Circuits Assembly - December 2007 - (Page 31) Cover Story device for oblique views, the sample need not be moved away from the x-ray tube to prevent collisions, as would be required in the traditional method. Therefore, there will be no loss in available geometric magnification when an oblique view is needed, unlike with traditional methods (Figure Figure 4. Tilting sample to achieve oblique viewing 4). Figure 3. Total or system magnification of x-ray versus moving detector. Enhanced grayscale sensitivinspection system. ity of the image-capture device is required so that in smaller and less dense objects, the x-ray system same time. Ideally, oblique angle views should be available without has better capacity to visually separate and very small density difany loss of available geometric magnification. If oblique angle views ferences in the samples. This permits detection of more subtle are not available, then the bulk of the feature or a device or compovariations and faults. The images use this enhanced sensitivity to nent on the second side of a board may obscure the object under highlight faults within the samples. investigation. Consequently, as devices continue to shrink, any lack ■ of magnification will again compromise the analytical value. Oblique viewing capability can be achieved by moving the Ed.: Part two will be published in January. system image-capture device, in some way, into an oblique angle relative to the plane of the x-ray tube and sample. This replaces the Dr. David Bernard is product manager x-ray systems at Dage Precitraditional method of tilting the sample relative to the plane of the sion Industries (dage-group.com); d.bernard@dage-group.com. x-ray tube and image capture device. By moving the image-capture In Stock and ready to ship! ONLY $34.95 plus shipping & handling Order your copy of the fourth edition of Printed Circuit Board Basics: An Introduction to the PCB Industry today! Now there’s an easy-to-read handbook that explains the process and business of printed circuit board manufacturing in simple terms anyone can understand! A must-read for those who are new to the industry and a valuable resource for those who work in the industry, Printed Circuit Board Basics: An Introduction to the PCB Industry is the perfect book to help your customers and employees understand the services your company provides to the PCB industry. Authored by Dan Beaulieu, a 30-year industry veteran and a founding partner of D.B. Management Group, and edited by Mike Buetow, editor-in-chief of Printed Circuit Design & Manufacture magazine, the fourth edition contains: • An updated primer on single-sided, double-sided and multilayer PCB manufacturing processes; • A review of new technologies such as embedded components and microvias (HDI); • Updated PCB specifications; • A history of the industry; • Detailed, updated graphics—including over 45 color photos and illustrations; • An updated glossary of terms and definitions (twice the size of the glossary in previous editions); • And much more! Visit www.pcdandf.com/cms/basics to order your copy of Printed Circuit Board Basics today for only $34.95 plus shipping and handling! P.S. Is your company looking for the perfect customer premium or orientation tool? PCB Basics can be customized with your logo, products, services and more. Contact Frances Stewart (fstewart@upmediagroup.com) at 678-817-1286 for details and a quote. circuitsassembly.com Circuits Assembly DECEMBER 2007 31 http://www.dage-group.com http://www.pcdandf.com/cms/basics http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - December 2007 Circuits Assembly - December 2007 Contents Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing Metalization Options for COB Assembly A Test Comparison of SAC and Non-SAC Pb-Free Solders An A-to-Z Guide to X-Ray Inspection BEST: A ‘Funky Chicken’ with an EMS Niche Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Approaches Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - December 2007 Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page Cover1) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page Cover2) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page 1) Circuits Assembly - December 2007 - Circuits Assembly - December 2007 (Page 2) Circuits Assembly - December 2007 - Contents (Page 3) Circuits Assembly - December 2007 - Caveat Lector (Page 4) Circuits Assembly - December 2007 - Caveat Lector (Page 5) Circuits Assembly - December 2007 - Industry News (Page 6) Circuits Assembly - December 2007 - Industry News (Page 7) Circuits Assembly - December 2007 - Industry News (Page 8) Circuits Assembly - December 2007 - Industry News (Page 9) Circuits Assembly - December 2007 - Industry News (Page 10) Circuits Assembly - December 2007 - Industry News (Page 11) Circuits Assembly - December 2007 - Market Watch (Page 12) Circuits Assembly - December 2007 - Market Watch (Page 13) Circuits Assembly - December 2007 - Market Watch (Page 14) Circuits Assembly - December 2007 - Market Watch (Page 15) Circuits Assembly - December 2007 - Talking Heads (Page 16) Circuits Assembly - December 2007 - Talking Heads (Page 17) Circuits Assembly - December 2007 - Global Sourcing (Page 18) Circuits Assembly - December 2007 - Global Sourcing (Page 19) Circuits Assembly - December 2007 - Screen Printing (Page 20) Circuits Assembly - December 2007 - Better Manufacturing (Page 21) Circuits Assembly - December 2007 - Metalization Options for COB Assembly (Page 22) Circuits Assembly - December 2007 - Metalization Options for COB Assembly (Page 23) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 24) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 25) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 26) Circuits Assembly - December 2007 - A Test Comparison of SAC and Non-SAC Pb-Free Solders (Page 27) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 28) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 29) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 30) Circuits Assembly - December 2007 - An A-to-Z Guide to X-Ray Inspection (Page 31) Circuits Assembly - December 2007 - BEST: A ‘Funky Chicken’ with an EMS Niche (Page 32) Circuits Assembly - December 2007 - BEST: A ‘Funky Chicken’ with an EMS Niche (Page 33) Circuits Assembly - December 2007 - Tech Tips (Page 34) Circuits Assembly - December 2007 - Tech Tips (Page 35) Circuits Assembly - December 2007 - Wave Soldering (Page 36) Circuits Assembly - December 2007 - Process Doctor (Page 37) Circuits Assembly - December 2007 - Pb-Free Lessons Learned (Page 38) Circuits Assembly - December 2007 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - December 2007 - Getting Lean (Page 40) Circuits Assembly - December 2007 - Getting Lean (Page 41) Circuits Assembly - December 2007 - Eastern Approaches (Page 42) Circuits Assembly - December 2007 - Eastern Approaches (Page 43) Circuits Assembly - December 2007 - Eastern Approaches (Page 44) Circuits Assembly - December 2007 - Product Spotlight (Page 45) Circuits Assembly - December 2007 - Ad Index (Page 46) Circuits Assembly - December 2007 - Assembly Insider (Page 47) Circuits Assembly - December 2007 - Technical Abstracts (Page 48) Circuits Assembly - December 2007 - Technical Abstracts (Page Cover3) Circuits Assembly - December 2007 - Technical Abstracts (Page Cover4)
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