, not the highest scores. Chelsey Drysdale iNEMI Roadmap 50 Tech Tips Wire harnesses and cable routing. American Competitiveness Institute Optoelectronic Substrates: Will They Happen? Optoelectronic interconnects can provide increased bandwidth and other advantages for special applications over copper, but implementation has fizzled. What changes need to occur to make this mainstream? Jack Fisher 52 Wave Soldering Setting up the wave. Ursula Marquez de Tino 54 Process Doctor Selective leakage. Terry Munson This month at PCDandF.com A New Approach for Finer Pitch Package-onPackage for Mobile Devices Manisha Sharma 56 Test and Inspection Data: that big CAD. Stacy Kalisz Johnson 57 Getting Lean The power of incremental improvements. Marty Neese and S.M. Kong HDI Via Structures Effect on PCB Design Flexibility, Constraints and Cost Happy Holden 59 Materials World Edge and corner bonding. Dr. Renzhe Zhao DEPARTMENTS 8 Industry News 14 Market Watch 61 Product Spotlight 62 Assembly Insider 64 Ad Index 60 Equipment Advances Inovaxe’s MSD storage unit. 64 Technical Abstracts Kuzma and Li Kim http://circuitsassembly.com http://PCDandF.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2007

Circuits Assembly - November 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Pb-Free Manufacturing from a Tier III EMS Perspective ‘Living Documents, Subject to Change’ Creating Ideal Solder Joints An Alternative Drying Process for MSDs ‘Customer Satisfaction is More than a Score’ Optoelectronic Substrates: Will They Happen? Tech Tips Wave Soldering Process Doctor Test and Inspection Getting Lean Materials World Equipment Advances Product Spotlight Assembly Insider Technical Abstracts Ad Index

Circuits Assembly - November 2007

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