Circuits Assembly - November 2007 - (Page 47) SEAs 2007 Our customer service plan is a highly detailed, well-documented program that permeates every single aspect of DEK’s business – from a customer’s first interaction with us on the phone or at a show through to development of a completely new process or application. This kind of service and the level of innovative support tools we provide doesn’t just happen; it is a carefully executed plan to ensure success and total customer satisfaction. Winning five consecutive Service Excellence Awards is no coincidence. CA: What do you do if service levels fall below your organization’s standards? How do you determine those standards? NM: Through our various metrics, we have well-defined and measured standards. Certain customer grades that fall below the standard (and DEK’s standard is very high) are followed up immediately, and a detailed course of action is undertaken. We conduct a root cause analysis, present every case that has fallen below our standards and present a resolution. And, again, this is not just about a machine that might be down; it is a service for all products at all levels of the organization. CA: How important is customer service to the bottom line? NM: It’s everything. Superior customer service directly translates to repeat sales and leading market share. Over the past several years, DEK has made tremendous market share gains, and I believe this is a direct result of our ability to deliver unrivaled process expertise, superior products and of course outstanding customer service. The cost of excellent support is high; it’s a tremendous investment but, in the end, only has positive impacts on the bottom line. CA: What is the length of your business relationship with a typical customer? NM: The majority of our customer relationships last for many years. Our repeat order percentage is extremely high – again, an indicator of superior products, expertise and support. CA: Does your company place greater emphasis on retaining customers or gaining new ones? NM: Both are equally important. And, in fact, having satisfied customers serves to enable new business gains. I believe our five-year SEA run, in tandem with our continued market share gains, validates this. ■ Visit us at Productronica, Hall A3, Booth 263 Continued from pg. 28 What our company has discovered is that a reel-to-reel system is the most cost-effective way to achieve speed, accuracy and substrate control (Figure 1). Remember these substrates are a little weird and wonderful. Cardboard and paper are porous materials, so moving them into the printer, enabling printing stability within the system during material deposition, and then moving the substrate out – all without tearing them – takes ingenuity and inventiveness. Also, because the enzymes are layered one on top of the other, this process happens inline – usually with several printing systems. The substrate is unrolled and travels all the way down the line through each material deposition process before getting re-rolled onto the cylinder at the end of the line. This is a delicate operation, to say the least. As I’ve said, the possibilities for high-accuracy printing applications are endless. With biosensor manufacturing, just as with countless other applications, it’s just a matter of understanding what the end-product has to be and using the right screen printing equipment and know-how to develop novel ways of facilitating the process. As for medical manufacturing, the prognosis for robust high-volume manufacturing is excellent! ■ Reference 1. A. Primavera, R. Roberts and R. Subrahmanyan, “Medical Electronics Pose Unique Challenges,” Global SMT and Packaging, July 2007. circuitsassembly.com Circuits Assembly NOVEMBER 2007 47 http://www.seho.de http://circuitsassembly.com http://www.seho.de
Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2007 Circuits Assembly - November 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Pb-Free Manufacturing from a Tier III EMS Perspective ‘Living Documents, Subject to Change’ Creating Ideal Solder Joints An Alternative Drying Process for MSDs ‘Customer Satisfaction is More than a Score’ Optoelectronic Substrates: Will They Happen? Tech Tips Wave Soldering Process Doctor Test and Inspection Getting Lean Materials World Equipment Advances Product Spotlight Assembly Insider Technical Abstracts Ad Index Circuits Assembly - November 2007 Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page Cover1) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page Cover2) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page 1) Circuits Assembly - November 2007 - Circuits Assembly - November 2007 (Page 2) Circuits Assembly - November 2007 - Contents (Page 3) Circuits Assembly - November 2007 - Contents (Page 4) Circuits Assembly - November 2007 - Contents (Page 5) Circuits Assembly - November 2007 - Caveat Lector (Page 6) Circuits Assembly - November 2007 - Caveat Lector (Page 7) Circuits Assembly - November 2007 - Industry News (Page 8) Circuits Assembly - November 2007 - Industry News (Page 9) Circuits Assembly - November 2007 - Industry News (Page 10) Circuits Assembly - November 2007 - Industry News (Page 11) Circuits Assembly - November 2007 - Industry News (Page 12) Circuits Assembly - November 2007 - Industry News (Page 13) Circuits Assembly - November 2007 - Market Watch (Page 14) Circuits Assembly - November 2007 - Market Watch (Page 15) Circuits Assembly - November 2007 - Market Watch (Page 16) Circuits Assembly - November 2007 - Market Watch (Page 17) Circuits Assembly - November 2007 - Talking Heads (Page 18) Circuits Assembly - November 2007 - Talking Heads (Page 19) Circuits Assembly - November 2007 - Focus on Business (Page 20) Circuits Assembly - November 2007 - Focus on Business (Page 21) Circuits Assembly - November 2007 - Focus on Business (Page 22) Circuits Assembly - November 2007 - Focus on Business (Page 23) Circuits Assembly - November 2007 - Global Sourcing (Page 24) Circuits Assembly - November 2007 - Global Sourcing (Page Insert1) Circuits Assembly - November 2007 - Global Sourcing (Page Insert2) Circuits Assembly - November 2007 - On the Forefront (Page 25) Circuits Assembly - November 2007 - On the Forefront (Page 26) Circuits Assembly - November 2007 - On the Forefront (Page 27) Circuits Assembly - November 2007 - Screen Printing (Page 28) Circuits Assembly - November 2007 - Screen Printing (Page 29) Circuits Assembly - November 2007 - Better Manufacturing (Page 30) Circuits Assembly - November 2007 - Better Manufacturing (Page 31) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 32) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 33) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 34) Circuits Assembly - November 2007 - Pb-Free Manufacturing from a Tier III EMS Perspective (Page 35) Circuits Assembly - November 2007 - ‘Living Documents, Subject to Change’ (Page 36) Circuits Assembly - November 2007 - ‘Living Documents, Subject to Change’ (Page 37) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 38) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 39) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 40) Circuits Assembly - November 2007 - Creating Ideal Solder Joints (Page 41) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 42) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 43) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 44) Circuits Assembly - November 2007 - An Alternative Drying Process for MSDs (Page 45) Circuits Assembly - November 2007 - ‘Customer Satisfaction is More than a Score’ (Page 46) Circuits Assembly - November 2007 - ‘Customer Satisfaction is More than a Score’ (Page 47) Circuits Assembly - November 2007 - Optoelectronic Substrates: Will They Happen? (Page 48) Circuits Assembly - November 2007 - Optoelectronic Substrates: Will They Happen? (Page 49) Circuits Assembly - November 2007 - Tech Tips (Page 50) Circuits Assembly - November 2007 - Tech Tips (Page 51) Circuits Assembly - November 2007 - Wave Soldering (Page 52) Circuits Assembly - November 2007 - Wave Soldering (Page 53) Circuits Assembly - November 2007 - Process Doctor (Page 54) Circuits Assembly - November 2007 - Process Doctor (Page 55) Circuits Assembly - November 2007 - Test and Inspection (Page 56) Circuits Assembly - November 2007 - Getting Lean (Page 57) Circuits Assembly - November 2007 - Getting Lean (Page 58) Circuits Assembly - November 2007 - Materials World (Page 59) Circuits Assembly - November 2007 - Equipment Advances (Page 60) Circuits Assembly - November 2007 - Product Spotlight (Page 61) Circuits Assembly - November 2007 - Assembly Insider (Page 62) Circuits Assembly - November 2007 - Assembly Insider (Page 63) Circuits Assembly - November 2007 - Ad Index (Page 64) Circuits Assembly - November 2007 - Ad Index (Page Cover3) Circuits Assembly - November 2007 - Ad Index (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.