Circuits Assembly - January 2008 - (Page 18) On the Forefront Have We ‘Mortgaged’ Our Future? LEDs and solar energy are among the bright spots, but fiscal uncertainties reign. espite many concerns during the first few months of 2007, the year was a good one. After a slow start, consumer spending on mobile phones, PCs and other products formed a good atmosphere for backend assembly, despite rising energy prices. The 2008 outlook is not as positive, but there are bright spots in many product sectors and regions. While overall economic trends may be in question for some parts of the globe, many electronics segments are poised for strong growth. LEDs, especially high brightness versions, are one bright spot. With less power consumption for lighting, many governments, including those of Australia, Singapore, Malaysia, Taiwan and Shanghai, are encouraging or even mandating a switch to LED lighting. David Lin, president of Lite-On Group, a major Taiwanese LED supplier, recently commented LED would be a darling industry for 20 to 30 years. Solar energy contributes only about a tenth of a percent (0.1%) of the U.S.’s electricity needs, but this is expected to increase. Boosted by higher government subsidies, Germany and Japan use a larger percentage of solar power, and various companies are pushing solar as an alternative energy source. Much of the equipment used in the semiconductor industry is also used to produce solar panels, boosting suppliers’ sales.1 The downside: polysilicon shortages and price inflation (up to 15%). Still, semiconductor equipment suppliers participating in the solar market expect 2008 to be a good year. Advanced package (BGA, CSP, WLP and flip chip) shipments are expected to rise 30% in 2008. Mobile phones remain the major driver for CSPs and WLPs. Flip-chip growth continues in processors, ASICs and other high-performance devices. Driven by both form factor and performance, this year will see more flipchip devices shipping in wireless packages. System-inpackage (SiP), stacked die inside packages and stacked packages continue to see strong growth. Emerging areas such as embedded components and through silicon via are also hot topics. Geographic hot spots. Europe’s economic growth was strong in 2007 and Productronica was busy (42,000 attendees) in November, an indicator of the economic strength both of the continent and many material and equipment suppliers. The mood was positive, as it was at the December SEMICon Japan show (110,000 attendees). Manufacturing solar cells received attention at both shows. Recent Indian government incentives for semiconductor manufacturing and assembly are generating D E. Jan Vardaman is president of TechSearch International, Austin, TX; jan@TechSearch Inc.com. Her column appears bimonthly. growth in assembly and test capacity. Some companies also may be turning to India for low-cost, scaleable assembly solutions, in the wake of recent product recalls of Chinese-made goods. Demand for semiconductor packaging assembly and materials manufacturing in India is driven by the desire for export revenue and growing consumer demand from the Indian middle class, numbering more than 300 million. TV and appliance production is increasing. Telecommunications is a big growth area in India, with major cellphone makers such as Nokia supplying the domestic market. Major EMS providers, including Flextronics, Jabil, Celestica and Foxconn, have located plants in India; some are expanding. At least 22 Japanese companies, including Suzuki, Honda, Sony, Matsushita and Mitsubishi, have announced plans to invest in India, and special areas have been established for these companies. Semiconductor manufacturing and assembly in India is predominantly for bipolar devices. Companies such as Bharat Electronics (BEL), Continental Device India Ltd. (CDIL), and SPEL Semiconductor are major assemblers for imported and domestic components. With word of Intel’s pending assembly facility in Vietnam, interest in establishing manufacturing facilities there has risen. As many as six PCB operations are in Vietnam, while at least one major probe card supplier, SVProbe, has a large operation there. Many companies are announcing new investment or expansion. Hon Hai, the world’s largest EMS company, is quintupling its planned investment in Vietnam to $5 billion, reflecting the Southeast Asian country’s growing appeal to high-tech manufacturers.2 Under targets set by the Vietnamese Ministry of Industry and Trade, key exports include textiles, garments, crude oil, footwear and electronics. The country is expected to export $3.6 billion worth of electronics in 2008, 50% more than in 2007.3 Bubbling over? China’s electronics industry continues to grow, but many are concerned about an overheated economy. China’s computer and home electrical appliance sectors recorded impressive first-half growth in corporate profits, according to China’s Ministry of Information Industry. Between January and June, computers gained 114 billion yuan ($15.1 billion) in sales, up 14% year-over-year, and home electrical appliances raked in 249.6 billion yuan, up 12%. Over the six months, China’s 100 leading electronics and IT enterprises sold 12.76 million computers in the domestic market, up 112%, and exports climbed 103%.4 With growth rates exceeding 10% for many years, China’s economy may be overheated. An 11.5% growth circuitsassembly.com 18 Circuits Assembly JANUARY 2008 http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - January 2008 Circuits Assembly - January 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing Walking on Water Flux Selection for Lead-Free Wave Soldering An A-to-Z Guide to X-Ray Inspection, Part II Evolution in Action Research Priorities for the Electronics Industry Selective Soldering Process Doctor Pb-Free Lessons Learned Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - January 2008 Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover2) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 2) Circuits Assembly - January 2008 - Contents (Page 3) Circuits Assembly - January 2008 - Contents (Page 4) Circuits Assembly - January 2008 - Contents (Page 5) Circuits Assembly - January 2008 - Caveat Lector (Page 6) Circuits Assembly - January 2008 - Caveat Lector (Page 7) Circuits Assembly - January 2008 - Industry News (Page 8) Circuits Assembly - January 2008 - Industry News (Page 9) Circuits Assembly - January 2008 - Industry News (Page 10) Circuits Assembly - January 2008 - Industry News (Page 11) Circuits Assembly - January 2008 - Market Watch (Page 12) Circuits Assembly - January 2008 - Market Watch (Page 13) Circuits Assembly - January 2008 - Talking Heads (Page 14) Circuits Assembly - January 2008 - Talking Heads (Page 15) Circuits Assembly - January 2008 - Focus on Business (Page 16) Circuits Assembly - January 2008 - Focus on Business (Page 17) Circuits Assembly - January 2008 - On the Forefront (Page 18) Circuits Assembly - January 2008 - On the Forefront (Page 19) Circuits Assembly - January 2008 - Screen Printing (Page 20) Circuits Assembly - January 2008 - Screen Printing (Page 21) Circuits Assembly - January 2008 - Better Manufacturing (Page 22) Circuits Assembly - January 2008 - Better Manufacturing (Page 23) Circuits Assembly - January 2008 - Walking on Water (Page 24) Circuits Assembly - January 2008 - Walking on Water (Page 25) Circuits Assembly - January 2008 - Walking on Water (Page 26) Circuits Assembly - January 2008 - Walking on Water (Page 27) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 28) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 29) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 30) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 31) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 32) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 33) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 34) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 35) Circuits Assembly - January 2008 - Evolution in Action (Page 36) Circuits Assembly - January 2008 - Evolution in Action (Page 37) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 38) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 39) Circuits Assembly - January 2008 - Selective Soldering (Page 40) Circuits Assembly - January 2008 - Process Doctor (Page 41) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - January 2008 - Materials World (Page 44) Circuits Assembly - January 2008 - Product Spotlight (Page 45) Circuits Assembly - January 2008 - Ad Index (Page 46) Circuits Assembly - January 2008 - Assembly Insider (Page 47) Circuits Assembly - January 2008 - Technical Abstracts (Page 48) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover4)
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