Circuits Assembly - December 2007 - (Page 10) NEWS People VJ Electronix’s worldwide sales manager Doug Robinson relocated to Suzhou, China, where he will manage rework and inspection equipment sales and services. Winland Electronics CEO Lorin Krueger has resigned, effective Jan. 2, after 31 years with the EMS company. He will aid the company in identifying a successor. Blakell Europlacer named Andy Jones UK general sales manager. He has extensive experience in SMT capital equipment sales through senior roles with Quad, Europlacer and Mydata. The IPC Solder Products Value Council named Karl Seelig chairman. He is vice president of technology of AIM Inc., and holds numerous patents in soldering technology, including four Pb-free solder alloys. He supersedes Kester president Roger Savage, who completed a two-year term. Valor Computerized Systems named Meir Zelzer vice president of R&D. He was previously a senior development vice president at SAP, VP R&D at TopTier and IT director at TesCom. He has a bachelor’s in mathematics and computer science. Henkel Corp. promoted Renzhe Zhao, Ph.D. to technical manager of applications engineering in the company’s technical center in California. He has been employed by Henkel for five years, and is also a CIRCUITS ASSEMBLY columnist. iNEMI named Haley Fu, Ph.D. manager of operationsChina, at its new office in Pudong. Fu will coordinate the consortium’s activities in the region. She has several years’ experience in electronics with Schneider Electric Investment Co., Motorola and UTStarcom Telecom. DfR Solutions named Klaus Hagen to its technical sales team in Germany, Austria and Switzerland. Industry US Trade Rep Calls for Anti-Counterfeiting Pact SAN JOSE – U.S. Trade Rep. Susan C. Schwab in October announced the U.S. would join Canada, the European Commission, Japan, Mexico, New Zealand and Switzerland in seeking negotiations on an Anti-Counterfeiting Trade Agreement. The Semiconductor Industry Association (sia-online.org) applauded the announcement. SIA has seen an increase in cases of counterfeit semiconductors in recent years, with the most common problem being re-marked products. “Given the ubiquity of semiconductors in computers, telecommunications equipment, consumer electronics, automobiles, and medical equipment, reliability problems caused by counterfeit semiconductors can cause economic losses and safety effects far exceeding the value of the semiconductor itself,” said SIA president George Scalise. The SIA recently formed an Anti-Counterfeiting Task Force that works to combat counterfeiting; the group develops standards with SEMI (semichips.org) to facilitate the use of encrypted “license plates” on containers that can be authenticated by third parties. In May, the World Semiconductor Council issued a statement calling “for all governments/authorities to implement effective enforcement measures for protection of IP rights within their jurisdictions.” – Chelsey Drysdale iNEMI Publishes Pb-Free Tome HERNDON, VA – The International Electronics Manufacturing Initiative (inemi.org) announced publication of Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. The book, published by Wiley-IEEE Press, is based on results of iNEMI’s six years of study into lead-free electronics, and covers implementation issues of Pb-free solder into board assembly, iNEMI says. “The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. "Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.” The book features chapters by industry experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, and tin whisker mitigation strategies. The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at www. wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html. – Chelsey Drysdale Cookson to Open Larger India R&D Center BANGALORE – Cookson Electronics (cooksonelectronics.com) in October opened a state-of-the-art research center in Bangalore. The 32,000 sq. ft. facility will aid semiconductor and alternative energy research, and help boost Asian sales, which currently make up 60% of the company's assembly materials business. The center will focus on semiconductor manufacturing, packaging materials, and renewable energy, including solar technologies, said Dr. Bawa Singh, vice president of technology and chief technology officer. "We are building a strong foundation in nano-technology-based materials that will allow customers to achieve paradigm shifts in their product performance.” The company's original center is on the Indian Institute of Science (iisc.ernet.in) campus in Bangalore. The company has outgrown that site. “Several years ago our company made a strategic decision to establish an R&D center in Bangalore and develop a close relationship with the Indian Institute of Science," said president and chief executive Steve Corbett in a statement. The new center is "extremely important to our continued growth in Asia." – Mike Buetow Cookson’s new R&D Taj. circuitsassembly.com 10 Circuits Assembly DECEMBER 2007 http://www.sia-online.org http://semichips.org http://www.inemi.org http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html http://cooksonelectronics.com http://www.iisc.ernet.in/ http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - December 2007 Circuits Assembly - December 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing Metalization Options for COB Assembly A Test Comparison of SAC and Non-SAC Pb-Free Solders An A-to-Z Guide to X-Ray Inspection BEST: A ‘Funky Chicken’ with an EMS Niche Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Approaches Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - December 2007 Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page Cover1) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page Cover2) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page 1) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page 2) Circuits Assembly - December 2007 - Contents (Page 3) Circuits Assembly - December 2007 - Caveat Lector (Page 4) Circuits Assembly - December 2007 - Caveat Lector (Page 5) Circuits Assembly - December 2007 - Industry News (Page 6) Circuits Assembly - December 2007 - Industry News (Page 7) Circuits Assembly - December 2007 - Industry News (Page 8) Circuits Assembly - December 2007 - Industry News (Page 9) Circuits Assembly - December 2007 - Industry News (Page 10) Circuits Assembly - December 2007 - Industry News (Page 11) Circuits Assembly - December 2007 - Market Watch (Page 12) Circuits Assembly - December 2007 - Market Watch (Page 13) Circuits Assembly - December 2007 - Market Watch (Page 14) Circuits Assembly - December 2007 - Market Watch (Page 15) Circuits Assembly - December 2007 - Talking Heads (Page 16) Circuits Assembly - December 2007 - Talking Heads (Page 17) Circuits Assembly - December 2007 - Global Sourcing (Page 18) Circuits Assembly - December 2007 - Global Sourcing (Page 19) Circuits Assembly - December 2007 - Screen Printing (Page 20) Circuits Assembly - December 2007 - Better Manufacturing (Page 21) Circuits Assembly - December 2007 - Metalization Options for COB Assembly (Page 22) Circuits Assembly - December 2007 - Metalization Options for COB Assembly (Page 23) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 24) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 25) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 26) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 27) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 28) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 29) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 30) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 31) Circuits Assembly - December 2007 - BEST: A ‘Funky Chicken’ with an EMS Niche (Page 32) Circuits Assembly - December 2007 - BEST: A ‘Funky Chicken’ with an EMS Niche (Page 33) Circuits Assembly - December 2007 - Tech Tips (Page 34) Circuits Assembly - December 2007 - Tech Tips (Page 35) Circuits Assembly - December 2007 - Wave Soldering (Page 36) Circuits Assembly - December 2007 - Process Doctor (Page 37) Circuits Assembly - December 2007 - Pb-Free Lessons Learned (Page 38) Circuits Assembly - December 2007 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - December 2007 - Getting Lean (Page 40) Circuits Assembly - December 2007 - Getting Lean (Page 41) Circuits Assembly - December 2007 - Eastern Approaches (Page 42) Circuits Assembly - December 2007 - Eastern Approaches (Page 43) Circuits Assembly - December 2007 - Eastern Approaches (Page 44) Circuits Assembly - December 2007 - Product Spotlight (Page 45) Circuits Assembly - December 2007 - Ad Index (Page 46) Circuits Assembly - December 2007 - Assembly Insider (Page 47) Circuits Assembly - December 2007 - Technical Abstracts (Page 48) Circuits Assembly - December 2007 - Technical Abstracts (Page Cover3) Circuits Assembly - December 2007 - Technical Abstracts (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.